R. Gordin

发表

Characterization of TSV-Induced Loss and Substrate Noise Coupling in Advanced Three-Dimensional CMOS SOI Technology

X. Gu, J. Silberman, A. Young, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Modeling Methodology for On-Chip Coplanar Transmission Lines over the Lossy Silicon Substrate

Michael Zelikson, David Goren, Rachel Gordin, 2005 .

Study of the compound of properties of percolating and neck-based thermal underfills

Thomas Brunschwiler, Rachel Gordin, Gerd Schlottig, 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Design and Modeling Methodology of Vertical Interconnects for 3DI Applications

Xiaoxiong Gu, Fei Liu, R Gordin, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.