Zhiye Zhang

High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment

J. D. van Wyk, J. Guofeng Bai, Jian Yin, 2007, IEEE Transactions on Advanced Packaging.

Modeling, analysis and experiments of inter yarn compaction effects in braided composite actuators

Michael Philen, Zhiye Zhang, Zhiye Zhang, 2013 .

A lead-free, low-temperature sintering die-attach technique for high-performance and high-temperature packaging

Guo-Quan Lu, Zhiye Zhang, Zhiye Zhang, 2004, Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04).

Comparison of the interfacial thermal resistivity of silver and solder die-attach using laser flash technique

Zhiye Zhang, G. Lu, D. Hasselman, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material

Guo-Quan Lu, J.G. Bai, Zhiye Zach Zhang, 2006, IEEE Transactions on Components and Packaging Technologies.

Fracture Toughness of Spray‐Dried Powder Compacts

Zhiye Zhang, D. J. Green, 2004 .

A biologically inspired artificial fish using flexible matrix composite actuators: analysis and experiment

Wayne L. Neu, Michael Philen, Zhiye Zhang, 2010 .

Pressurized artificial muscles

Michael Philen, Zhiye Zhang, Zhiye Zhang, 2012 .

Determination of interfacial thermal resistivity by finite element modeling of the flash measurements

Guo-Quan Lu, J.G. Bai, J.N. Calata, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).