Gang Yih Chong

Advanced wafer bonding for substrate engineering and 3D IC integration

Gang Yih Chong, 2014 .

AlN-AlN Wafer Bonding and Its Thermal Characteristics

Gang Yih Chong, Eugene A. Fitzgerald, Kwang Hong Lee, 2014 .

Simulation and optimization of a micromachined gyroscope using high-aspect-ratio micromachining fabrication process

Gang Yih Chong, Man Siu Tse, Aiwu Y. Ruan, 2001, SPIE Micro + Nano Materials, Devices, and Applications.

High throughput Cu-Cu bonding by non-thermo-compression method

Chuan Seng Tan, Gang Yih Chong, C. S. Tan, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Defects reduction of Ge epitaxial film in a germanium-on-insulator wafer by annealing in oxygen ambient

Chuan Seng Tan, Gang Yih Chong, Eugene A. Fitzgerald, 2015 .

Fabrication and characterization of germanium-on-insulator through epitaxy, bonding, and layer transfer

Chuan Seng Tan, Gang Yih Chong, Eugene A. Fitzgerald, 2014 .