Cao Li

Application specific LED packaging for automotive forward-lighting application and design of whole lamp module

Fei Chen, Kai Wang, Zhangming Mao, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

21-Layer 3-D Chip Stacking Based on Cu-Sn Bump Bonding

Cao Li, Xuefang Wang, Sheng Liu, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Fabrication of Lens With Large View Angle Through Droplet Evaporation for High-Power Light-Emitting Diodes

Cao Li, Sheng Liu, J. Chu, 2016, Journal of Display Technology.

Modeling and simulation for the thermo -mechanical interfacial reliability of throug h-silicon-via for 3D IC integration

Hao Jiang, Cao Li, Sheng Liu, 2015, Electronic Components and Technology Conference.

An innovative way to improve the reliability of gold wire in lighting emitting diodes (LEDs)

Cao Li, Xiang Gao, Run Chen, 2012 .

A New Prewetting Process of Through Silicon Vias (TSV) Electroplating for 3D Integration

Cao Li, Huai Zheng, Jun Nie, 2019, Journal of Microelectromechanical Systems.

Dimension optimization of through silicon via(TSV) through simulation and design of experiment (DOE)

Cao Li, Xiang Gao, Run Chen, 2012 .