Yuejin Li

MTL-based modeling and analysis of the effects of TSV noise coupling on the power delivery network in 3D ICs

Yang Wang, Gang Dong, Weijun Zhu, 2020 .

Study of plasma etching of β-SiC thin films grown on Si-substrate

Yintang Yang, Yuejin Li, Changchun Chai, 2003 .

Parasitic effects of air-gap through-silicon vias in high-speed three-dimensional integrated circuits

Yintang Yang, Yuejin Li, Zhangming Zhu, 2016 .

High-Frequency Electrical Model of Through-Silicon Vias for 3-D Integrated Circuits Considering Eddy Current and Proximity Effects

Yintang Yang, Yuejin Li, Zhangming Zhu, 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Electrical Modeling and Analysis of Cu-CNT Heterogeneous Coaxial Through-Silicon Vias

Yintang Yang, Yuejin Li, Zhangming Zhu, 2017, IEEE Transactions on Nanotechnology.

Structure-dependent behavior of stress-induced voiding in Cu interconnects

Yintang Yang, Yuejin Li, Changchun Chai, 2010 .

Electrical Modeling and Analysis of Differential Dielectric-Cavity Through-Silicon via Array

Yintang Yang, Zhangming Zhu, Ruixue Ding, 2017, IEEE Microwave and Wireless Components Letters.

Epitaxial growth and microstructure of cubic SiC films on Si substrates

Yintang Yang, Yuejin Li, Hu-jun Jia, 2003 .

Growth and characterization of Si/SiN/SiC structures by APCVD process

Yuejin Li, Hu-jun Jia, Yin-Tang Yang, 2008, 2008 9th International Conference on Solid-State and Integrated-Circuit Technology.