C. Bailey
发表
Hua Lu,
D. Flynn,
C. Bailey,
2006,
2006 1st Electronic Systemintegration Technology Conference.
Chris Bailey,
Koulis Pericleous,
Mark Cross,
2001
.
C. Bailey,
M. Cross,
G. Taylor,
1999
.
C. Bailey,
M. Cross,
A. Slone,
2003
.
Owen Thomas,
Chris Bailey,
Christopher Hunt,
2010,
Microelectron. Reliab..
Chris Bailey,
Stoyan Stoyanov,
Tim Tilford,
2017,
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
C. Bailey,
S. Stoyanov,
T. Tilford,
2016,
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Chris Bailey,
Stoyan Stoyanov,
C. Bailey,
2017,
2017 40th International Spring Seminar on Electronics Technology (ISSE).
Andrew J. Forsyth,
Chris Bailey,
Hua Lu,
2020,
IEEE Transactions on Power Electronics.
Gareth A. Taylor,
Chris Bailey,
Mark Cross,
1995
.
Chris Bailey,
Chunyan Yin,
H. Lu,
2008,
2008 31st International Spring Seminar on Electronics Technology.
C. Bailey,
C. M. Johnson,
C. Yin,
2018
.
Hua Lu,
C. Bailey,
2015,
2015 16th International Conference on Electronic Packaging Technology (ICEPT).
Hua Lu,
C. Bailey,
L. Mills,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Hua Lu,
C. Bailey,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
M. J. Rizvi,
C. Bailey,
R. Skuriat,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
M. Pecht,
D. Das,
Hua Lu,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
C. Bailey,
C.M. Johnson,
H. Lu,
2008,
2008 10th Electronics Packaging Technology Conference.
Hua Lu,
C. Bailey,
S. Ridout,
2008,
2008 International Conference on Electronic Packaging Technology & High Density Packaging.
Y. Chan,
Hua Lu,
C. Bailey,
2014
.
C. Bailey,
M. Desmulliez,
M. Kersaudy-Kerhoas,
2012
.
Y. Chan,
Hua Lu,
C. Bailey,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
S. S. Edussuriya,
C. Bailey,
A. Williams,
2004
.
Hua Lu,
C. Bailey,
P. Rajaguru,
2020
.
Computational modeling techniques for reliability of electronic components on printed circuit boards
Hua Lu,
C. Bailey,
D. Wheeler,
2002
.
Hua Lu,
C. Bailey,
C. Yin,
2018,
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Hua Lu,
C. Bailey,
A. Castellazzi,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Hua Lu,
C. Bailey,
M. Cross,
2000
.
J. E. Morris,
C. Bailey,
M. Desmulliez,
2010,
3rd Electronics System Integration Technology Conference ESTC.
C. Bailey,
M. Desmulliez,
A. Sangster,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
C. Bailey,
S. Stoyanov,
H. Lu,
2004,
2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of.
Chris Bailey,
Hua Lu,
Hua Lu,
2002,
4th Electronics Packaging Technology Conference, 2002..
C. Bailey,
G. Glinski,
2002,
ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).
Hua Lu,
C. Bailey,
2002,
ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).
D. Flynn,
C. Bailey,
M. Desmulliez,
2016
.
C. Bailey,
S. Stoyanov,
T. Tilford,
2018,
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
Marc P.Y. Desmulliez,
Mayur Patel,
Xiangdong Xue,
2011
.
C. Bailey,
Xiangdong Xue,
2013,
Computer methods in biomechanics and biomedical engineering.
C. Bailey,
M. Desmulliez,
Xiangdong Xue,
2012,
Computer methods in biomechanics and biomedical engineering.
C. Bailey,
M. Desmulliez,
M. Kersaudy-Kerhoas,
2009,
2009 59th Electronic Components and Technology Conference.
C. Bailey,
M. Desmulliez,
M. Kersaudy-Kerhoas,
2008,
2008 2nd Electronics System-Integration Technology Conference.
Xiangdong Xue,
C. Bailey,
M. Kersaudy-Kerhoas,
2008,
2008 2nd Electronics System-Integration Technology Conference.
C. Bailey,
Xiangdong Xue,
Mayur K. Patel,
2010,
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
Steven Begg,
Chris Bailey,
Graham K. Hargrave,
2002
.
Chunyan Yin,
Chris Bailey,
M. J. Rizvi,
2007
.
Chris Bailey,
M. O. Alam,
C. Bailey,
2011
.
C.M. Johnson,
Hua Lu,
C. Bailey,
2008,
2008 2nd Electronics System-Integration Technology Conference.
Hua Lu,
C. Bailey,
C.M. Johnson,
2008,
2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.
Xiangdong Xue,
Hua Lu,
T. Tilford,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
C. Bailey,
M. Desmulliez,
D. Hutt,
2009
.
C. Bailey,
M. Desmulliez,
D. Price,
2008,
2008 2nd Electronics System-Integration Technology Conference.
C. Bailey,
N. Strusevich,
M. Hughes,
2008,
2008 2nd Electronics System-Integration Technology Conference.
C. Bailey,
Mayur K. Patel,
N. Strusevich,
2012,
2012 14th International Conference on Electronic Materials and Packaging (EMAP).
C. Bailey,
M.,
.. A. Taylor,
2005
.
Chris Bailey,
Stoyan Stoyanov,
Paul Firth,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Chris Bailey,
Koulis Pericleous,
K. Pericleous,
1995
.
C. Bailey,
K. Dhinsa,
K. Pericleous,
2005,
2005 International Symposium on Electronics Materials and Packaging.
Chris Bailey,
Koulis Pericleous,
K. Dhinsa,
2005
.
C. Bailey,
H. Lu,
M. Bella,
2018,
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Hua Lu,
C. Bailey,
P. Rajaguru,
2018,
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
C. Bailey,
A. Albarbar,
S. Stoyanov,
2020
.
Svetan Ratchev,
Michele Turitto,
Xiangdong Xue,
2007
.
C. Bailey,
S. Ratchev,
Xiangdong Xue,
2009
.
C. Bailey,
Hua Lu,
S. Stoyanov,
2012,
2012 35th International Spring Seminar on Electronics Technology.
D. Flynn,
C. Bailey,
M. Desmulliez,
2013
.
C. Bailey,
S. Stoyanov,
C. Gourlay,
2022,
International Journal of Plasticity.
Hua Lu,
C. Bailey,
P. Rajaguru,
2014
.
Y. Chan,
C. Bailey,
H. Lu,
2007,
2007 9th Electronics Packaging Technology Conference.
M. J. Rizvi,
C. Bailey,
H. Lu,
2006,
2006 1st Electronic Systemintegration Technology Conference.
C. Bailey,
H. Lu,
C. Yin,
2012,
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
C. Bailey,
T. Tilford,
M. Santhanakrishnan,
2017
.
C. Bailey,
D. Wheeler,
H. Lu,
2000,
Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).
C. Bailey,
S. Stoyanov,
M. Ahsan,
2020
.
C. Bailey,
T. Tilford,
M. Burgard,
2018
.
C. Bailey,
S. Stoyanov,
T. Tilford,
2016,
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
David Flynn,
Marc P.Y. Desmulliez,
Chris Bailey,
2008
.
Chris Bailey,
Mark Cross,
Choi-Hong Lai,
1991
.
Hua Lu,
C. Bailey,
C. Hunt,
2010,
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
Y. Chan,
K. Hung,
Hua Lu,
2004
.
K.,
C. Bailey,
M. Desmulliez,
2019
.
C. Bailey,
M. Desmulliez,
M. Ferenets,
2010,
3rd Electronics System Integration Technology Conference ESTC.
C. Bailey,
M. Desmulliez,
M. Ferenets,
2010,
2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP).
C. Bailey,
M. Desmulliez,
A. Sangster,
2008,
IEEE Transactions on Microwave Theory and Techniques.
C. Bailey,
M. Desmulliez,
A. Sangster,
2008,
2008 38th European Microwave Conference.
Hua Lu,
C. Bailey,
C. Yin,
2022,
Power Electronic Devices and Components.
J. E. Morris,
C. Bailey,
M. Desmulliez,
2010
.
Hua Lu,
C. Bailey,
Xiangdong Xue,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
C. Bailey,
C. Yin,
S. Riches,
2007,
2007 8th International Conference on Electronic Packaging Technology.
Da Zhu,
Chris Bailey,
Marty Lastiwka,
2017
.
Hua Lu,
C. Bailey,
P. Rajaguru,
2019,
IEEE Transactions on Device and Materials Reliability.
Chris Bailey,
Hua Lu,
Pushparajah Rajaguru,
2015,
Microelectron. Reliab..
C. Bailey,
B.Y. Wu,
Y. Chan,
2007,
2007 International Symposium on High Density packaging and Microsystem Integration.
C. Bailey,
M. Cross,
D. Edwards,
1987
.
C. Bailey,
M. Desmulliez,
T. Tilford,
2009,
2009 32nd International Spring Seminar on Electronics Technology.
Tim Tilford,
Hua Lu,
Chris Bailey,
2008
.
C. Bailey,
H. Lu,
T. Tilford,
2007,
2007 30th International Spring Seminar on Electronics Technology (ISSE).
C. Bailey,
H. Lu,
T. Tilford,
2007,
2007 8th International Conference on Electronic Packaging Technology.
M. J. Rizvi,
Y. Chan,
Hua Lu,
2007
.
Hua Lu,
C. Bailey,
J. Morris,
2010,
2010 IEEE Nanotechnology Materials and Devices Conference.
Tim Tilford,
Chris Bailey,
Pushpa Rajaguru,
2019,
2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Chris Bailey,
Mani Sekaran Santhanakrishnan,
Tim Tilford,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Chris Bailey,
Tim Tilford,
C. Bailey,
2018
.
Chris Bailey,
Paul Stewart,
Stoyan Stoyanov,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Hua Lu,
Chris Bailey,
Sha Xu,
2014
.
M. J. Rizvi,
C. Bailey,
H. Lu,
2010,
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
Chris Bailey,
Hua Lu,
M. J. Rizvi,
2010
.
Y. Chan,
C. Bailey,
L. Rufer,
2006,
2006 8th Electronics Packaging Technology Conference.
Chris Bailey,
Y. C. Chan,
Hua Lu,
2006
.
Chris Bailey,
S. Ridout,
C. Bailey,
2007
.
C. Bailey,
M. Dusek,
C. Hunt,
2006,
2006 1st Electronic Systemintegration Technology Conference.
C. Bailey,
H. Lu,
X. Zhu,
2014,
14th IEEE International Conference on Nanotechnology.
Y. C. Chan,
C. Bailey,
X. Zhu,
2013,
2013 14th International Conference on Electronic Packaging Technology.
M. J. Rizvi,
Hua Lu,
C. Bailey,
2009
.
Chris Bailey,
Christopher Hunt,
M Dusek,
2004
.
C. Bailey,
S. Stoyanov,
C. Yin,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
C. Bailey,
S. Stoyanov,
C. Yin,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
Chris Bailey,
Y. C. Chan,
Hua Lu,
2007
.
N. Strusevich,
N. Dumas,
C. Bailey,
2006,
2006 8th Electronics Packaging Technology Conference.
P. Conway,
C. Bailey,
D. Hutt,
2000,
Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).
Y. Chan,
C. Bailey,
H. Lu,
2013,
2013 13th IEEE International Conference on Nanotechnology (IEEE-NANO 2013).
Y. C. Chan,
Hua Lu,
C. Bailey,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
C. Bailey,
E. Kamara,
C. Hunt,
2012,
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.
Chris Bailey,
Y. C. Chan,
M. O. Alam,
2009
.
Hua Lu,
Y. Chan,
C. Bailey,
2009,
IEEE Transactions on Device and Materials Reliability.
H. Lu,
C. Bailey,
Y. Chan,
2008,
2008 2nd Electronics System-Integration Technology Conference.
Mark Cross,
Chris Bailey,
Koulis Pericleous,
2004
.
Chris Bailey,
Chunyan Yin,
Hua Lu,
2018,
Microelectron. Reliab..
Florin Udrea,
Alberto Castellazzi,
Pushparajah Rajaguru,
2018,
Microelectron. Reliab..
Pushparajah Rajaguru,
Hua Lu,
Chris Bailey,
2017,
Microelectron. Reliab..
C. Bailey,
S. Stoyanov,
T. Tilford,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
C. Bailey,
H. Lu,
P. Rajaguru,
2017,
2017 Pan Pacific Microelectronics Symposium (Pan Pacific).
Chris Bailey,
Hua Lu,
Pushparajah Rajaguru,
2015,
Microelectron. Reliab..
Chris Bailey,
Chunyan Yin,
Hua Lu,
2003,
Microelectron. Reliab..
Stoyan Stoyanov,
Chris Bailey,
Mark Cross,
2002
.
C. Bailey,
M. Cross,
D. Wheeler,
1998
.
Chris Bailey,
Hua Lu,
Hua Lu,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
Hua Lu,
M. Warner,
J. Parry,
2004,
The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).
Stoyan Stoyanov,
Chris Bailey,
Chunyan Yin,
2015
.
Chris Bailey,
Y. C. Chan,
Ahmed Sharif,
2005
.
Chris Bailey,
Stoyan Stoyanov,
Asif Malik,
2018,
2018 Fifth HCT Information Technology Trends (ITT).
C. Bailey,
M. Desmulliez,
K. Brown,
2013
.
Koulis Pericleous,
A. K. Slone,
Chris Bailey,
2002
.
David Flynn,
Valentin Robu,
Michael Pecht,
2019,
IEEE Access.
C. Bailey,
Mohammad Shahjalal,
H. Lu,
2014,
20th International Workshop on Thermal Investigations of ICs and Systems.
Chris Bailey,
Chunyan Yin,
Hua Lu,
2009,
Microelectron. Reliab..
Ndy Ekere,
Chris Bailey,
G Glinski,
2002
.
Gareth A. Taylor,
Chris Bailey,
Mark Cross,
2000
.
Hua Lu,
Stoyan Stoyanov,
Chris Bailey,
2013
.
Y. Chan,
Hua Lu,
C. Bailey,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
C. Bailey,
H. Lu,
C. Bailey,
2011,
Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE).
Chris Bailey,
Xiangdong Xue,
Mayur K Patel,
2011,
Computer methods in biomechanics and biomedical engineering.
Chris Bailey,
Mayur K Patel,
Marc P. Y. Desmulliez,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
C. Bailey,
M. Desmulliez,
M. Kersaudy-Kerhoas,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
C. Bailey,
C. Bailey,
2008,
2008 10th Electronics Packaging Technology Conference.
Chunyan Yin,
Hua Lu,
Chris Bailey,
2006
.
Modelling and optimisation study on the fabrication of nano‐structures using imprint forming process
Marc P.Y. Desmulliez,
Stoyan Stoyanov,
Tim Tilford,
2011
.
C. Bailey,
M. Desmulliez,
S. Stoyanov,
2008,
2008 31st International Spring Seminar on Electronics Technology.
C. Bailey,
M. Desmulliez,
S. Stoyanov,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
C. Bailey,
S. Stoyanov,
T. Golding,
2019,
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Chris Bailey,
Tim Tilford,
Mani Sekara Santhanakrishnan,
2021,
International Journal of Numerical Methods for Heat & Fluid Flow.
Chris Bailey,
Paul Stewart,
Stoyan Stoyanov,
2020,
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
C. Bailey,
S. Stoyanov,
2022,
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
C. Bailey,
M. Desmulliez,
T. Tilford,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Stoyan Stoyanov,
Chris Bailey,
Chunyan Yin,
2015,
Microelectron. Reliab..
M. O. Alam,
C. Bailey,
S. Stoyanov,
2012,
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.
David Flynn,
Chris Bailey,
Helen Lewis,
2018,
IEEE Access.
Hua Lu,
Chris Bailey,
Pushparajah Rajaguru,
2012
.
Hua Lu,
C. Bailey,
2016,
2016 6th Electronic System-Integration Technology Conference (ESTC).
C. Bailey,
S. Stoyanov,
C. Bailey,
2007,
IEEE Transactions on Components and Packaging Technologies.
Chris Bailey,
Mark Cross,
Daniel Wheeler,
1999
.
Hua Lu,
C. Bailey,
R. Durairaj,
2004
.
Stoyan Stoyanov,
Chris Bailey,
Tim Tilford,
2018,
Microelectron. Reliab..
C. Bailey,
M. Alam,
2011
.
C. Bailey,
K. Dhinsa,
K. Pericleous,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
Chris Bailey,
Stoyan Stoyanov,
Thamo Sutharssan,
2011,
18th European Microelectronics & Packaging Conference.
C. Bailey,
M. Cross,
G. Taylor,
2003
.
Chris Bailey,
Mark Cross,
C. Bailey,
1995
.
Chris Bailey,
Mark Cross,
Daniel Wheeler,
2000
.
Chris Bailey,
Koulis Pericleous,
K. Pericleous,
2000
.
Chris Bailey,
Koulis Pericleous,
Chris Walshaw,
1999
.
C. Bailey,
P. Rajaguru,
M. Bella,
2021,
2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Hua Lu,
C. Bailey,
C. Yin,
2017,
2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Chris Bailey,
Christopher Hunt,
Milos Dusek,
2006,
Microelectron. Reliab..
C. Bailey,
S. Stoyanov,
N. Strusevich,
2007,
2007 30th International Spring Seminar on Electronics Technology (ISSE).
Stoyan Stoyanov,
Chris Bailey,
Pushpa Rajaguru,
2010
.
C. Bailey,
M. J. Rizvi,
C.Y. Yin,
2006,
2006 International Conference on Electronic Materials and Packaging.
Stoyan Stoyanov,
Chris Bailey,
Peter Mason,
2010
.
Chris Bailey,
Stoyan Stoyanov,
Alexander Dabek,
2013,
Proceedings of the 36th International Spring Seminar on Electronics Technology.
C. Bailey,
M. Ferenets,
T. Tilford,
2011,
2011 IEEE 13th Electronics Packaging Technology Conference.
J. E. Morris,
C. Bailey,
M. Desmulliez,
2010,
3rd Electronics System Integration Technology Conference ESTC.
C. Bailey,
H. Lu,
P. Rajaguru,
2015,
2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Chris Bailey,
Stoyan Stoyanov,
Mominul Ahsan,
2018,
2018 41st International Spring Seminar on Electronics Technology (ISSE).
J. E. Morris,
C. Bailey,
M. Desmulliez,
2010,
33rd International Spring Seminar on Electronics Technology, ISSE 2010.
Chris Bailey,
Stoyan Stoyanov,
Mominul Ahsan,
2016,
2016 39th International Spring Seminar on Electronics Technology (ISSE).
C. Bailey,
M. Desmulliez,
J. Gourlay,
2003
.
Chris Bailey,
Chunyan Yin,
Y. C. Chan,
2013
.
Chris Bailey,
Xiangdong Xue,
C. Bailey,
2007
.
Chris Bailey,
Xiao Zhu,
Sha Xu,
2013
.