D. Baldwin

发表

Flip chip self-alignment mechanism and modeling

Ruijun Chen, B. Fennell, D. Baldwin, 2000, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507).

Numerical and experimental study of the evolution of stresses in flip chip assemblies during assembly and thermal cycling

D. Baldwin, C. Hanna, S. Michaelides, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

Adhesion mechanisms of nanoparticle silver to substrate materials: identification

D. Baldwin, Sungchul Joo, 2010, Nanotechnology.

Effect of the pressure drop rate on cell nucleation in continuous processing of microcellular polymers

Chul B. Park, Daniel F. Baldwin, Nam P. Suh, 1995 .

High density, high aspect ratio through-wafer electrical interconnect vias for MEMS packaging

Daniel F. Baldwin, Seong Joon Ok, D. Baldwin, 2003 .

Correlation of flip chip underfill process parameters and material properties with in-process stress generation

Daniel F. Baldwin, Ching-Ping Wong, P. Palaniappan, 1998, ECTC 1998.

Novel approach to fabricate porous sponges of poly(D,L-lactic-co-glycolic acid) without the use of organic solvents.

R Langer, D J Mooney, N. Suh, 1996, Biomaterials.

Thermal dissipation analysis in flip chip on board and chip on board assemblies

J. T. Beerensson, D. Baldwin, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Characterization of in-process substrate warpage of underfilled flip chip assembly

I. C. Ume, D. Baldwin, Jian Zhang, 2003, IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003..

In-process stress characterization of flip chip assembly on warped organic substrate

I. C. Ume, D. Baldwin, Jian Zhang, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Correlation of flip chip underfill process parameters and material properties with in-process stress generation

P. J. Selman, C. Wong, D. Baldwin, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Modelling reliability of flip chip on board assemblies implementing a correction function approach comparing analytical and finite element techniques

D. Baldwin, J. Muncy, 2004, IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585).

Predictive failure model of flip chip on board component level assemblies

D. Baldwin, J. Muncy, T. Lazarakis, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

High Yield, Near Void-Free Assembly Process of a Flip Chip in Package Using No-Flow Underfill

D. Baldwin, Sangil Lee, 2010 .

A numerical study of void nucleation and growth in a flip chip assembly process

Haomin Zhou, D. Baldwin, Sangil Lee, 2010 .

Manufacturability of Underfill Processing for Low Cost Flip Chip

D. Baldwin, N. W. Pascarella, 1997, Structural Analysis in Microelectronics and Fiber Optics.

Integrated hardware and software for improved flatness measurement: ATC4.1 flip chip assembly case studies

R. E. Powell, I. C. Ume, D. Baldwin, 2003, Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003..

Evaluation of reworkable underfills for area array packaging encapsulation

D. Baldwin, C. Wong, Haiying Li, 2001, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).

HIGH-THROUGHPUT, LOW-COST FLIP CHIP-ON-BOARD ASSEMBLY

L. P. Mcgovern, D. F. Baldwin, D. Baldwin, 1998 .

Characterization of the floating phenomena for flip chip processing with no flow underfills

D. Baldwin, Chunho Kim, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

No-flow underfill process modeling and analysis for low cost, high throughput flip chip assembly

D. Baldwin, Chunho Kim, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

No-flow underfill process optimization for high yield and reliability in flip chip assembly

D. Baldwin, Chunho Kim, T. Lazarakis, 2002, 2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617).

Compression flow modeling of underfill encapsulants for low cost flip-chip assembly

D. Baldwin, N. W. Pascarella, 1998, IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C.

Low-cost large area processing using small area substrates-a novel multitiled palletization concept for MCM-D thin film process

R. Tummala, D. Baldwin, J. Qu, 2000 .

Reliability of a rapid package prototyping technology based on a data driven chip first approach

D. Baldwin, Sungchul Joo, 2006, 56th Electronic Components and Technology Conference 2006.

Demonstration for rapid prototyping of micro-systems packaging by data-driven chip-first process using nano-particles metal colloids

D. Baldwin, Sungchul Joo, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Prediction of solder interconnects wetting and experimental evaluation

D. Baldwin, S. Kang, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Development of solder interconnects wetting model

D. Baldwin, S. Kang, 2002, 2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617).

Sensitivity analysis of Pb free reflow profile parameters toward flip chip on silicon assembly yield, reliability and intermetallic compound characteristics

D. Baldwin, T. Tessier, Zhaozhi Li, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Effect of Nano-Particles on Heterogeneous Void Nucleation in No-Flow Underfill Materials

D. Baldwin, S. Lee, M. Yim, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Gallium alloy interconnects for flip-chip assembly applications

D. Baldwin, R. Deshmukh, C. S. Hau, 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

The use of diffraction techniques for the study of in‐plane distortions of x‐ray masks

D. Baldwin, R. Ruby, M. Karnezos, 1987 .

Analysis of Solder Paste Release in Fine Pitch Stencil Printing Processes

D. Baldwin, G. Rodriguez, 1999 .

A microcellular processing study of poly(ethylene terephthalate) in the amorphous and semicrystalline states. Part I: Microcell nucleation

Chul B. Park, N. Suh, D. Baldwin, 1996 .

A microcellular processing study of poly(ethylene terephthalate) in the amorphous and semicrystalline states. Part II: Cell growth and process design

Chul B. Park, N. Suh, D. Baldwin, 1996 .

Analysis of Adhesion and Fracture Energy of Nano-Particle Silver in Electronics Packaging Applications

D. Baldwin, Sungchul Joo, 2010, IEEE Transactions on Advanced Packaging.

Interfacial adhesion of nano-particle silver interconnects for electronics packaging application

D. Baldwin, Sungchul Joo, 2008, 2008 58th Electronic Components and Technology Conference.

Flip chip interconnect systems using copper wire stud bump and lead free solder

D. Baldwin, S. Zama, T. Hikami, 2001 .

The viscoelastic behavior of microcellular plastics with varying cell size

N. Suh, D. Baldwin, M. Shimbo, 1995 .

Microcellular sheet extrusion system process design models for shaping and cell growth control

Chul B. Park, N. Suh, D. Baldwin, 1998 .

An extrusion system for the processing of microcellular polymer sheets: Shaping and cell growth control

Chul B. Park, Daniel F. Baldwin, Nam P. Suh, 1996 .

The Role of Gas Dissolution and Induced Crystallization During Microcellular Polymer Processing: A Study of Poly (Ethylene Terephthalate) and Carbon Dioxide Systems

Daniel F. Baldwin, Nam P. Suh, N. Suh, 1995 .

Axiomatic design of a microcellular filament extrusion system

Chul B. Park, Daniel F. Baldwin, Nam P. Suh, 1996 .

Microcellular polymer processing and the design of a continuous sheet processing system

Daniel Flanagan Baldwin, D. Baldwin, 1994 .

Heterogeneous Void Nucleation Study in Flip Chip Assembly Process Using No-Flow Underfill

Daniel F. Baldwin, Sangil Lee, D. Baldwin, 2014 .

Near Void-Free Assembly Development of Flip Chip Using No-Flow Underfill

C. Wong, D. Baldwin, M. Yim, 2009, IEEE Transactions on Electronics Packaging Manufacturing.

Compression flow modeling of underfill encapsulants for low cost flip chip assembly

Daniel F. Baldwin, Nathan W. Pascarella, D. Baldwin, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Component level reliability on different dimensions of lead free wafer level chip scale packages subjected to extreme temperatures

D. Baldwin, J. Evans, Jiawei Zhang, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid

B. Fennell, D. Baldwin, Sangil Lee, 2010 .

Integrated hardware and software for improved flatness measurement with ATC4.1 flip-chip assembly case study

Jian Zhang, I. Charles Ume, Daniel F. Baldwin, 2005, IEEE Transactions on Instrumentation and Measurement.

Warpage of conductive gallium alloy via-filled stainless steel substrates for large area microelectronic packaging

I. C. Ume, D. Baldwin, S. Bhattacharya, 2000 .

Experimental evaluation of wetting dynamics models for Sn63Pb37 and SnAg4.0Cu0.5 solder materials

D. Baldwin, Chunho Kim, S. Kang, 2008 .

Characterization of a no-flow underfill encapsulant during the solder reflow process

C. Wong, B. Fennell, D. Baldwin, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

A process and reliability analysis of no flow underfill materials for high throughput flip chip processing

D. Baldwin, R. Thorpe, B.A. Smith, 2000, Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146).

A reliability and failure mode analysis of no flow underfill materials for low cost flip chip assembly

D. F. Baldwin, D. Baldwin, R. Thorpe, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

An integrated computer aid for generating and evaluating assembly sequences for mechanical products

Thomas L. DeFazio, Daniel F. Baldwin, Thomas E. Abell, 1991, IEEE Trans. Robotics Autom..

Computer aids for finding, representing, choosing amongst, and evaluating the assembly sequences of mechanical products

Daniel E. Whitney, Daniel F. Baldwin, Man-Cheung Max Lui, 1991 .

Solder wetting in a wafer-level flip chip assembly

D. Baldwin, Jicun Lu, S. Busch, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Comprehensive Study of Lead-Free Reflow Process for a 3-D Flip Chip on Silicon Package

D. Baldwin, J. Evans, Zhaozhi Li, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

A theoretical yield model for assembly process of area array solder interconnect packages with experimental verification

D. Baldwin, Chunho Kim, D.F. Baldwin, 2005, IEEE Transactions on Electronics Packaging Manufacturing.

Flux-underfill compatibility and failure mode analysis in high yield flip chip processing

D. Baldwin, P. Houston, W. Tsai, 2000, Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146).

Deca & Cadence Breakthrough Heterogeneous Integration Barriers with Adaptive Patterning™

D. Baldwin, T. Olson, Craig W. Bishop, 2021, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

Reliability assessment of microvias in HDI printed circuit boards

Rao Tummala, Fuhan Liu, George E. White, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Flux-underfill compatibility and failure mode analysis in high yield flip chip processing

D. F. Baldwin, P. N. Houston, D. Baldwin, 2000, 27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium.

High-speed SMT compatible dispenseless underfill process for CSP BGA flip chip assembly

Jian Zhang, Daniel F. Baldwin, D. Baldwin, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Numerical and experimental investigations of large IC flip chip attach

C. P. Wong, H. Reichl, Jianmin Qu, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Yield analysis and process modeling of low cost, high throughput flip chip assembly based on no-flow underfill materials

L. P. Mcgovern, D. F. Baldwin, D. Baldwin, 2001 .

Void Formation Study of Flip Chip in Package Using No-Flow Underfill

C.P. Wong, S. Lee, C. Wong, 2008, IEEE Transactions on Electronics Packaging Manufacturing.