Samson Yoon

Phenomenological description of cyclic deformation using the overlay model

Seong-Gu Hong, Soon-Bok Lee, Samson Yoon, 2004 .

Description of Hysteresis Loops using Modified Overlay Model

Seong-Gu Hong, Soon-Bok Lee, Samson Yoon, 2003 .

Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem

Samson Yoon, B. Han, C. Jang, 2007 .

Low Cycle Fatigue Behavior of 429EM Ferritic Stainless Steel at Elevated Temperatures

Soon-Bok Lee, Samson Yoon, B. Kim, 2004 .

The effect of temperature on low-cycle fatigue behavior of prior cold worked 316L stainless steel

Seong-Gu Hong, Soon-Bok Lee, Samson Yoon, 2003 .

On Moisture Diffusion Modeling Using Thermal-Moisture Analogy

Bongtae Han, Samson Yoon, Zhaoyang Wang, 2007 .

Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading

Bongtae Han, Changsoo Jang, Samson Yoon, 2008 .

Non-linear finite element analysis for electronic packages subjected to combined hygroscopic and thermo-mechanical stresses

Bongtae Han, Seungmin Cho, Samson Yoon, 2005, 2005 7th Electronic Packaging Technology Conference.

Development of predictive modeling scheme for flip-chip on fine pitch flex substrate

Samson Yoon, Samson Yoon, S. Han, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

FLEXURAL STRENGTH OF BGA SOLDER JOINTS WITH ENIG SUBSTRATE FINISH USING 4-POINT BEND TEST

Anurag Bansal, Vadali Mahadev, Samson Yoon, 2005 .

Comprehensive Moisture Diffusion Characteristics of Epoxy Molding Compounds Over Solder Reflow Process Temperature

Bongtae Han, Changsoo Jang, Samson Yoon, 2010, IEEE Transactions on Components and Packaging Technologies.

Methodology to Predict Substrate Warpage and Different Techniques to Achieve Substrate Warpage Targets

K. Moon, Samson Yoon, S. Sitaraman, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem

Bongtae Han, Seungbae Park, Samson Yoon, 2008 .

Thermal Stress and Fatigue Analysis of Exhaust Manifold

Soon-Bok Lee, Samson Yoon, K. Park, 2004 .

Measurement of the Hygroscopic Swelling Coefficient of Thin Film Polymers Used in Semiconductor Packaging

Samson Yoon, B. Han, C. Jang, 2010, IEEE Transactions on Components and Packaging Technologies.