Jun Fan

发表

Root Cause Analysis Methodology of ESD Soft-Failure Applied to a Robot

Wei Zhang, Jun Fan, David Pommerenke, 2018, 2018 IEEE International Conference on Computational Electromagnetics (ICCEM).

Design criteria of automatic fixture removal (AFR) for asymmetric fixture de-embedding

Jun Fan, James L. Drewniak, Jingook Kim, 2014, 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).

An Efficient Approach to Find the Truncation Frequency for Transmission Line-Based Dielectric Material Property Extraction

Jun Fan, Xiaoning Ye, Xinglin Sun, 2018, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI).

Improved “Root-Omega” Method for Transmission-Line-Based Material Property Extraction for Multilayer PCBs

Jun Fan, Shuai Jin, Bichen Chen, 2017, IEEE Transactions on Electromagnetic Compatibility.

On-chip linear voltage regulator module (VRM) effect on power distribution network (PDN) noise and jitter at high-speed output buffer

Jun Fan, Joungho Kim, Changwook Yoon, 2015, 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity.

Including SNIT ferrite beads in DC power bus and high-speed I/O

Jun Fan, James L. Drewniak, Shaofeng Luan, 2001 .

Analytical Transfer Functions Relating Power and Ground Voltage Fluctuations to Jitter at a Single-Ended Full-Swing Buffer

Jun Fan, Chulsoon Hwang, Jingook Kim, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

A slope and amplitude controllable triangular-current generator for the injection of a broad-band PDN noise

Joungho Kim, Jun Fan, Changwook Yoon, 2016, IEEE Electromagnetic Compatibility Magazine.

Measuring IC switching current waveforms using a GMI probe for power integrity studies

Jun Fan, Hiroshi Inoue, Songping Wu, 2010, 2010 Asia-Pacific International Symposium on Electromagnetic Compatibility.

Accuracy of Physics-Based Via Models for Simulation of Dense Via Arrays

Jun Fan, Xiaoxiong Gu, Y. H. Kwark, 2012, IEEE Transactions on Electromagnetic Compatibility.

Recent development of via models: Hybrid circuit and field analysis

Jun Fan, Yaojiang Zhang, 2010, 2010 IEEE Electrical Design of Advanced Package & Systems Symposium.

A Novel Impedance Definition of a Parallel Plate Pair for an Intrinsic Via Circuit Model

Jun Fan, Yaojiang Zhang, Gang Feng, 2010, IEEE Transactions on Microwave Theory and Techniques.

Power integrity with voltage ripple spectrum decomposition for physics-based design

Jun Fan, Tamar Makharashvili, Siqi Bai, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Parametric study on the effect of asymmetry in multi-channel differential signaling

Jun Fan, B. Archambeault, Xiaoxiong Gu, 2011, 2011 IEEE International Symposium on Electromagnetic Compatibility.

Analytical evaluation of scattering parameters for equivalent circuit of through silicon via array

Jun Fan, Antonio Orlandi, Stefano Piersanti, 2015 .

Signal/Power Integrity Analysis for Multilayer Printed Circuit Boards Using Cascaded S-Parameters

Jun Fan, Yaojiang Zhang, F. de Paulis, 2010, IEEE Transactions on Electromagnetic Compatibility.

De-embedding techniques for transmission lines: An application to measurements of on-chip coplanar traces

Jun Fan, Xu Gao, Siming Pan, 2014, 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Modeling and Analysis of On-Chip Power Noise Induced by an On-Chip Linear Voltage Regulator Module With a High-Speed Output Buffer

James L. Drewniak, Changwook Yoon, Heegon Kim, 2020, IEEE Transactions on Electromagnetic Compatibility.

Noncontact Wideband Current Probes With High Sensitivity and Spatial Resolution for Noise Location on PCB

Donglin Su, Wei Liu, Jun Fan, 2018, IEEE Transactions on Instrumentation and Measurement.

A Magnetic-Field Resonant Probe With Enhanced Sensitivity for RF Interference Applications

Jun Fan, D. Pommerenke, Eakhwan Song, 2013, IEEE Transactions on Electromagnetic Compatibility.

A Simple Miniature Ultrawideband Magnetic Field Probe Design for Magnetic Near-Field Measurements

Wei Zhang, Jun Fan, Zhaowen Yan, 2016, IEEE Transactions on Antennas and Propagation.

Investigation of S21 magnitude extraction methodologies by using a pattern generator and sampling oscilloscope

Jun Fan, Ketan Shringarpure, Xinyun Guo, 2015, 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity.

Ground Bridge Effect on Reduction of Conducted Emission from Three-Phase Motor Drive System

Jun Fan, Hongseok Kim, Yuandong Guo, 2019, 2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE.

Load characteristics of wireless power transfer system with different resonant types and resonator numbers

Zhengming Zhao, Kainan Chen, Jun Fan, 2017 .

Detection of open and short faults in 3D-ICs based on through silicon via (TSV)

Joungho Kim, D. Jung, Jun Fan, 2017, 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).

Multiport PDN Optimization With the Newton–Hessian Minimization Method

Jun Fan, B. Ravelo, Jun Wang, 2021, IEEE Transactions on Microwave Theory and Techniques.

Measurement and correlation-based methodology for estimating worst-case skew due to glass weave effect

Jun Fan, A. Koul, Seungyong Baek, 2017, 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).

Studying the effect of drilling uncertainty on signal propagation through vias

Srinath Penugonda, Jun Fan, Ji Chen, 2015, 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity.

Stochastic modeling of a high-speed signal channel by polynomial chaos method

Jun Fan, Ji Chen, Ji Chen, 2014, 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Extraction of the parameters of the coupling capacitance hysteresis cycle for TSV transient modeling

Joungho Kim, Jun Fan, S. Piersanti, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Characterizing EMI radiation physics corresponding to distributive geometry features using the PEEC method

L. J. Jiang, Y. S. Cao, Jun Fan, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Analyzing Multiple Vias in a Parallel-Plate Pair Based on a Nonorthogonal PEEC Method

Jun Fan, Xinglin Sun, Lingyun Ye, 2019, IEEE Transactions on Electromagnetic Compatibility.

A Hybrid Method for Signal Integrity Analysis of Traces and Vias in an Infinitely Large Plate Pair

Jun Fan, Yaojiang Zhang, Peng Shao, 2015, IEEE Transactions on Electromagnetic Compatibility.

Evaluating the Crosstalk Current and the Total Radiated Power of a Bent Cable Harness Using the Generalized MTL Method

Ying S. Cao, Y. S. Cao, Jun Fan, 2020, IEEE Transactions on Electromagnetic Compatibility.

SNR Analysis and Optimization in Near-Field Scanning and EMI Applications

Jun Fan, D. Pommerenke, Shubhankar Marathe, 2018, IEEE Transactions on Electromagnetic Compatibility.

DISCONTINUOUS GALERKIN VSIE METHOD FOR ELECTROMAGNETIC SCATTERING FROM COMPOSITE METALLIC AND DIELECTRIC STRUCTURES

Jun Fan, Runren Zhang, Yanwen Zhao, 2019, Progress In Electromagnetics Research M.

HO-SIE Based Domain Decomposition Method for Solving Multiscale EM Scattering Problems

Jun Fan, Yanwen Zhao, Qiangming Cai, 2019, 2019 Cross Strait Quad-Regional Radio Science and Wireless Technology Conference (CSQRWC).

Identifying Interference From Multiple Noise Sources by Magnetic Near Fields Only

Jun Fan, Xu Gao, Jingnan Pan, 2019, IEEE Transactions on Electromagnetic Compatibility.

De-embedding method to accurately measure high-frequency impedance of an O-shape spring contact

Jun Fan, Jing Li, Joe Zhou, 2014, 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).

A Cross-sectional Profile Based Model for Stripline Conductor Surface Roughness

Jun Fan, J. Drewniak, S. Hinaga, 2020, 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).

Signal-signal D-probe and unified launch pad designs

Jun Fan, J. Drewniak, Bichen Chen, 2018, IEEE Electromagnetic Compatibility Magazine.

A Transfer Function Based Calculation Method for Radio Frequency Interference

Chulsoon Hwang, Qiaolei Huang, Takashi Enomoto, 2019, IEEE Transactions on Electromagnetic Compatibility.

Source Reconstruction in Near-Field Scanning Using Inverse MoM for RFI Application

Jun Fan, D. Pommerenke, D. Beetner, 2020, IEEE Transactions on Electromagnetic Compatibility.

Accurate RFI prediction of 3D non-planar connector with half magnetic dipole pattern

Jun Fan, Chulsoon Hwang, Qiaolei Huang, 2019, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC).

Application of dipole-moment model in EMI estimation

L. Li, Jun Fan, Chulsoon Hwang, 2015, 2015 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Near-field coupling estimation by source reconstruction and Huygens's equivalence principle

L. Li, Jun Fan, Chulsoon Hwang, 2015, 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity.

Modeling Stripline With Slotted Ground Plane in Multilayered Circuit Board Using PEEC Formulation

Jun Fan, Xinglin Sun, Lingyun Ye, 2020, IEEE Transactions on Electromagnetic Compatibility.

Evaluating Field Interactions Between Multiple Wires and the Nearby Surface Enabled by a Generalized MTL Approach

Jun Fan, Sandeep Chandra, Yansheng Wang, 2018, IEEE Transactions on Electromagnetic Compatibility.

Applying the Multiple Scattering (MS) Method to Evaluate the Current Response on a Cable Harness Due to an Incident Plane Wave

Y. S. Cao, Jun Fan, Dazhao Liu, 2018, 2018 IEEE International Conference on Computational Electromagnetics (ICCEM).

EMI Modeling for Antenna-Chassis System Using Characteristic Mode Analysis

Y. S. Cao, Jun Fan, Yansheng Wang, 2018, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI).

A survey on modeling strategies for high-speed differential Via between two parallel plates

Jun Fan, Jun Xu, Ying Zhang, 2017, 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).

DC ground compact wideband omnidirectional vertically polarised slot loop antenna for 4G long-term evolution applications

Jun Fan, Y. Qi, Wei Yu, 2018 .

Causality Analyzing for Transmission Line with Surface Roughness

Jun Fan, J. Drewniak, Xinglin Sun, 2019, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI).

Systematic Power Integrity Analysis Based on Inductance Decomposition in a Multi-Layered PCB PDN

Jun Fan, J. Drewniak, B. Achkir, 2020, IEEE Electromagnetic Compatibility Magazine.

Photonic Crystal Power Substrate for Wideband Suppression of Power / Ground Bounce Noise and Radiated Emission in High-speed Packages

Jun Fan, J. Drewniak, S. Connor, 2006 .

Capacitance Calculation for Via Structures Using an Integral Equation Method Based on Partial Capacitance

Jun Fan, Jingook Kim, Hanfeng Wang, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

An Equivalent Circuit Model to Analyze Passive Intermodulation of Loose Contact Coaxial Connectors

Jun Fan, He Wen, Y. Qi, 2018, IEEE Transactions on Electromagnetic Compatibility.