N. Papageorgiou

3-D-integrated RF and millimeter-wave functions and modules using liquid crystal polymer (LCP) system-on-package technology

J. Papapolymerou, J. Laskar, M.M. Tentzeris, 2004, IEEE Transactions on Advanced Packaging.

Multi-band RF and mm-wave design solutions for integrated RF functions in liquid crystal polymer system-on-package technology

L. Roselli, M. Tentzeris, J. Laskar, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).