H. Ehara

Cosmic ray neutron-induced soft errors in sub-half micron CMOS circuits

Y. Tosaka, T. Itakura, S. Satoh, 1997, IEEE Electron Device Letters.

Investigation of stress-induced voiding inside and under VIAS in copper interconnects with “wing” pattern

H. Ehara, H. Matsuyama, T. Suzuki, 2008, 2008 IEEE International Reliability Physics Symposium.

Measurements and analysis of neutron-reaction-induced charges in a silicon surface region

Toshihiro Sugii, Yoshiharu Tosaka, Shigeo Satoh, 1997 .

Re-think stress migration phenomenon with stress measurement in 12 years

H. Ehara, H. Matsuyama, M. Shiozu, 2015, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).

Stress migration phenomena in narrow copper lines

H. Ehara, H. Matsuyama, T. Suzuki, 2006, 2006 IEEE International Integrated Reliability Workshop Final Report.

Voiding generation in copper interconnect under room temperature storage in 12 years

H. Ehara, K. Yamabe, H. Matsuyama, 2017 .

Impact of cosmic ray neutron induced soft errors on advanced submicron CMOS circuits

T. Sugii, S. Satoh, H. Ehara, 1996, 1996 Symposium on VLSI Technology. Digest of Technical Papers.

Advances in Brief Detection of Micrometastatic Prostate Cancer Cells in Lymph Nodes by Reverse Transcriptase-Polymerase Chain Reaction 1

Takuji Tanaka, H. Ehara, T. Deguchi, 2006 .