S. Holmes

发表

Investigation of immersion related defects using pre- and post-wet experiments

Yayi Wei, Frank Goodwin, Karen Petrillo, 2006, SPIE Advanced Lithography.

Design, synthesis, and characterization of KrF negative developable bottom anti-reflective coating materials

Sen Liu, Brian Osborn, Brian P. Osborn, 2012, Other Conferences.

Optimization of pitch-split double patterning phoresist for applications at the 16nm node

Brian P. Osborn, S. Holmes, K. Petrillo, 2011, ASMC 2011.

Extremely thin SOI (ETSOI) CMOS with record low variability for low power system-on-chip applications

L. H. Vanamurth, D. Yang, T. Adam, 2009, 2009 IEEE International Electron Devices Meeting (IEDM).

ETSOI CMOS for system-on-chip applications featuring 22nm gate length, sub-100nm gate pitch, and 0.08µm2 SRAM cell

T. Adam, T. Standaert, M. Khare, 2011, 2011 Symposium on VLSI Circuits - Digest of Technical Papers.

22-nm-node technology active-layer patterning for planar transistor devices

Scott Halle, Aasutosh Dave, Harry J. Levinson, 2010 .

Simple and versatile methods to integrate directed self-assembly with optical lithography using a polarity-switched photoresist.

Joy Y. Cheng, A. Friz, W. Hinsberg, 2010, ACS nano.

A 0.063 µm2 FinFET SRAM cell demonstration with conventional lithography using a novel integration scheme with aggressively scaled fin and gate pitch

K. Maitra, P. Kulkarni, T. Yamashita, 2010, 2010 Symposium on VLSI Technology.

Use of scatterometric latent-image detector in closed-loop feedback control of linewidth

S. Holmes, D. Mellichamp, J. Sturtevant, 1994 .

Strain engineered extremely thin SOI (ETSOI) for high-performance CMOS

T. Nagumo, N. Loubet, W. Schwarzenbach, 2012, 2012 Symposium on VLSI Technology (VLSIT).

Chemistry of Ketal Resist System and Its Lithographic Performance

William R. Brunsvold, Roger F. Sinta, Ronald W. Nunes, 1998 .

Procedures for the directional self-organization and Produced layer structures

Joy Y. Cheng, W. Hinsberg, S. Holmes, 2010 .

Negative photoresists for optical lithography

Steven J. Holmes, Jeffrey D. Gelorme, Nancy C. LaBianca, 1997, IBM J. Res. Dev..

Overview of gate linewidth control in the manufacture of CMOS logic chips

D. G. Chesebro, J. W. Adkisson, L. R. Clark, 1995, IBM J. Res. Dev..

Self-assembly patterning for sub-15nm half-pitch: a transition from lab to fab

William D. Hinsberg, Chris Bencher, Hoa D. Truong, 2011, Advanced Lithography.

Integration of Directed Self-Assembly with 193 nm Lithography

William D. Hinsberg, Joy Cheng, Matthew E. Colburn, 2010 .

Processing thick multilevel polyimide films for 3-D stacked memory

S. Holmes, Michael Caterer, T. H. Daubenspeck, 1999, ECTC 1999.

Progress toward developing high performance immersion compatible materials and processes

Kurt R. Kimmel, Karen Petrillo, Takashi Chiba, 2005, SPIE Advanced Lithography.

1X deep-UV lithography with chemical amplification for 1-micron DRAM production

Scott A. MacDonald, C. Grant Willson, Nicholas J. Clecak, 1990, Advanced Lithography.

UTBB FDSOI transistors with dual STI for a multi-Vt strategy at 20nm node and below

O. Rozeau, O. Faynot, M. Vinet, 2012, 2012 International Electron Devices Meeting.

High performance extremely thin SOI (ETSOI) hybrid CMOS with Si channel NFET and strained SiGe channel PFET

M. Vinet, L. Grenouillet, T. Nagumo, 2012, 2012 International Electron Devices Meeting.

Challenges and opportunities of extremely thin SOI (ETSOI) CMOS technology for future low power and general purpose system-on-chip applications

B. Jagannathan, N. Loubet, P. Kulkarni, 2010, Proceedings of 2010 International Symposium on VLSI Technology, System and Application.

Deep-ultraviolet lithography for 500-nm devices

Karey L. Holland, Steven J. Holmes, Ruth Levy, 1990, Advanced Lithography.

Lithographic performance of an environmentally stable chemically amplified photoresist (ESCAP)

Will Conley, Gregory Breyta, William R. Brunsvold, 1996, Advanced Lithography.

The evolution of IBM CMOS DRAM technology

John K. DeBrosse, Steven H. Voldman, James S. Nakos, 1995, IBM J. Res. Dev..

Linewidth control effects on MOSFET ESD robustness

J. Adkisson, S. Voldman, J. Never, 1996, 1996 Proceedings Electrical Overstress/Electrostatic Discharge Symposium.

Simple and versatile methods to integrate directed self-assembly with optical lithography using a polarity-switched photoresist.

Joy Y. Cheng, A. Friz, W. Hinsberg, 2010, ACS nano.