Hong Yang

Reliability Issues and Models of sub-90nm NAND Flash Memory Cells

Hong Yang, Hyunjae Kim, Sung-il Park, 2006, 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings.

Circuit Design And Reliability Of A Cmos Receiver

Hong Yang, 2004 .

Effect of gate oxide breakdown on RF device and circuit performance

Jinhong Yuan, Hong Yang, Enjun Xiao, 2003, 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual..

Soft breakdown on deep sub-micrometer RF nMOSFET performance

Hong Yang, A. Sadat, J. Yuan, 2003, The 11th IEEE International Symposium on Electron Devices for Microwave and Optoelectronic Applications, 2003. EDMO 2003..

Design for Reliability in Flip Chip Applications

Hong Yang, J. Leal, P. Neathway, 1999 .

Creep deformation of 96.5Sn-3.5Ag solder joints in a flip chip package

Hong Yang, K. Murty, P. Magill, 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

Precision glass molding technology for low Tg glasses

Feng Zhang, Hong Yang, Yunlong Zhang, 2017, Other Conferences.

Integrating Semiconductor Device Characterisation and Reliability into Electrical Engineering Education

Hong Yang, Jiann S. Yuan, Hong Yang, 2006 .

Voltage stress-induced performance degradation in NMOSFET mixer

Hong Yang, J. S. Yuan, Chuanzhao Yu, 2005, IEICE Electron. Express.

A Unified Physical BTI Compact Model in Variability-Aware DTCO Flow: Device Characterization and Circuit Evaluation on Reliability of Scaling Technology Nodes

Ming Liu, F. Schanovsky, Hong Yang, 2021, Symposium on VLSI Technology.

Effect of gate-oxide breakdown on RF performance

Yi Liu, Jinhong Yuan, Hong Yang, 2003 .