Hyungdong Lee

发表

Analysis of power distribution network in TSV-based 3D-IC

Yongkee Kwon, Taigon Song, Joungho Kim, 2010, 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems.

PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

Taigon Song, Joungho Kim, Jonghyun Cho, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Double-sided electrohydrodynamic jet printing of two-dimensional electrode array in paper-based digital microfluidics

Ali Turab Jafry, Ayodya Pradhipta Tenggara, Hyungdong Lee, 2019, Sensors and Actuators B: Chemical.

Directly printed stretchable strain sensor based on ring and diamond shaped silver nanowire electrodes

Hyungdong Lee, D. Byun, Baekhoon Seong, 2015 .

Slow wave and dielectric quasi-TEM modes of Metal-Insulator-Semiconductor (MIS) structure Through Silicon Via (TSV) in signal propagation and power delivery in 3D chip package

Joungho Kim, Jonghyun Cho, Joohee Kim, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Measurement and Analysis of a High-Speed TSV Channel

Joungho Kim, Jonghyun Cho, Kiyeong Kim, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer

Taigon Song, Joungho Kim, Woojin Lee, 2009, 2009 11th Electronics Packaging Technology Conference.

Direct exfoliation and dispersion of two-dimensional materials in pure water via temperature control

Hyungdong Lee, G. Ryu, D. Byun, 2015, Nature Communications.

Effects of on-chip decoupling capacitors and silicon substrate on power distribution networks in TSV-based 3D-ICs

Joungho Kim, Kiyeong Kim, J. Pak, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Direct Patterning and Spontaneous Self-Assembly of Graphene Oxide via Electrohydrodynamic Jet Printing for Energy Storage and Sensing

Hyungdong Lee, D. Byun, Jaehyun Lee, 2019, Micromachines.

Through-silicon via (TSV) depletion effect

Joungho Kim, Jun So Pak, Jonghyun Cho, 2011, 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems.

Nonlinear effects of TSV and harmonic generation

Joungho Kim, Jun So Pak, Jonghyun Cho, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Characteristics of high-k gate oxide prepared by oxidation of multi-layered Hf/Zr/Hf/Zr/Hf metal films

Hyungdong Lee, M. T. Yu, S. Jeong, 2008 .

Strain behavior of epitaxial Si1 − xCx films on silicon substrates during dry oxidation

Hyungdong Lee, D. Ko, J. Yoo, 2013 .

Modeling and analysis of differential signal Through Silicon Via (TSV) in 3D IC

Joungho Kim, Jun So Pak, Jonghyun Cho, 2010, 2010 IEEE CPMT Symposium Japan.

A hybrid aerodynamic and electrostatic atomization system for enhanced uniformity of thin film

Liwei Lin, Hyungdong Lee, D. Byun, 2017 .

Silver Nanowire Micro-Ring Formation Using Immiscible Emulsion Droplets for Surface-Enhanced Raman Spectroscopy

Hyungdong Lee, D. Byun, Jae‐Hyun Lee, 2020, Applied Sciences.

Electrohydrodynamic Jet-Printed MAPbBr3 Perovskite/Polyacrylonitrile Nanostructures for Water-Stable, Flexible, and Transparent Displays

Hyungdong Lee, D. Byun, Hyung-seok Jang, 2022, ACS Applied Nano Materials.

Self-Assembly of Silver Nanowire Ring Structures Driven by the Compressive Force of a Liquid Droplet.

Liwei Lin, Hyungdong Lee, D. Byun, 2017, Langmuir : the ACS journal of surfaces and colloids.

Transparent arrays of silver nanowire rings driven by evaporation of sessile droplets

Hyungdong Lee, D. Byun, Baekhoon Seong, 2017 .

Infiltrated thin film structure with hydrogel-mediated precursor ink for durable SOFCs

Hyungdong Lee, D. Byun, Mingi Choi, 2021, Scientific reports.

Printing Conductive Micro‐Web Structures via Capillary Transport of Elastomeric Ink for Highly Stretchable Strain Sensors

Hyungdong Lee, D. Byun, Jae‐Hyun Lee, 2018 .

HfO2 gate insulator formed by atomic layer deposition for thin-film-transistors

W. Xianyu, Hyungdong Lee, Kyunghae Kim, 2007 .

Vertical tree 3-dimensional TSV clock distribution network in 3D IC

Junho Lee, Joungho Kim, Joohee Kim, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

I/O power estimation and analysis of high-speed channels in through-silicon via (TSV)-based 3D IC

Junho Lee, Joungho Kim, Jun So Pak, 2010, 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems.

Electrohydrodynamic Jet Printed 3D Metallic Grid: Toward High‐Performance Transparent Electrodes

Hyungdong Lee, D. Byun, Bin Zhang, 2020, Advanced Engineering Materials.

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Junho Lee, Joungho Kim, Heegon Kim, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Ultrafast Growth of Large 2D Silver Nanosheets by Highly Ordered Biological Template at Air/Gel Interface

Liwei Lin, Hyungdong Lee, D. Byun, 2018 .

Hydrogel Film Assembly Process at Droplet Interface with Evaporation Temperature

Hyungdong Lee, D. Byun, H. Ko, 2019, Advanced Materials Interfaces.

Direct alignment and patterning of silver nanowires by electrohydrodynamic jet printing.

Hyungdong Lee, D. Byun, Baekhoon Seong, 2014, Small.

Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

Junho Lee, Joungho Kim, Jun So Pak, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Effects of annealing temperature on the characteristics of ALD-deposited HfO2 in MIM capacitors

W. Xianyu, Hyungdong Lee, Kyunghae Kim, 2006 .

Directly drawn poly(3-hexylthiophene) field-effect transistors by electrohydrodynamic jet printing: improving performance with surface modification.

Hyungdong Lee, D. Byun, Byoung-Sun Lee, 2014, ACS applied materials & interfaces.

Spontaneous self-welding of silver nanowire networks.

Hyungdong Lee, D. Byun, Baekhoon Seong, 2015, Physical chemistry chemical physics : PCCP.

Redox-Active Tyrosine-Mediated Peptide Template for Large-Scale Single-Crystalline Two-Dimensional Silver Nanosheets.

Hyungdong Lee, D. Byun, K. Nam, 2020, ACS nano.

Biomimetic, Flexible, and Self-Healable Printed Silver Electrode by Spontaneous Self-Layering Phenomenon of a Gelatin Scaffold.

Liwei Lin, Hyungdong Lee, D. Byun, 2018, ACS applied materials & interfaces.

Direct Fabrication of Metallic Microgear via Electrohydrodynamic Inkjet 3D Printing

Hyungdong Lee, D. Byun, Bin Zhang, 2020, Advanced Engineering Materials.

Highly selective dry etching of alternating phase-shift mask (PSM) structures for extreme ultraviolet lithography (EUVL) using inductively coupled plasmas (ICP)

N. Lee, Hyungdong Lee, J. Ahn, 2009 .

Characteristics of high-k gate oxides prepared by oxidation of 1.4 nm multi-layered Hf/Al metal film

Hyungdong Lee, Kyunghae Kim, Cheol‐Woong Yang, 2006 .