P. Chan

发表

Integrated fuel cell micro power system by microfabrication technique

Zhiyong Xiao, G. Yan, C. Feng, 2005, The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05..

Carbon nanotube thermal interface material for high-brightness light-emitting-diode cooling

P. Chan, K. Zhang, Y. Chai, 2008, Nanotechnology.

First Principles Simulations of Nanoscale Silicon Devices With Uniaxial Strain

P. Chan, M. Chan, Lining Zhang, 2013, IEEE Transactions on Electron Devices.

Integration of an RF MEMS resonator with a bulk CMOS process using a low-temperature and dry-release fabrication method

Zhiyong Xiao, P. Chan, Zhixiong Xiao, 2006 .

Catalyzed microelectrode mediated by PPy/Nafion® composite film for microfabricated fuel cells

C. Feng, P. Chan, I. Hsing, 2007 .

A silicon-based fuel cell micro power system using a microfabrication technique

I-Ming Hsing, Philip C.H. Chan, Zhiyong Xiao, 2006 .

Monolithically Integrated Planar Micro Fuel Cell Arrays

Zhiyong Xiao, C. Feng, P. Chan, 2007, TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference.

Catalyzed microelectrode mediated by polypyrrole/Nafion® composite film for microfabricated fuel cell applications

Philip C. H. Chan, C. Feng, P. Chan, 2007 .

Nanoscale Bipolar and Complementary Resistive Switching Memory Based on Amorphous Carbon

Shimeng Yu, Ali Javey, Hong-Yu Chen, 2011, IEEE Transactions on Electron Devices.

Effect of Al pad surface morphology on the flip-chip solder bump reliability

P. Chan, E. Yau, S. Law, 2002 .

An energy-based failure criterion for delamination initiation in electronic packaging

P. Chan, M. Yuen, H. Fan, 2005 .

An Integrated Surface Micromachined Convex Microhotplate Structure for Tin Oxide Gas Sensor Array

A. Bermak, P.C.H. Chan, G. Yan, 2007, IEEE Sensors Journal.

Characterization of Integrated Tin Oxide Gas Sensors With Metal Additives and Ion Implantations

A. Bermak, G. Yan, P. Chan, 2008, IEEE Sensors Journal.

Accurate modeling of lossy silicon substrate for on-chip inductors and transformers design

P.C.H. Chan, X. Huo, P. Chan, 2004, 2004 IEE Radio Frequency Integrated Circuits (RFIC) Systems. Digest of Papers.

Low-Resistance Carbon Nanotube Contact Plug to Silicon

P.C.H. Chan, Yang Chai, Zhiyong Xiao, 2009, IEEE Electron Device Letters.

Impact of non-vertical sidewall on sub-50 nm FinFET

P.C.H. Chan, M. Chan, Xusheng Wu, 2003, 2003 IEEE International Conference on SOI.

Exact equivalent circuit model for steady-state characterization of semiconductor devices with multiple-energy-level recombination centers

P.C.H. Chan, P. Chan, Chih-Tang Sah, 1979, IEEE Transactions on Electron Devices.

An experimental study on high-temperature metallization for micro-hotplate-based integrated gas sensors

I-Ming Hsing, Johnny K. O. Sin, Zhenan Tang, 2002 .

Three dimensional CMOS integrated circuits on large grain polysilicon films

Mansun Chan, P.C.H. Chan, P. Chan, 2000, International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138).

Thermal analysis and design of a micro-hotplate for integrated gas-sensor applications

Johnny K. O. Sin, Philip C. H. Chan, P. W. Cheung, 1996 .

The effects of grain boundaries in the electrical characteristics of large grain polycrystalline thin-film transistors

Philip C. H. Chan, P. Chan, V.W.C. Chan, 2002 .

Investigation of the source/drain asymmetric effects due to gate misalignment in planar double-gate MOSFETs

P.C.H. Chan, P. Chan, Chunshan Yin, 2005, IEEE Transactions on Electron Devices.

Integrated liquid crystal optical switch based on total internal reflection

Hoi Sing Kwok, Kam Tai Chan, M. S. Demokan, 2005 .

State-of-the-art in Micro-Hotplates

G. Cheng, P. Chan, J. Sin, 2000 .

A low-power CMOS compatible integrated gas sensor using maskless tin oxide sputtering

P. Chan, J. Sin, Zhenan Tang, 1997, Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97).

Reliability study and failure analysis of fine pitch solder bumped flip chip on low-cost printed circuit board substrate

P. Chan, M. Yuen, P. Lee, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Multiple Layers of CMOS Integrated Circuits Using

P. Chan, M. Chan, V.W.C. Chan, 2001 .

Optimization of electroplating, stencil printing, ball placement solder-bumping flip-chip process technologies

P. Chan, M. Yuen, Jingfeng Gong, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Moisture sensor using reactive sputtered TiO/sub 2/ thin film with negative substrate bias

P. Chan, M. Yuen, A. Teng, 2000, International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).

RF circuit integration using high Q copper inductors on organic substrate and solder-bumped flip chip technology

P. Chan, X. Huo, Guo-Wei Xiao, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

A pressure sensor using flip-chip on low-cost flexible substrate

P. Chan, M. Yuen, Jian Cai, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

High-performance microwave passive components on silicon substrate

Kevin J. Chen, P. Chan, L. Leung, 2002, 2002 3rd International Conference on Microwave and Millimeter Wave Technology, 2002. Proceedings. ICMMT 2002..

On-Chip Microwave Filters on Standard Silicon Substrate Incorporating a Low-k BCB Dielectric Layer

Kevin J. Chen, P. Chan, L. Leung, 2002, European Microwave Conference.

Flexible transfer of aligned carbon nanotube films for integration at lower temperature

P. Chan, Y. Chai, M. Yuen, 2007 .

MEASUREMENT OF INTERFACIAL FRACTURE TOUGHNESS FOR MICROELECTRONIC PACKAGES

P. Chan, M. Yuen, D. Lam, 2000 .

Silicon-on-Organic Integration of a 2.4–GHz VCO Using High-Q Copper Inductors and Solder-Bumped Flip Chip Technology

Kevin J. Chen, P. Chan, X. Huo, 2003, IEEE Transactions on Components and Packaging Technologies.

Thermal Analysis And Design Of A Micro-hotplate For Integrated Gas Sensor Applications

P. Chan, S. Fung, J. Sin, 1995, Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95.

High-Q copper inductors on standard silicon substrate with a low-k BCB dielectric layer

P. Chan, X. Huo, K.J. Chen, 2002, 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278).

Electron-beam double resist process to enhance bright field pattern resolution

P. Chan, V.W.C. Chan, 2002 .

Design and fabrication of micro-hotplate for thin film gas sensor

P. Chan, S. Fung, J. Sin, 1994, 1994 IEEE Hong Kong Electron Devices Meeting.

Micro-hotplate for thin film gas sensor: fabrication using cmos technology

P. Chan, S. Fung, J. Sin, 1994, International Electron Devices and Materials Symposium.

Towards future VLSI interconnects using aligned carbon nanotubes

Yuan Li, Min Zhang, Zhiyong Xiao, 2011, 2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip.

The Application of Carbon Nanotubes in CMOS Integrated Circuits

P. Chan, 2006, 2006 7th International Conference on Electronic Packaging Technology.

A 4×4 Tin Oxide Gas Sensor Array with On-chip Signal Pre-processing

G. Yan, P. Chan, A. Bermak, 2006, 2006 International Conference on Microelectronics.

Integration of horizontal carbon nanotube devices on silicon substrate using liquid evaporation

Zhiyong Xiao, P. Chan, Y. Chai, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Inductance properties of silicon-in-grown horizontal carbon nanotubes

Zhiyong Xiao, P. Chan, Y. Chai, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth properties

P. Chan, M. Yuen, Guo-Wei Xiao, 2006, IEEE Transactions on Components and Packaging Technologies.

Effect of Cu stud microstructure and electroplating process on intermetallic compounds growth and reliability of flip-chip solder bump

P. Chan, M. Yuen, Jian Cai, 2001 .

Study on failure mode of solder bump fabricated using eutectic solder electroplating process

P. Chan, M. Yuen, Jian Cai, 2000, International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).

The effect of Cu stud structure and eutectic solder electroplating on intermetallic growth and reliability of flip-chip solder bump

P. Chan, C. Jian, A. Teng, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Novel Local Silicon-Gate Carbon Nanotube Transistors Combining Silicon-on-Insulator Technology for Integration

P. Chan, Min Zhang, Yang Chai, 2009, IEEE Transactions on Nanotechnology.

Fabrication of gate-all-around transistors using metal induced lateral crystallization

P.C.H. Chan, P. Chan, V.W.C. Chan, 2001, IEEE Electron Device Letters.

Experimental and theoretical studies of I—V characteristics of zinc-doped silicon p-n junctions using the exact DC circuit model

P.C.H. Chan, P. Chan, Chih-Tang Sah, 1979, IEEE Transactions on Electron Devices.

A comparative study of droplet impact dynamics on a dual-scaled superhydrophobic surface and lotus leaf

Zhiyong Xiao, P. Chan, Zhigang Li, 2011 .

Radio-frequency transmission properties of carbon nanotubes in a field-effect transistor configuration

M. Zhang, P. Chan, X. Huo, 2006, IEEE Electron Device Letters.

An integrated gas sensor technology using surface micro-machining

P.C.H. Chan, I-Ming Hsing, Zhenan Tang, 2002, Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090).

Impacts of nonrectangular fin cross section on the electrical characteristics of FinFET

P.C.H. Chan, M. Chan, Xusheng Wu, 2005, IEEE Transactions on Electron Devices.

Sensing mechanism of polymer for selectivity enhancement of gas sensors

P. Chan, Zhenan Tang, H. Hiraoka, 1996, ICSE '96. 1996 IEEE International Conference on Semiconductor Electronics. Proceedings.

Low-Resistance Electrical Contact to Carbon Nanotubes With Graphitic Interfacial Layer

Hong-Yu Chen, Yang Chai, K. Takei, 2012, IEEE Transactions on Electron Devices.

An experimental study on micro-gas sensors with strip shape tin oxide thin films

P.C.H. Chan, Zhenan Tang, G. Yan, 2009 .

Carbon Nanotube/Copper Composites for Via Filling and Thermal Management

M. Zhang, P. Chan, Y. Chai, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Reliability Evaluation of Carbon Nanotube Interconnect in a Silicon CMOS Environment

M. Zhang, P. Chan, Y. Chai, 2006, 2006 International Conference on Electronic Materials and Packaging.

Scalability of Quasi-Hysteretic FSM-Based Digitally Controlled Single-Inductor Dual-String Buck LED Driver to Multiple Strings

Albert T. L. Lee, Johnny K. O. Sin, Philip C. H. Chan, 2014, IEEE Transactions on Power Electronics.

Investigation of stability and reliability of tin oxide thin-film for integrated micro-machined gas sensor devices

I-Ming Hsing, Johnny K. O. Sin, Philip C. H. Chan, 2001 .

Sacrificial removal of caps of aligned carbon nanotubes for interconnect application

Zhiyong Xiao, P. Chan, Y. Chai, 2009, 2009 59th Electronic Components and Technology Conference.

Low Temperature Transfer of Aligned Carbon Nanotube Films Using Liftoff Technique

P. Chan, Y. Chai, M. Yuen, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Study on Thermal Interface Material with Carbon Nanotubes and Carbon Black in High-Brightness LED Packaging with Flip-Chip

Kai Zhang, P.C.H. Chan, P. Chan, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Characterization of edge direct tunneling leakage of gate misaligned double gate MOSFETs

P.C.H. Chan, P. Chan, Chunshan Yin, 2004, 2004 IEEE International SOI Conference (IEEE Cat. No.04CH37573).

Reactive sputtered TiO2 thin film humidity sensor with negative substrate bias

P. Chan, M. Yuen, L. Chow, 2001 .

Fast and robust gas identification system using an integrated gas sensor technology and Gaussian mixture models

A. Bermak, S. Brahim-Belhouari, P.C.H. Chan, 2005, IEEE Sensors Journal.

On the use of the transient information for gas identification using microelectronic gas sensor

A. Bermak, S. Brahim-Belhouari, Guangfen Wei, 2004, 2004 IEEE Region 10 Conference TENCON 2004..

Fabrication of raised S/D gate-all-around transistor and gate misalignment analysis

P.C.H. Chan, P. Chan, V.W.C. Chan, 2003, IEEE Electron Device Letters.

Directly synthesizing CNT-TIM on aluminum alloy heat sink for HB-LED thermal management

P. Chan, M. Yuen, D. Xiao, 2008, 2008 58th Electronic Components and Technology Conference.

A resistance variation tolerant constant power heating circuit for integrated sensor applications

P.C.H. Chan, S.S.W. Chan, P. Chan, 1999, Proceedings of the 23rd European Solid-State Circuits Conference.

A monolithic integrated 4 × 4 tin oxide gas sensor array with on-chip multiplexing and differential readout circuits

Amine Bermak, Bin Guo, Guizhen Yan, 2007 .

Horizontally aligned carbon nanotube bundles for interconnect application: diameter-dependent contact resistance and mean free path

Zhiyong Xiao, P. Chan, Y. Chai, 2010, Nanotechnology.

Electromigration Studies of Cu/Carbon Nanotube Composite Interconnects Using Blech Structure

P. Chan, Y. Chai, Yunyi Fu, 2008, IEEE Electron Device Letters.

Gas Identification Based on Committee Machine for Microelectronic Gas Sensor

Amine Bermak, Minghua Shi, Philip C. H. Chan, 2006, IEEE Transactions on Instrumentation and Measurement.

A comparative study of density models for gas identification using microelectronic gas sensor

A. Bermak, S. Brahim-Belhouari, Guangfen Wei, 2003, Proceedings of the 3rd IEEE International Symposium on Signal Processing and Information Technology (IEEE Cat. No.03EX795).

Development of a miniature silicon wafer fuel cell using L-ascorbic acid as fuel

Zhiyong Xiao, P. Chan, Y. Ying, 2008 .

Theory and experiments on r.f. sputtered tin oxide thin-films for gas sensing applications

P. Chan, J. Sin, Zhenan Tang, 1997 .

Design and calibration of a 3-D micro-strain gauge for in situ on chip stress measurements

P.C.H. Chan, P. Chan, T.C.P. Lo, 1996, ICSE '96. 1996 IEEE International Conference on Semiconductor Electronics. Proceedings.

Design and characterization of a micro strain gauge

P. Chan, Zhenan Tang, T. Lo, 1995, 1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings.

A circuit simulation model for bipolar-induced breakdown in MOSFET

Mario Pinto-Guedes, Philip C. Chan, P. Chan, 1988, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..

Radio-frequency characterization for the single-walled carbon nanotubes

Min Zhang, Philip C. H. Chan, Xiao Huo, 2006 .

Fabrication and characterization of horizontally aligned carbon nanotubes for interconnect application

Zhiyong Xiao, P. Chan, Y. Chai, 2009, 2009 59th Electronic Components and Technology Conference.

Electron-shading effect on the horizontal aligned growth of carbon nanotubes

Zhiyong Xiao, P. Chan, Y. Chai, 2009 .

Inductance Properties of In Situ-Grown Horizontally Aligned Carbon Nanotubes

Zhiyong Xiao, P. Chan, Y. Chai, 2011, IEEE Transactions on Electron Devices.

Low‐loss microwave filters on CMOS‐grade standard silicon substrate with low‐k BCB dielectric

Kevin J. Chen, Philip C. H. Chan, L.L.W. Leung, 2004 .

A Blind Source Separation Based Micro Gas Sensor Array Modeling Method

Jun Yu, Guangfen Wei, Zhenan Tang, 2004, ISNN.

A Physical Model for On-Chip Spiral Inductors With Accurate Substrate Modeling

K.J. Chen, P.C.H. Chan, H.C. Luong, 2006, IEEE Transactions on Electron Devices.