D. Gardner

发表

Review of On-Chip Inductor Structures With Magnetic Films

S. Borkar, D. Gardner, G. Schrom, 2009, IEEE Transactions on Magnetics.

High frequency (GHz) and low resistance integrated inductors using magnetic materials

Shan X. Wang, D. Gardner, A. Crawford, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

A 480-MHz, multi-phase interleaved buck DC-DC converter with hysteretic control

S. Narendra, V. De, P. Hazucha, 2004, 2004 IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551).

Mechanical stress as a function of temperature in aluminum films

P. Flinn, D. Gardner, 1988 .

Sub-100 μm scale on-chip inductors with CoZrTa for GHz applications

W. Xu, B. Bakkaloglu, D. Gardner, 2011 .

Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal history

P. Flinn, D. Gardner, W. Nix, 1987, IEEE Transactions on Electron Devices.

Microring and microdisk optical resonators using silicon nanocrystals and erbium prepared using silicon technology

Mark L. Brongersma, Donald S. Gardner, D. Gardner, 2005 .

High-frequency microinductors with amorphous magnetic ground planes

Shan X. Wang, D. Gardner, A. Crawford, 2002 .

Control of magnetic flux and eddy currents in magnetic films for on-chip radio frequency inductors: Role of the magnetic vias

D. Gardner, Hao Wu, Hongbin Yu, 2014 .

Layered and homogeneous films of aluminum and aluminum/silicon with titanium and tungsten for multilevel interconnects

K. Saraswat, D. Gardner, J. McVittie, 1985, IEEE Transactions on Electron Devices.

Layered and Homogeneous Films of Aluminum and Aluminum/Silicon with Titanium and Tungsten for Multilevel Interconnects

D. Gardner, J. McVittie, T. Michalka, 1985, IEEE Journal of Solid-State Circuits.

Mechanical Stress as a Function of Temperature in Thin Aluminum Films and its Alloys

P. Flinn, D. Gardner, 1988 .

Encapsulated copper interconnection devices using sidewall barriers

D. Gardner, J. Onuki, Q. T. Vu, 1995 .

Observations of electromigration induced void nucleation and growth in polycrystalline and near‐bamboo passivated Al lines

P. Flinn, T. Marieb, D. Gardner, 1995 .

Multilayered Interconnections for VLSI

K. Saraswat, D. Gardner, 1987 .

Encapsulated copper interconnection devices using sidewall barriers

D. Gardner, J. Onuki, K. Kudoo, 1991, 1991 Proceedings Eighth International IEEE VLSI Multilevel Interconnection Conference.

Integrated On-Chip Inductors With Magnetic Films

G. Schrom, T. Karnik, P. Hazucha, 2006, IEEE Transactions on Magnetics.

Effectiveness and Reliability of Metal Diffusion Barriers for Copper Interconnects

T. Marieb, D. Gardner, D. Fraser, 1995 .

Strain Measurement and Calculation in Passivated Cu Lines Deposited by Three Different Methods

T. Marieb, D. Gardner, A. Mack, 1995 .

Observation of voids induced by mechanical stress and electromigration in passivated Al lines deposited at different purity levels

P. Flinn, T. Marieb, D. Gardner, 1994 .

Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniques

Donald S. Gardner, William D. Nix, D. Gardner, 1986 .

Interconnection and electromigration scaling theory

J.D. Meindl, D.S. Gardner, K.C. Saraswat, 1987, IEEE Transactions on Electron Devices.

Electrochemical Fabrication of Multi-Nanolayers

Saibal Roy, Terence O'Donnell, Paul McCloskey, 2015 .

Detection of reactions and changes in thin film morphology using stress measurements

P. Flinn, D. Gardner, H. Longworth, 1992 .

Stress and TEM measurements as a function of temperature for aluminum alloys

P. Flinn, D. Gardner, H. Longworth, 1990, Seventh International IEEE Conference on VLSI Multilevel Interconnection.

Mechanical stress as a function of temperature for aluminum alloy films

P. Flinn, D. Gardner, 1990 .

Integrated on-chip energy storage using passivated nanoporous-silicon electrochemical capacitors

Yang Liu, John L. Gustafson, Chunhui Chen, 2016 .

Integrated on-chip inductors using magnetic material (invited)

Peter Hazucha, Fabrice Paillet, Gerhard Schrom, 2008 .

Integrated On-Chip Inductors with Magnetic Films

S. Borkar, P. Hazucha, D. Gardner, 2007, 2006 International Electron Devices Meeting.

Integrated On-Chip Inductors Using Magnetic Materials

Fabrice Paillet, Gerhard Schrom, Tanay Karnik, 2011 .

Electrodeposited amorphous Co–P based alloy with improved thermal stability

D. Gardner, B. Jamieson, T. O'Donnell, 2010 .

Performance Enhancement of On-Chip Inductors With Permalloy Magnetic Rings

Yu Cao, Saurabh Sinha, Bertan Bakkaloglu, 2011, IEEE Electron Device Letters.

Influence of line dimensions on the resistance of Cu interconnections

D. Gardner, Fen Chen, D. Gardner, 1998, IEEE Electron Device Letters.

High-reliability interconnections for ULSI using Al-Si-Pd-Nd/Mo layered films

D. Gardner, J. Onuki, M. Koizumi, 1992 .

Fabrication and Comparison of Broad-band Inductors with One and Two Co-based Amorphous Ground Planes

Shan X. Wang, D. Gardner, A. Crawford, 2002 .

High frequency microwave on-chip inductors using increased ferromagnetic resonance frequency of magnetic films

Liwei Lin, D. Gardner, Chen Yang, 2015, 2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS).

Improved High Frequency Response and Quality Factor of On-Chip Ferromagnetic Thin Film Inductors by Laminating and Patterning Co-Zr-Ta-B Films

Hongbin Yu, Donald S. Gardner, D. Gardner, 2013, IEEE Transactions on Magnetics.

A 100MHz Eight-Phase Buck Converter Delivering 12A in 25mm2 Using Air-Core Inductors

P. Hazucha, G. Schrom, F. Paillet, 2007, APEC 07 - Twenty-Second Annual IEEE Applied Power Electronics Conference and Exposition.

A 233-MHz 80%-87% efficient four-phase DC-DC converter utilizing air-core inductors on package

S. Narendra, V. De, S. Borkar, 2005, IEEE Journal of Solid-State Circuits.

Integration of magnetic materials into package RF and power inductors on organic substrates for system in package (SiP) applications

Hongbin Yu, Cheng Lv, Donald S. Gardner, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Magnetically aligned 2D rectangular micro magnets with uniaxial in-plane anisotropy for high frequency magnetic devices

D. Gardner, N. Tayebi, K. Koh, 2015, 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS).

Integrated RF On-Chip Inductors With Patterned Co-Zr-Ta-B Films

Wei Xu, Hongbin Yu, D. S. Gardner, 2012, IEEE Transactions on Magnetics.

Feasibility of monolithic and 3D-stacked DC-DC converters for microprocessors in 90nm technology generation

Vivek De, Volkan Kursun, Siva G. Narendra, 2004, Proceedings of the 2004 International Symposium on Low Power Electronics and Design (IEEE Cat. No.04TH8758).