J. Lee

3-D-integrated RF and millimeter-wave functions and modules using liquid crystal polymer (LCP) system-on-package technology

J. Papapolymerou, J. Laskar, M.M. Tentzeris, 2004, IEEE Transactions on Advanced Packaging.

Multi-band RF and mm-wave design solutions for integrated RF functions in liquid crystal polymer system-on-package technology

L. Roselli, M. Tentzeris, J. Laskar, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Fast hybrid electromagnetic/statistical approach for design and optimization of RF systems and packages

N. Vasiloglou, M. Tentzeris, J. Lee, 2004, 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..

Millimeter wave RF front end design using neuro-genetic algorithms

J. Laskar, J.H. Lee, G.S. May, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

3D-SOP Millimeter-Wave Fuctions for High Data Rate Wireless Systems using LTCC and LCP Technologies

J. Papapolymerou, J. Laskar, M.M. Tentzeris, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Advanced 3-D LTCC system-on-package (SOP) architectures for highly integrated millimeter-wave wireless systems

J. Papapolymerou, J. Laskar, S. Pinel, 2004, 34th European Microwave Conference, 2004..