T. Ohba
发表
M. Nakao,
Kensuke Tsuchiya,
T. Sadamitsu,
2008
.
Kuan-Neng Chen,
T. Ohba,
Hiroyuki Ito,
2021,
IEEE Transactions on Electron Devices.
T. Ohba,
H. Kitada,
N. Maeda,
2010
.
Young Suk Kim,
Takayuki Ohba,
Hideki Kitada,
2013
.
T. Ohba,
T. Nakamura,
Y. Mizushima,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
T. Ohba,
Youngsu Kim,
Tomoji Nakamura,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
T. Ohba,
S. Kodama,
Y. S. Kim,
2019,
2019 International Conference on Electronics Packaging (ICEP).
T. Ohba,
S. Kodama,
N. Araki,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
T. Ohba,
S. Kodama,
Y. S. Kim,
2018,
2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
H. Kitada,
T. Ohba,
K. Arai,
2009,
2009 IEEE International Electron Devices Meeting (IEDM).
H. Kitada,
T. Ohba,
T. Eshita,
2010,
2010 Symposium on VLSI Technology.
H. Kitada,
T. Ohba,
K. Arai,
2014,
2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers.
T. Ohba,
K. Arai,
T. Nakamura,
2015,
2015 IEEE International Electron Devices Meeting (IEDM).
T. Ohba,
2011,
11th International Workshop on Junction Technology (IWJT).
T. Ohba,
Y. Shimogaki,
T. Ohta,
2005
.
Kuan-Neng Chen,
T. Ohba,
Hiroyuki Ito,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Kuan-Neng Chen,
T. Ohba,
Hiroyuki Ito,
2019,
2019 International Conference on Electronics Packaging (ICEP).
T. Ohba,
Y. Okamoto,
Y. Mita,
2020,
Journal of Microelectromechanical Systems.
T. Ohba,
Y. Okamoto,
Y. Mita,
2018,
IEEE Electron Device Letters.
T. Ohba,
Taek‐Soo Kim,
Young Suk Kim,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Takayuki Ohba,
T. Ohba,
2012
.
T. Ohba,
T. Ohba,
N. Misawa,
1994
.
T. Ohba,
Y. Shimogaki,
T. Ohta,
2005
.
T. Ohba,
K. Atsumi,
Tomoji Nakamura,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
T. Ohba,
N. Taoka,
Y. Mizushima,
2014
.
T. Ohba,
1995
.
Hiroshi Hashimoto,
Tadao Nakamura,
Takayuki Ohba,
2013,
2013 IEEE International 3D Systems Integration Conference (3DIC).
Takayuki Ohba,
Nagayasu Oshima,
Ryoichi Suzuki,
2014
.
Tetsuya Osaka,
Madhav Datta,
Yosi Shacham-Diamand,
2009
.
Young Suk Kim,
Takayuki Ohba,
Akira Uedono,
2017
.
Takayuki Ohba,
Hideki Hashimoto,
Akira Uedono,
2014
.
Takayuki Ohba,
S. W. Kim,
Hideki Kitada,
2012
.
Koji Fujimoto,
Takayuki Ohba,
Young-Suk Kim,
2015,
IEICE Electron. Express.
T. Ohba,
1995
.
T. Ohba,
S. Inoue,
M. Maeda,
1987,
International Electron Devices Meeting.
T. Ohba,
Y. Furumura,
1991
.
Young Suk Kim,
Takayuki Ohba,
Shigeaki Zaima,
2011
.
T. Ohba,
Y. Shimogaki,
T. Ohta,
2006
.
Miniaturized 3D Functional Interposer Using Bumpless Chip-on-Wafer (COW) Integration with Capacitors
T. Ohba,
T. Funaki,
Youngsu Kim,
2021,
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
T. Ohba,
Y. Mizushima,
H. Kitada,
2013
.
T. Ohba,
Taek‐Soo Kim,
Young Suk Kim,
2018,
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
T. Ohba,
Y. Shimogaki,
T. Ohta,
2006
.
Koji Sakui,
Norio Chujo,
Hiroyuki Ryoson,
2020,
IEEE Transactions on Electron Devices.
Koji Sakui,
Takayuki Ohba,
T. Ohba,
2019,
2019 International 3D Systems Integration Conference (3DIC).
Koji Sakui,
Takayuki Ohba,
T. Ohba,
2019,
2019 IEEE 11th International Memory Workshop (IMW).
Koji Sakui,
Takayuki Ohba,
T. Ohba,
2019,
2019 IEEE Custom Integrated Circuits Conference (CICC).
T. Ohba,
K. Sakui,
H. Ryoson,
2023,
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC).
T. Ohba,
K. Sakui,
Youngsu Kim,
2021,
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Takayuki Ohba,
Shinji Sugatani,
Norio Chujo,
2020,
2020 IEEE Symposium on VLSI Technology.
T. Ohba,
T. Fukuda,
N. Araki,
2022,
Impact.
T. Ohba,
T. Ohba,
Y. Mizushima,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
P. Tzeng,
T. Ohba,
T. Ku,
2016,
2016 International Conference on Electronics Packaging (ICEP).
T. Ohba,
S. Hidaka,
S. Abe,
2022,
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).
T. Ohba,
K. Sakui,
Young-Suk Kim,
2021,
IEEE International Reliability Physics Symposium.
T. Ohba,
I. Kinefuchi,
J. Nakatsuka,
2011,
2011 Symposium on VLSI Technology - Digest of Technical Papers.
T. Ohba,
S. Hasegawa,
S. Yoshimoto,
2009
.
T. Ohba,
S. Hasegawa,
S. Yoshimoto,
2012
.
T. Ohba,
T. Hirahara,
Y. Kitaoka,
2022
.
Tadao Nakamura,
K. Suzuki,
Takayuki Ohba,
2012,
2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.
Y. Matsumoto,
H. Kudo,
T. Yonekawa,
2014,
2014 International Conference on Electronics Packaging (ICEP).
Y. Matsumoto,
Y. Oguri,
A. Tsukune,
2013,
2013 IEEE International Electron Devices Meeting.