D. Hutt

发表

The Effect of Ultrasonic Additive Manufacturing on Integrated Printed Electronic Conductors

Alkaios Bournias-Varotsis, D. Engstrøm, Shanda Wang, 2018, Electronic Materials Letters.

Application of adhesives in MEMS and MOEMS assembly: a review

D. Hutt, D. Whalley, F. Sarvar, 2002, 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599).

Under bump metallisation of fine pitch flip-chip using electroless nickel deposition

P. Conway, D. Hutt, D. Whalley, 2000 .

Materials and Processes Issues in Fine Pitch Eutectic Solder Flip Chip Interconnection

P. Conway, D. Hutt, D. Whalley, 2004, IEEE Transactions on Components and Packaging Technologies.

Excimer Laser Machining of Fired LTCC for Selectively Metallized Open Channel Structures

P. Conway, D. Hutt, Dilshani Rathnayake-Arachchige, 2013 .

Adhesion improvement of electroless copper (Cu) thin films deposited on Low Temperature Co-fired Ceramics (LTCC)

P. Conway, D. Hutt, Dilshani Rathnayake-Arachchige, 2012, 2012 4th Electronic System-Integration Technology Conference.

Ultrasound assisted dispersal of a copper nanopowder for electroless copper activation.

J. Graves, D. Hutt, T. Mason, 2016, Ultrasonics sonochemistry.

CO2 laser micromachining of optical waveguides for interconnection on circuit boards

P. Conway, D. Hutt, Kai Wang, 2012 .

Polymer Overmoulding for Microfluidic Device Packaging and System Integration

P. J. Palmer, P. Conway, D. Hutt, 2005, Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics.

Integration and Packaging of Microsystems by Polymer Overmoulding

P. J. Palmer, P. Conway, D. Hutt, 2006, 2006 1st Electronic Systemintegration Technology Conference.

A SEXAFS investigation of self-assembled monolayers on silver

D. Hutt, G. Leggett, E. Cooper, 1998 .

Fabrication of Polymer Waveguides by Laser Ablation Using a 355 nm Wavelength Nd:YAG Laser

Kai Wang, P. P. Conway, D. A. Hutt, 2011, Journal of Lightwave Technology.

Megasonic agitation for enhanced electrodeposition of copper

C. Bailey, M. Desmulliez, D. Hutt, 2009 .

Static secondary ion mass spectrometry studies of self-assembled monolayers : electron beam degradation of alkanethiols on gold

D. Hutt, G. Leggett, 1999 .

Current leakage failure of conformally coated electronic assemblies

D. Hutt, D. Whalley, G. Dou, 2008, 2008 2nd Electronics System-Integration Technology Conference.

Surface modification of an ambient UV-cured dielectric to realise electrically conducting traces

Yee Mey Goh, D. Hutt, Changqing Liu, 2015 .

Glass as a Substrate for High Density Electrical Interconnect

P. Conway, D. Hutt, X. Cui, 2008, 2008 10th Electronics Packaging Technology Conference.

Modeling of the Power Cycling Performance of a Si on Si Flip Chip Assembly

D. Hutt, A. Al-Habaibeh, A. R. Ochana, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

Electrodeposition of Indium Bumps for Ultrafine Pitch Interconnection

D. Hutt, Changqing Liu, Yingtao Tian, 2014, Journal of Electronic Materials.

Electrical performance of isotropic conductive adhesives with copper and copper coated iron fillers

D. Hutt, D. Whalley, Junpeng Liu, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

Laser sintering and patterning of gallium-doped zinc oxide/indium-tin oxide nanoparticle films with tailorable electrical and optical properties

P. Conway, D. Hutt, J. Bowers, 2020 .

Processes for integration of microfluidic based devices

P. Conway, D. Hutt, C. Liu, 2009, 2009 European Microelectronics and Packaging Conference.

Electrical method of monitoring percolation and abrasion of conducting spheres due to shear flow of a dense suspension in a narrow gap

D. Hutt, D. Whalley, S. Mannan, 1999 .

Patterning Copper using Ink Jet Printing of Self Assembled Monolayers

D. Hutt, Changqing Liu, S. Ebbens, 2007, 2007 9th Electronics Packaging Technology Conference.

Investigation of ink-jet printing of self-assembled monolayers for copper circuit patterning

D. Hutt, Changqing Liu, S. Ebbens, 2006, 2006 8th Electronics Packaging Technology Conference.

Dispersion and microwave processing of nano-sized ITO powder for the fabrication of transparent conductive oxides

P. Conway, D. Hutt, I. Parkin, 2016 .

Three dimensional printed electronic devices realised by selective laser melting of copper/high-density-polyethylene powder mixtures

J. Tyrer, D. Hutt, Shuai Hou, 2018 .

Functionalised copper nanoparticles as catalysts for electroless plating

J. Graves, D. Hutt, A. Cobley, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

Copper conductive adhesives for printed circuit interconnects

D. Hutt, Changqing Liu, B. Vaidhyanathan, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

An Evaluation of the Electrical Stability of Copper Filled Isotropic Conductive Adhesives in High Moisture Environments

Shanda Wang, D. Hutt, D. Whalley, 2018, 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).

The Thermal Stability of Alkanethiol Self-Assembled Monolayers on Copper for Fluxless Soldering Applications

D. Hutt, Changqing Liu, S. Ebbens, 2010, IEEE Transactions on Components and Packaging Technologies.

Thermal Stability of Self-Assembled Monolayer Copper Preservatives for Fluxless Soldering

D. Hutt, Changqing Liu, S. Ebbens, 2006, 2006 1st Electronic Systemintegration Technology Conference.

Fluxless Soldering of Copper Substrates Using Self-Assembled Monolayers for Preservation

D. Hutt, Changqing Liu, 2006, IEEE Transactions on Components and Packaging Technologies.

Effect of temperature and storage environment on the preservation of copper surfaces for fluxless soldering

D. Hutt, Changqing Liu, S. Ebbens, 2006, 56th Electronic Components and Technology Conference 2006.

Integrated in‐plane mirror and multimode waveguide fabrication using 248 nm excimer laser ablation for optical interconnects on PCBs

David R. Selviah, P. Conway, D. Hutt, 2012 .

Electronic Interconnect � Printed Circuit Board � Manufacturing �

David R. Selviah, P. Conway, A. Walker, 2008 .

On-chip single cell funneling operated by microfabricated thermo-responsive hydrogel layers

Yang Liu, P. Conway, D. Hutt, 2015 .

Structural study of porous silicon

D. Hutt, Q. Zhang, S. Bayliss, 1995 .

Observations of solder paste reflow by means of electrical measurements

P. Conway, D. Hutt, D. Whalley, 2000, International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).

A novel flip‐chip interconnection process for integrated circuits

D. Hutt, D. Whalley, Changqing Liu, 2012 .

Metal-coated mono-sized polymer core particles for fine pitch flip-chip interconnects

D. Hutt, D. Whalley, Changqing Liu, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Optimisation of piezoelectric injection of dopants and drift gas modifiers in transverse ion mobility spectrometry

D. Hutt, I. Ratiu, J. Chappell, 2010 .

Growth of Ir overlayers on a Mo(110) surface

D. Hutt, D. Bassett, 1993 .

Integrated optical and electronic interconnect PCB manufacturing research

Ioannis Papakonstantinou, David J. Ives, Paul Conway, 2010 .

Innovative Optical and Electronic Interconnect Printed Circuit Board Manufacturing research

P.P. Conway, David R. Selviah, H. Suyal, 2008, 2008 2nd Electronics System-Integration Technology Conference.

Integrated optical and electronic interconnect printed circuit board manufacturing

Kai Wang, Paul Conway, David A. Hutt, 2008 .

Adhesion of Thermoplastics to Materials used in Electronics (Tin)

D. Hutt, D. P. Webb, H. Abhyankar, 2008, 2008 10th Electronics Packaging Technology Conference.

Damp‐heat induced degradation in photovoltaic modules manufactured with passivated emitter and rear contact solar cells

R. Gottschalg, T. Betts, D. Hutt, 2022, Progress in Photovoltaics: Research and Applications.

Evolution of microstructure and electrical conductivity of electroless copper deposits on a glass substrate

P. Conway, D. Hutt, X. Cui, 2012 .

Interfacial Reaction Between Molten Sn-Bi Based Solders and Electroless Ni-P Coatings for Liquid Solder Interconnects

C. Liu, P. Conway, D. Hutt, 2008, IEEE Transactions on Components and Packaging Technologies.

Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects

David A. Hutt, David C. Whalley, Michael Clode, 2006 .

Electroless Ni-W-P Alloys as Barrier Coatings for Liquid Solder Interconnects

D. Hutt, D. Whalley, C. Liu, 2006, 2006 1st Electronic Systemintegration Technology Conference.

Solder paste reflow modeling for flip chip assembly

P. Conway, C. Bailey, D. Hutt, 2000, Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).

Structural investigation of ordered Sb adsorption phases on Ag(111) using coaxial impact collision ion scattering spectroscopy

D. P. Woodruff, D. Hutt, T. Noakes, 1997 .

Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders

David A. Hutt, David C. Whalley, Michael Clode, 2007 .

A comparative study of the interfacial reaction between electroless Ni-P coatings and molten tin

D. Hutt, D. Whalley, Changqing Liu, 2008 .

Adsorption of Sb on Ag(111) studied using LEED, AES and XPS

D. Hutt, T. Noakes, C. McConville, 1994 .

The Evolution of Pd ∕ Sn Catalytic Surfaces in Electroless Copper Deposition

P. Conway, D. Hutt, D. Scurr, 2011 .

An investigation of electroless copper films deposited on glass

P. Conway, D. Hutt, X. Cui, 2008, 2008 2nd Electronics System-Integration Technology Conference.

Desorption of butanethiol from Au(111) during storage in ultrahigh vacuum: Effects on surface coverage and stability toward displacement by solution-phase thiols

D. Hutt, G. Leggett, 1997 .

Investigation of the Adhesion of Electroless Copper to Glass Substrates

P. Conway, D. Hutt, X. Cui, 2008 .

Copper Deposition and Patterning for Glass Substrate Manufacture

P. Conway, D. Hutt, K. Williams, 2007, 2007 9th Electronics Packaging Technology Conference.

Electroless nickel bumping of aluminum bondpads. I. Surface pretreatment and activation

Paul Conway, David A. Hutt, David C. Whalley, 2002 .

Electroless nickel bumping of aluminium bondpads. Part 1 - surface pre-treatment and activation

Paul Conway, David A. Hutt, David C. Whalley, 2002 .

Challenges in the Manufacture of Glass Substrates for Electrical and Optical Interconnect

P. Conway, D. Hutt, K. Williams, 2006, 2006 1st Electronic Systemintegration Technology Conference.

Electroless nickel bumping of aluminum bondpads. II. Electroless nickel plating

Paul Conway, David A. Hutt, David C. Whalley, 2002 .

Electrodeposition of indium for bump bonding

Changqing Liu, B. Stevens, D. Hutt, 2008, 2008 58th Electronic Components and Technology Conference.

Laser processing of printed copper interconnects on polymer substrates

J. Tyrer, D. Hutt, D. Whalley, 2016, 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).

Characterization of metal‐polymer interaction forces by AFM for insert molding applications

D. Hutt, G. West, D. P. Webb, 2020 .

Oxidation protection of copper surfaces using self-assembled monolayers of octadecanethiol

David A. Hutt, Changqing Liu, D. Hutt, 2005 .

A multi‐electrode array (MEA) biochip with excimer laser‐produced micro‐well features

Paul Conway, David A. Hutt, Divya Rajamohan, 2012 .

Fabrication of a novel Multi-Electrode Array (MEA) biochip using polyester insulated electrodes with microwell features for cardiomyocyte analysis

Olivia M Flaherty, Xiaoyun Cui, Divya Rajamohan, 2011, 18th European Microelectronics & Packaging Conference.

Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation

D. Flynn, M. Desmulliez, D. Hutt, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

Productionisation issues for commercialisation of microfluidic based devices

Paul Conway, D. P. Webb, Benedikt J. Knauf, 2009 .

Variation in the line stability of an inkjet printed optical waveguide-applicable material

J. Chappell, P. Conway, D. Hutt, 2008, 2008 2nd Electronics System-Integration Technology Conference.

INFLUENCE OF ADSORBATE ORDERING ON RATES OF UV PHOTOOXIDATION OF SELF-ASSEMBLED MONOLAYERS

David A. Hutt, Graham J. Leggett, D. Hutt, 1996 .

Fabrication of Cellular “Wires” on Micropatterned Monolayers of Short-Chain Alkanethiols on Gold

D. Hutt, G. Leggett, E. Cooper, 1996 .

Rates of attachment of fibroblasts to self-assembled monolayers formed by the adsorption of alkylthiols onto gold surfaces

D. Hutt, G. Leggett, E. Cooper, 1997 .

Conventional and microwave-assisted processing of Cu-loaded ICAs for electronic interconnect applications

D. Hutt, B. Vaidhyanathan, Siyuan Qi, 2013, Journal of Materials Science.

High density indium bumping using electrodeposition enhanced by megasonic agitation

D. Flynn, M. Desmulliez, D. Hutt, 2009, 2009 11th Electronics Packaging Technology Conference.

High density indium bumping through pulse plating used for pixel X-Ray detectors

D. Hutt, Changqing Liu, Yingtao Tian, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Megasonic enhanced wafer bumping process to enable high density electronics interconnection

M. Desmulliez, D. Hutt, Changqing Liu, 2008, 2008 2nd Electronics System-Integration Technology Conference.

Indium tin oxide nanowires manufactured via printing and laser irradiation

P. Conway, D. Engstrøm, D. Hutt, 2020 .

Aerosol-assisted fabrication of tin-doped indium oxide ceramic thin films from nanoparticle suspensions

P. Conway, D. Hutt, I. Parkin, 2016 .

Surface Micro-patterning with Self-assembled Monolayers Selectively Deposited on Copper Substrates by Ink-jet Printing

D. Hutt, Changqing Liu, S. Ebbens, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.