Kai Wang

发表

Design method of high-efficient  LED headlamp lens.

Fei Chen, Kai Wang, Zong Qin, 2010, Optics express.

Application specific LED packaging for automotive forward-lighting application and design of whole lamp module

Fei Chen, Kai Wang, Zhangming Mao, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Heat and fluid flow in high-power LED packaging and applications

Kai Wang, Sheng Liu, Run Hu, 2016 .

Optical Analysis of Color Distribution in White LEDs With Various Packaging Methods

Sheng Liu, Kai Wang, Xiaobing Luo, 2008, IEEE Photonics Technology Letters.

Precise optical modeling of blue light-emitting diodes by Monte Carlo ray-tracing.

Kai Wang, Xiaobing Luo, Sheng Liu, 2010, Optics express.

Measurement and numerical studies of optical properties of YAG:Ce phosphor for white light-emitting diode packaging.

Sheng Liu, Kai Wang, Xiaobing Luo, 2010, Applied optics.

Study on the Reliability of Application-Specific LED Package by Thermal Shock Testing, Failure Analysis, and Fluid–Solid Coupling Thermo-Mechanical Simulation

Kai Wang, Zhaohui Chen, Sheng Liu, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Status and prospects for phosphor-based white LED packaging

Kai Wang, Xiaobing Luo, Sheng Liu, 2009 .

Effects of phosphor’s thickness and concentration on performance of white LEDs

Kai Wang, Xiaobing Luo, Sheng Liu, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

Angular color uniformity enhancement of phosphor converted white LEDs integrated with compact modified freeform TIR components

Fei Chen, Kai Wang, Sheng Liu, 2012 .

Effects of phosphor’s location on LED packaging performance

Sheng Liu, Kai Wang, Xiaobing Luo, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

Analysis of factors affecting color distribution of white LEDs

Sheng Liu, Kai Wang, Xiaobing Luo, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

Analysis of condition for uniform lighting generated by array of light emitting diodes with large view angle.

Sheng Liu, Fei Chen, Kai Wang, 2010, Optics express.

Enhancement of light extraction of multi-chips light-emitting diode (LED) modules with various micro-structure arrays

Sheng Liu, Kai Wang, Dan Wu, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

Highly Efficient and Stable Quantum Dot Light Emitting Diodes Optimized by Micro-Packaged Luminescent Microspheres

Kai Wang, Xiaobing Luo, Sheng Liu, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Freeform Optics for LED Packages and Applications

Kai Wang, Xiaobing Luo, Sheng Liu, 2017 .

Studies on Optical Consistency of White LEDs Affected by Phosphor Thickness and Concentration Using Optical Simulation

Sheng Liu, Kai Wang, Kai Wang, 2010, IEEE Transactions on Components and Packaging Technologies.

New freeform lenses for white LEDs with high color spatial uniformity.

Kai Wang, Sheng Liu, Shuiming Li, 2012, Optics express.

Design of compact freeform lens for application specific Light-Emitting Diode packaging.

Fei Chen, Kai Wang, Xiaobing Luo, 2010, Optics express.

Effects of Defects on the Thermal and Optical Performance of High-Brightness Light-Emitting Diodes

Sheng Liu, Kai Wang, Liuxi Tan, 2009, IEEE Transactions on Electronics Packaging Manufacturing.

A light emitting diode’s chip structure with low stress and high light extraction efficiency

Kai Wang, Sheng Liu, Zongyuan Liu, 2008, 2008 58th Electronic Components and Technology Conference.

A Sensor Integrated Ultra-long Span LED Street Lamp System

Sheng Liu, Kai Wang, Kai Wang, 2007, 2007 8th International Conference on Electronic Packaging Technology.

Lens design of LED searchlight of high brightness and distant spot.

Sheng Liu, Fei Chen, Kai Wang, 2011, Journal of the Optical Society of America. A, Optics, image science, and vision.

Optical analysis of a 3W light-emitting diode (LED) MR16 lamp

Sheng Liu, Fei Chen, Kai Wang, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

Design of compact freeform lens for application specific Light-Emitting Diode packaging.

Kai Wang, Xiaobing Luo, Sheng Liu, 2010, Optics express.

Fluid-solid coupling thermo-mechanical analysis of high power LED package during thermal shock testing

Qin Zhang, Sheng Liu, Zhaohui Chen, 2012, Microelectron. Reliab..

Dynamic mechanical properties of the transparent silicone resin for high power LED packaging

Sheng Liu, Kai Wang, Xiaobing Luo, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.