Chun-Pin Lin

CIC signal processing embedded system a modulizable platform for multi-domain signal processing

Chien-Ming Wu, Chun-Ming Huang, Chih-Ting Kuo, 2012, 2012 Annual International Conference of the IEEE Engineering in Medicine and Biology Society.

A 975-mW Fully Integrated Genetic Variant Discovery System-on-Chip in 28 nm for Next-Generation Sequencing

Jia-Rong Chang, Chun-Pin Lin, Chao-Hsi Lee, 2021, IEEE Journal of Solid-State Circuits.

A nano-sensor platform utilizes tablet computer for biomedical signal processing

Chien-Ming Wu, Chun-Ming Huang, Chih-Ting Kuo, 2011, 2011 IEEE International Conference on Consumer Electronics -Berlin (ICCE-Berlin).

An implantable 128-channel wireless neural-sensing microsystem using TSV-embedded dissolvable μ-needle array and flexible interposer

Shang-Lin Wu, Ching-Te Chuang, Wei Hwang, 2017, 2017 IEEE International Symposium on Circuits and Systems (ISCAS).

The design and implementation of DCT/IDCT chip with novel architecture

Kuo-Hsing Cheng, Chun-Pin Lin, Chih-Sheng Huang, 2000, 2000 IEEE International Symposium on Circuits and Systems. Emerging Technologies for the 21st Century. Proceedings (IEEE Cat No.00CH36353).

A Novel Flexible 3-D Heterogeneous Integration Scheme Using Electroless Plating on Chips With Advanced Technology Node

Ming-Hwa Sheu, Yu-Chen Hu, Yao-Jen Chang, 2015, IEEE Transactions on Electron Devices.

A novel design methodology for hybrid process 3D-IC

Chien-Ming Wu, Chun-Ming Huang, Chien-Lin Huang, 2012, Proceedings of Technical Program of 2012 VLSI Design, Automation and Test.

Development of a Novel Micro-motion Dental Implant System

Chun-Pin Lin, Hung-Cheng Chang, Weng-Pin Chen, 2015 .

Morpack Cube: A portable 3D heterogeneous system integration platform

Chien-Ming Wu, Chun-Ming Huang, Chih-Chyau Yang, 2013, 2013 IEEE International SOC Conference.

21.1 A Fully Integrated Genetic Variant Discovery SoC for Next-Generation Sequencing

Jia-Rong Chang, Chun-Pin Lin, Chao-Hsi Lee, 2020, 2020 IEEE International Solid- State Circuits Conference - (ISSCC).

Universal CMOS Diamond-Graph Circuit for Embedded Computing

Wei-Chang Tsai, Chun-Pin Lin, Shun-Wen Cheng, 2018, 2018 31st IEEE International System-on-Chip Conference (SOCC).

A 1.625 TOPS/W SOC for Deep CNN Training and Inference in 28nm CMOS

Tzi-Dar Chiueh, Chun-Pin Lin, Chi-Shi Chen, 2021, ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC).

A 1.625 TOPS/W SOC for Deep CNN Training and Inference in 28nm CMOS

Tzi-Dar Chiueh, Chun-Pin Lin, Hsiu-Wen Wang, 2021, ESSCIRC 2021 - IEEE 47th European Solid State Circuits Conference (ESSCIRC).

3D heterogeneous integration structure based on 40 nm- and 0.18 µm-technology nodes

Yu-Sheng Hsieh, Ming-Hwa Sheu, Chun-Pin Lin, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).