R. Kang

发表

Topology optimization-based lightweight primary mirror design of a large-aperture space telescope.

Shutian Liu, Quhao Li, Rui Hu, 2014, Applied optics.

A novel approach of mechanical chemical grinding

R. Kang, D. Guo, Zhenyu Zhang, 2017 .

Rotary ultrasonic machining of potassium dihydrogen phosphate (KDP) crystal: An experimental investigation on surface roughness

Hang Gao, Z. J. Pei, Renke Kang, 2009 .

Precision Fabrication of Thin Copper Substrate by Double-sided Lapping and Chemical Mechanical Polishing

R. Kang, Jiang Guo, J. Kong, 2019, Journal of Manufacturing Processes.

Simulated and experimental study on the ultrasonic cutting mechanism of aluminum honeycomb by disc cutter

Z. Dong, R. Kang, Sun Jiansong, 2021 .

A novel approach of high speed scratching on silicon wafers at nanoscale depths of cut

R. Kang, D. Guo, Zhenyu Zhang, 2015, Scientific Reports.

Direct laser fabrication of aluminum-alloy slot antenna array

R. Kang, D. Guo, W. Xu, 2006, 2006 1st International Symposium on Systems and Control in Aerospace and Astronautics.

Energy-Mode Adjustment in Laser Processing a Small Vitrified CBN Grinding Wheel

R. Kang, Jun Wang, X. Wang, 2005 .

Al2O3-ZrO2 eutectic ceramic via ultrasonic-assisted laser engineered net shaping

R. Kang, Guang-yi Ma, Dongjiang Wu, 2017 .

A Novel Ultrasonic Trepanning Method for Nomex Honeycomb Core

Z. Dong, R. Kang, Yidan Wang, 2020, Applied Sciences.

Analytical Elastic–Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer

P. Zhou, R. Kang, D. Guo, 2018, Journal of Manufacturing Science and Engineering.

Novel rotating-vibrating magnetic abrasive polishing method for double-layered internal surface finishing

Kui Liu, R. Kang, Hirofumi Suzuki, 2019, Journal of Materials Processing Technology.

Milling Force and Machining Deformation in Mirror Milling of Aircraft Skin

Zhao Li, Renke Kang, Zhigang Dong, 2016 .

Photochemically combined mechanical polishing of N-type gallium nitride wafer in high efficiency

Z. Dong, R. Kang, D. Guo, 2019, Precision Engineering.

Photoelectrochemically combined mechanical polishing of n-type gallium nitride wafer by using metal nanoparticles as photocathodes

Z. Dong, R. Kang, D. Guo, 2019, The International Journal of Advanced Manufacturing Technology.

A mixed elastohydrodynamic lubrication model for simulation of chemical mechanical polishing with double-layer structure of polishing pad

P. Zhou, Z. Dong, R. Kang, 2015 .

Investigation on Material Removal Rate in Rotation Grinding for Large-Scale Silicon Wafer

Jian Xiu Su, Zhuji Jin, Renke Kang, 2004 .

A theoretical and experimental investigation on ultrasonic assisted grinding from the single-grain aspect

Z. Dong, R. Kang, Jiang Guo, 2018, International Journal of Mechanical Sciences.

Study on the Subsurface Damages of Glass Fiber Reinforced Composites

Z. Dong, R. Kang, F. J. Ma, 2013 .

Formation mechanism and process optimization of nano Al2O3-ZrO2 eutectic ceramic via laser engineered net shaping (LENS)

R. Kang, D. Guo, Guang-yi Ma, 2017 .

Physically-based modeling of pad-asperity scale chemical-mechanical synergy in chemical mechanical polishing

P. Zhou, R. Kang, D. Guo, 2019, Tribology International.

Effects of tool edge radius on chip formation during the micromachining of pure iron

R. Kang, D. Guo, Jiang Guo, 2020, The International Journal of Advanced Manufacturing Technology.

Study into grinding force in back grinding of wafer with outer rim

Z. Dong, R. Kang, Shang Gao, 2020, Advances in Manufacturing.

Elastic recovery of monocrystalline silicon during ultra-fine rotational grinding

P. Zhou, R. Kang, D. Guo, 2020 .

Grinding Marks in Back Grinding of Wafer with Outer Rim

Z. Dong, R. Kang, Shanglin Gao, 2020 .

Nanogrinding induced surface and deformation mechanism of single crystal β-Ga 2 O 3

R. Kang, Han Huang, Shang Gao, 2018, Materials Science in Semiconductor Processing.

Design and evaluation of soft abrasive grinding wheels for silicon wafers

Z. Dong, R. Kang, D. Guo, 2013 .

Effect of Strain Rate on the Deformation Characteristic of AlN Ceramics under Scratching

Z. Dong, R. Kang, Shang Gao, 2021, Micromachines.

Study on the subsurface damage mechanism of optical quartz glass during single grain scratching

R. Kang, D. Guo, Xichun Luo, 2020 .

A THRESHOLD MODEL FOR LASER CLEANING OF LARGER SILICON WAFERS

R. Kang, Jun Wang, D. Guo, 2011 .

Solid-state phase transformation-induced residual stress in selective laser melting of martensitic stainless steel

Jun Yu Li, R. Kang, Q. Bai, 2022, The International Journal of Advanced Manufacturing Technology.

Nanogrinding of SiC wafers with high flatness and low subsurface damage

F. Huo, R. Kang, D. Guo, 2012 .

The Characteristics of Surface Residual Stresses by Plane Grinding Invar and the Effects of Them on Structural Stability

R. Kang, D. Guo, Y. Qiao, 2008 .

Recent progress of residual stress measurement methods: A review

R. Kang, Jiang Guo, Bo Pan, 2019 .

Effect of surface cleaning on interface bonding performance for 316H stainless steel joints manufactured by additive forging

R. Kang, Zhaocheng Wei, Jiang Guo, 2021 .

Composition-Optimized Cu-Zn-(Mn, Fe, Si) Alloy and Its Microstructural Evolution with Thermomechanical Treatments

C. Dong, Z. Dong, R. Kang, 2021, Journal of Materials Engineering and Performance.

Novel localized vibration-assisted magnetic abrasive polishing method using loose abrasives for V-groove and Fresnel optics finishing.

R. Kang, D. Guo, Jiang Guo, 2018, Optics express.

Determination of the Grinding Area and Allowance in the Radome Grinding

R. Kang, D. Guo, M. J. Liu, 2003 .

A novel method for workpiece deformation prediction by amending initial residual stress based on SVR-GA

R. Kang, Jiang Guo, Bin Wang, 2021, Advances in Manufacturing.

Microstructural evolution of soft magnetic 49Fe-49Co-2V alloy induced by drilling

Z. Dong, R. Kang, D. Guo, 2020 .

Study of Grinding Wheel for Polishing Diamond by Dynamic Friction Polishing

P. Zhou, R. Kang, Xiaoguang Guo, 2014 .

Smooth particle hydrodynamics modeling of cutting force in milling process of TC4

Z. Dong, R. Kang, Ming Li, 2019, Advances in Manufacturing.

Influence of Grinding to the Surface and Subsurface Quality of KDP Crystal

R. Kang, Hang Gao, Dongjiang Wu, 2008 .

Investigation on the Gallium Nitride Polishing Process Under Hybrid-Field Effects

Z. Dong, R. Kang, D. Guo, 2020, 2020 China Semiconductor Technology International Conference (CSTIC).

A Novel Method of Blade-Inclined Ultrasonic Cutting Nomex Honeycomb Core With Straight Blade

Z. Dong, R. Kang, Xuanping Wang, 2021 .

Detection of honeycomb cell walls from measurement data based on Harris corner detection algorithm

Z. Dong, R. Kang, B. Ayinde, 2018 .

Modelling of surface roughness in elliptical vibration cutting of ductile materials

Zhenhua Jiao, Jiang Guo, R. Kang, 2022, Precision Engineering.

Ultrahigh hardness and improved ductility for nanotwinned mercury cadmium telluride

R. Kang, Zhenyu Zhang, G. Ma, 2013 .

Residual stress analysis on silicon wafer surface layers induced by ultra-precision grinding

R. Kang, W. Gao, Yinxia Zhang, 2011 .

Atomistic mechanisms of chemical mechanical polishing of diamond (1 0 0) in aqueous H2O2/pure H2O: Molecular dynamics simulations using reactive force field (ReaxFF)

R. Kang, Xiaoguang Guo, Zhuji Jin, 2019, Computational Materials Science.

Nanomechanical behaviors of (110) and (111) CdZnTe crystals investigated by nanoindentation

R. Kang, Hang Gao, Yan Li, 2009 .

Nano-sized Al 2 O 3 -ZrO 2 eutectic ceramic structures prepared by ultrasonic-assisted laser engineered net shaping

R. Kang, D. Guo, Guang-yi Ma, 2018 .

Mechanical Load-Induced Atomic-Scale Deformation Evolution and Mechanism of SiC Polytypes Using Molecular Dynamics Simulation

R. Kang, Shang Gao, Xiaoguang Guo, 2022, Nanomaterials.

Atomistic observations on the structure evolution of glass-ceramics induced by the cascade collisions

R. Kang, D. Guo, Shuohua Zhang, 2021 .

Modeling the heterogeneity response induced by the cascade collisions of glass-ceramics

R. Kang, D. Guo, Shuohua Zhang, 2021 .

Insight into the roles of the glassy phase in glass-ceramics during the cascade collisions

R. Kang, D. Guo, Ming Li, 2021 .

Study on subsurface layer of nano-cutting single crystal tungsten in different crystal orientations

Z. Dong, R. Kang, Wenhao Du, 2020 .

Study on chemical effects of H2O2 and glycine in the Copper CMP process using ReaxFF MD

R. Kang, Jiang Guo, Xiaoguang Guo, 2020, Applied Surface Science.

Sub-nanoscale polishing of single crystal diamond(100) and the chemical behavior of nanoparticles during the polishing process

R. Kang, D. Guo, Xiaoguang Guo, 2019 .

Optical characterization of hydrogen-free CeO2 doped DLC films deposited by unbalanced magnetron sputtering

R. Kang, Hang Gao, D. Guo, 2008 .

Optical properties of La2O3 doped diamond-like carbon films

Zhenyuan Jia, F. Huo, R. Kang, 2008 .

A New High-Efficiency and Low-Damage Polishing Process of HgCdTe Wafer

R. Kang, Hang Gao, Yan Li, 2012 .

An empirical equation for prediction of silicon wafer deformation

Z. Dong, R. Kang, Bi Zhang, 2017 .

Effect of Fiber Type and Content on Mechanical Property and Lapping Machinability of Fiber-Reinforced Polyetheretherketone

R. Kang, Shang Gao, Honggang Li, 2022, Polymers.

Nanoscale Wear Layers on Silicon Wafers Induced by Mechanical Chemical Grinding

R. Kang, D. Guo, Zhenyu Zhang, 2017, Tribology Letters.

Insights into the surface oxidation modification mechanism of nano-diamond: An atomistic understanding from ReaxFF simulations

R. Kang, D. Guo, Xiaoguang Guo, 2021 .

Polishing of Free-Standing CVD Diamond Films by the Combination of EDM and CMP

R. Kang, B. Dong, Zhuji Jin, 2008 .

Atomistic mechanisms of Cu CMP in aqueous H2O2: Molecular dynamics simulations using ReaxFF reactive force field

R. Kang, Xiaoguang Guo, Zhuji Jin, 2018, Computational Materials Science.

Smoothed-Particle Hydrodynamics Investigation on Brittle–Ductile Transition of Quartz Glass in Single-Grain Grinding Process

R. Kang, D. Guo, Xichun Luo, 2020, Nanomanufacturing and Metrology.

Effect of amplitude ratios on hole quality in longitudinal–torsional coupled ultrasonic-assisted drilling of CFRP composites

Z. Dong, R. Kang, Yidan Wang, 2022, The International Journal of Advanced Manufacturing Technology.

Mechanical model of thrust force and torque in longitudinal-torsional coupled ultrasonic-assisted drilling of CFRP

Z. Dong, R. Kang, Yan Bao, 2021, The International Journal of Advanced Manufacturing Technology.

Hole quality in longitudinal–torsional coupled ultrasonic vibration assisted drilling of carbon fiber reinforced plastics

Z. Dong, R. Kang, D. Guo, 2020, Frontiers of Mechanical Engineering.

Mechanical modeling of ultrasonic vibration helical grinding of SiCf/SiC composites

Z. Dong, R. Kang, Yan Bao, 2022, International Journal of Mechanical Sciences.

Theoretical Analysis of Grinding Temperature Field for Carbon Fiber Reinforced Plastics

R. Kang, Hang Gao, He Ma, 2010 .

An Improved Cutting Force Model for Ultrasonically Assisted Grinding of Hard and Brittle Materials

Z. Dong, R. Kang, Yan Bao, 2021, Applied Sciences.

Subsurface crystal lattice deformation machined by ultraprecision grinding of soft-brittle CdZnTe crystals

R. Kang, Hang Gao, D. Guo, 2010 .

Nanoscale machinability and subsurface damage machined by CMP of soft-brittle CdZnTe crystals

R. Kang, Hang Gao, D. Guo, 2010 .

Chemical mechanical polishing and nanomechanics of semiconductor CdZnTe single crystals

R. Kang, Hang Gao, D. Guo, 2008 .

A novel approach of chemical mechanical polishing using environment-friendly slurry for mercury cadmium telluride semiconductors

P. Zhou, R. Kang, D. Guo, 2016, Scientific Reports.

Surface morphologies and corresponding hardness evolution during nanoscratching

R. Kang, D. Guo, Shuohua Zhang, 2020, Journal of Materials Research and Technology.

Surface integrity and removal mechanism in grinding sapphire wafers with novel vitrified bond diamond plates

Z. Dong, R. Kang, Ziguang Wang, 2017 .

Rotary Ultrasonic Machining of Potassium Dihydrogen Phosphate (KDP) crystal: an experimental investigation

Hang Gao, Z. J. Pei, Renke Kang, 2009 .

Investigation on Properties of Magnesia Grinding Wheels Used in Silicon Wafer Grinding

Z. Dong, R. Kang, Shang Gao, 2014 .

Effects of pressure and slurry on removal mechanism during the chemical mechanical polishing of quartz glass using ReaxFF MD

R. Kang, D. Guo, Xiaoguang Guo, 2020 .

Effect of surface hydroxylation on ultra-precision machining of quartz glass

R. Kang, D. Guo, Xiaoguang Guo, 2020 .

Study on Adhesion Removal Model in CMP SiO2 ILD

R. Kang, D. Guo, Zhuji Jin, 2008 .

Electroforming of Copper/ZrB2 Composites Coatings and Its Performance as Electro-Discharge Machining Electrodes

R. Kang, D. Guo, Zhuji Jin, 2005 .

Unusual stress behaviour of La2O3- and CeO2-doped diamond-like carbon nanofilms

R. Kang, Hang Gao, D. Guo, 2008 .

Microstructure and tribological properties of LaxCeyO1 − x − y composite nanofilms

Zhenyuan Jia, R. Kang, Hang Gao, 2008 .

Multipoint support technology for mirror milling of aircraft skins

Yan Bao, Dongming Guo, Renke Kang, 2018 .

Effects of grinding speeds on the subsurface damage of single crystal silicon based on molecular dynamics simulations

R. Kang, D. Guo, Ming Li, 2021, Applied Surface Science.

Study of mechanical properties and subsurface damage of quartz glass at high temperature based on MD simulation

R. Kang, Xiaoguang Guo, Zhuji Jin, 2019, Journal of Micromechanics and Molecular Physics.

A mixed elastohydrodynamic lubrication model with layered elastic theory for simulation of chemical mechanical polishing

P. Zhou, R. Kang, D. Guo, 2013 .

Surface damage characteristics of AlN ceramics induced by ultra-precision grinding

R. Kang, Shang Gao, Xianglong Zhu, 2022, Materials and Manufacturing Processes.

Microstructure characterization of W-Ni-Fe heavy alloys with optimized metallographic preparation method

Zhenhua Jiao, Z. Dong, R. Kang, 2019, International Journal of Refractory Metals and Hard Materials.

Effects of tool geometry on tungsten removal behavior during nano-cutting

Z. Dong, R. Kang, Yan Bao, 2022, International Journal of Mechanical Sciences.

An investigation of the onset of elastoplastic deformation during nanoindentation in MgO single crystal (001) and (110) planes

Z. Dong, R. Kang, Han Huang, 2010 .

Study on tool wear mechanism of single-crystal diamond in ultrasonic vibration elliptical cutting of tungsten heavy alloy

Z. Dong, R. Kang, Yan Bao, 2022, Wear.

Study using ReaxFF-MD on the CMP process of fused glass in pure H2O/aqueous H2O2

R. Kang, D. Guo, Xiaoguang Guo, 2021 .

Numerical studies on scavenging reaction in confined etchant layer technique (CELT)

P. Zhou, R. Kang, D. Guo, 2013 .

Two-Step Electrochemical Mechanical Polishing of Pure Copper

R. Kang, Jiang Guo, Bo Pan, 2019, ECS Journal of Solid State Science and Technology.

Chemical–mechanical wear of monocrystalline silicon by a single pad asperity

P. Zhou, R. Kang, D. Guo, 2017 .

Influence mechanism of defects on the subsurface damage and structural evolution of diamond in CMP process

R. Kang, D. Guo, Shuohua Zhang, 2021 .

Atomistic understanding of interfacial processing mechanism of silicon in water environment: A ReaxFF molecular dynamics simulation

R. Kang, D. Guo, Ming Li, 2021, Frontiers of Mechanical Engineering.

Effects of pressure and velocity on the interface friction behavior of diamond utilizing ReaxFF simulations

A. V. Duin, Jiang Guo, R. Kang, 2021 .

Insight into the mechanism of low friction and wear during the chemical mechanical polishing process of diamond: A reactive molecular dynamics simulation

R. Kang, D. Guo, Xiaoguang Guo, 2020 .

Diamond nanoscale surface processing and tribochemical wear mechanism

R. Kang, D. Guo, Xiaoguang Guo, 2019, Diamond and Related Materials.

Design Optimization Method for Additive Manufacturing of the Primary Mirror of a Large-Aperture Space Telescope

Rui Hu, Shutian Liu, Ping Zhou, 2017 .

Effects of minimum uncut chip thickness on tungsten nano-cutting mechanism

Z. Dong, R. Kang, Yan Bao, 2022, International Journal of Mechanical Sciences.

On-line prediction of ultrasonic elliptical vibration cutting surface roughness of tungsten heavy alloy based on deep learning

Z. Dong, R. Kang, Wenhao Du, 2020, Journal of Intelligent Manufacturing.

Effect of Fiber Type and Content on Surface Quality and Removal Mechanism of Fiber-Reinforced Polyetheretherketone in Ultra-Precision Grinding

R. Kang, Shang Gao, Jiani Guo, 2022, Polymers.

Electrogenerated chemical polishing of copper

P. Zhou, R. Kang, D. Guo, 2015 .

Laser ablation of RB-SiC composite by femtosecond laser irradiation

Z. Dong, R. Kang, G. Ma, 2023, Optik.

Warping of silicon wafers subjected to back-grinding process

Dongming Guo, Renke Kang, Zhigang Dong, 2015 .

Study on influence of grinding depth and grain shape on grinding damage of K9 glass by SPH simulation

R. Kang, D. Guo, Xiaoguang Guo, 2020 .

Warping model of high-power IGBT modules subjected to reflow soldering process

R. Kang, Shang Gao, Rongliang Wang, 2023, International Journal of Mechanical Sciences.

Implementation strategies for high accuracy grinding of hydrodynamic seal ring with wavy face for reactor coolant pumps

R. Kang, Dongming Guo, Zhuji Jin, 2013, Science China Technological Sciences.

Implementation strategies for high accuracy grinding of hydrodynamic seal ring with wavy face for reactor coolant pumps

DongMing Guo, Guang Feng, FengWei Huo, 2013 .

Characterization of microstructural stability for nanotwinned mercury cadmium telluride under cyclic nanoindentations

R. Kang, Zhenyu Zhang, G. Ma, 2013 .

Ultrasonic assisted grinding force model considering anisotropy of SiCf/SiC composites

Z. Dong, R. Kang, Yan Bao, 2023, International Journal of Mechanical Sciences.

Comparison of surface integrity for dry and wet drilling of 49Fe-49Co-2V alloy

Z. Dong, R. Kang, D. Guo, 2021, Chinese Journal of Aeronautics.

A novel reverse helical milling process for reducing push-out delamination of CFRP

Z. Dong, R. Kang, Shang Gao, 2020 .

Effects of cutting force on formation of subsurface damage during nano-cutting of single crystal tungsten

Z. Dong, R. Kang, Yan Bao, 2022, Journal of Manufacturing Science and Engineering.

Characterization of material removal in ultrasonically assisted grinding of SiCp/Al with high volume fraction

Z. Dong, R. Kang, Zhiqiang Liu, 2017 .

Molecular simulation of the plastic deformation and crack formation in single grit grinding of 4H-SiC single crystal

R. Kang, Shang Gao, Han Huang, 2023, International Journal of Mechanical Sciences.

Grinding and Lapping Induced Surface Integrity of Silicon Wafers and its Effect on Chemical Mechanical Polishing

R. Kang, Shang Gao, Honggang Li, 2022, SSRN Electronic Journal.

Effects of ultrasonic vibration cutting trajectories on chip formation of tungsten alloys

Z. Dong, R. Kang, Qingxuan Zhao, 2023, Journal of Manufacturing Processes.

Effect of grain size on subsurface characterization of pure iron subjected to orthogonal cutting

R. Kang, Q. Bai, Jingang Tang, 2022, The International Journal of Advanced Manufacturing Technology.

Robust cell wall recognition of laser measured honeycomb cores based on corner type identification

Z. Dong, R. Kang, Sun Jiansong, 2021 .

Optimization of support location in mirror-milling of aircraft skins

Bi Zhang, Yan Bao, Dongming Guo, 2018 .

A novel approach of chemical mechanical polishing for cadmium zinc telluride wafers

P. Zhou, R. Kang, D. Guo, 2016, Scientific Reports.

A pad roughness model for the analysis of lubrication in the chemical mechanical polishing of a silicon wafer

R. Kang, D. Guo, Zhuji Jin, 2007 .

A new polishing method for complex structural parts: moist particle electrolyte electrochemical mechanical polishing (MPE-ECMP)

Z. Dong, R. Kang, Shang Gao, 2023, Electrochemistry Communications.

Investigation on flatness and surface integrity of pure copper processed by electrochemical mechanical polishing

R. Kang, Jiang Guo, Di Wu, 2020 .

On the reaction mechanism of a hydroxyethylidene diphosphonic acid-based electrolyte for electrochemical mechanical polishing of copper

R. Kang, Jiang Guo, Di Wu, 2019, Electrochemistry Communications.

Preparation of Flat and Smooth Copper Surface by Jet Electrochemical Machining and Electrochemical Polishing

P. Zhou, R. Kang, D. Guo, 2020 .

Analysis of the polishing ability of electrogenerated chemical polishing

P. Zhou, R. Kang, D. Guo, 2017 .

A novel method for micro-gap control in electrogenerated chemical polishing

P. Zhou, R. Kang, D. Guo, 2015 .

A mixed elastohydrodynamic lubrication model with layered elastic theory for simulation of chemical mechanical polishing

R. Kang, D. Guo, Zhuji Jin, 2013, The International Journal of Advanced Manufacturing Technology.

Tribochemical polishing CVD diamond film with FeNiCr alloy polishing plate prepared by MA-HPS technique

R. Kang, Q. Wen, Zhuji Jin, 2012 .

Theoretical and experimental investigation of chemical mechanical polishing of W–Ni–Fe alloy

R. Kang, Jiang Guo, Hailong Cui, 2021, International Journal of Extreme Manufacturing.

Photoelectrochemical mechanical polishing method for n-type gallium nitride

Z. Dong, R. Kang, D. Guo, 2019, CIRP Annals.

Pulse Plating of Copper-ZrB2 Composite Coatings

R. Kang, D. Guo, Zhuji Jin, 2009 .

Elimination of surface scratch/texture on the surface of single crystal Si substrate in chemo-mechanical grinding (CMG) process

Jun Shimizu, Libo Zhou, Renke Kang, 2009 .

Removal of scratch on the surface of MgO single crystal substrate in chemical mechanical polishing process

R. Kang, Jun Wang, D. Guo, 2008 .

Equivalent mechanical model of resin-coated aramid paper of Nomex honeycomb

Z. Dong, R. Kang, Yidan Wang, 2022, International Journal of Mechanical Sciences.

Study on influence of grinding depth and grain shape on grinding damage of K9 glass by SPH simulation

R. Kang, D. Guo, Xiaoguang Guo, 2019, The International Journal of Advanced Manufacturing Technology.

Mechanism of Crack Propagation for K9 Glass

R. Kang, Xichun Luo, Zhipeng Li, 2019, International Journal of Precision Engineering and Manufacturing.

Mechanism of Crack Propagation for K9 Glass

R. Kang, Xichun Luo, Zhipeng Li, 2019, International Journal of Precision Engineering and Manufacturing.

Simulation and experimental study of ultrasonic cutting for aluminum honeycomb by disc cutter.

Z. Dong, R. Kang, Xuanping Wang, 2020, Ultrasonics.

Damage mechanisms during lapping and mechanical polishing CdZnTe wafers

Hang Gao, Yan Li, Dongjiang Wu, 2010 .

Nanocutting Process of CdZnTe Single Crystals

R. Kang, Hang Gao, D. Guo, 2009 .

Characterization of material removal in ultrasonically assisted grinding of SiCp/Al with high volume fraction

Z. Dong, R. Kang, Zhiqiang Liu, 2017, The International Journal of Advanced Manufacturing Technology.

Development and Optimization of Ultrasonic Elliptical Vibration Cutting Device Based on Single Excitation

Z. Dong, R. Kang, Wenhao Du, 2021 .

Investigation on Magnetorheological Finishing of thin Copper Substrate

R. Kang, Jiang Guo, Bin Wang, 2020 .

Recent progress in flexible supporting technology for aerospace thin-walled parts: A review

Yan BAO, Bin WANG, Zengxu HE, 2021 .

Material removal characteristics of precorroded Lu2O3 laser crystals and elastic deformation model during nanoscratch process

R. Kang, D. Guo, Shuohua Zhang, 2020 .

Surface Layer Damage of Silicon Wafers Sliced by Wire Saw Process

Z. Dong, R. Kang, Shang Gao, 2013 .

Changes in surface layer of silicon wafers from diamond scratching

Bo Wang, Dongming Guo, Renke Kang, 2015 .

A novel approach of high-performance grinding using developed diamond wheels

Bo Wang, Dongming Guo, Qian Bai, 2017 .

Mechanism of gradient strengthening layer formation based on microstructure and microhardness of Inconel 718 grinding surface

Yuan Zhang, Z. Dong, R. Kang, 2021, The International Journal of Advanced Manufacturing Technology.

Study on Adhesion Properties and Process Parameters of Electroless Deposited Ni-P Alloy for PEEK and Its Modified Materials

R. Kang, Shang Gao, Jirui Cheng, 2023, Coatings.

Generation and removal of pits during chemical mechanical polishing process for MgO single crystal substrate

R. Kang, D. Guo, Yuzhuo Li, 2010 .

An Experimental Study of the Polishing Process for MgO Single Crystal Substrate

R. Kang, Zhuji Jin, Ke Wang, 2007 .

Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a newly developed soft abrasive grinding wheel

R. Kang, Han Huang, Shang Gao, 2017 .

A novel approach of high-performance grinding using developed diamond wheels

R. Kang, D. Guo, Zhenyu Zhang, 2017, The International Journal of Advanced Manufacturing Technology.

Nanoscale solely amorphous layer in silicon wafers induced by a newly developed diamond wheel

R. Kang, D. Guo, Zhenyu Zhang, 2016, Scientific Reports.

Surface integrity and removal mechanism of chemical mechanical grinding of silicon wafers using a newly developed wheel

Z. Dong, R. Kang, Han Huang, 2016 .

Surface integrity and removal mechanism of chemical mechanical grinding of silicon wafers using a newly developed wheel

Z. Dong, R. Kang, Shang Gao, 2015, The International Journal of Advanced Manufacturing Technology.

Grinding Performance Evaluation of the Developed Chemo-Mechanical Grinding (CMG) Tools for Sapphire Substrate

P. Zhou, Z. Dong, R. Kang, 2012 .

Study on Grinding Performance of Soft Abrasive Wheel for Silicon Wafer

R. Kang, Shang Gao, D. Guo, 2009 .

Finishing of rectangular microfeatures by localized vibration-assisted magnetic abrasive polishing method

R. Kang, Jiang Guo, Wenhe Feng, 2020 .

Effects of tool edge radius on chip formation during the micromachining of pure iron

Y. Li, R. Kang, D. Guo, 2020, The International Journal of Advanced Manufacturing Technology.

Advances in molecular dynamics simulation of ultra-precision machining of hard and brittle materials

R. Kang, Dongming Guo, Xiaoguang Guo, 2017, Frontiers of Mechanical Engineering.

Ultra-Precision Machining Technology of the Soft and Brittle Functional Crystal

R. Kang, Hang Gao, C. Lu, 2008 .

Deformation and fracture behaviors of monocrystalline β-Ga2O3 characterized using indentation method and first-principles calculations

R. Kang, Shang Gao, Xiaoguang Guo, 2023, Materials Characterization.

Development Research of Science and Technologies in Ultra-precision Machining Field

Julong Yuan, Hui Yang, Yifan Dai, 2010 .

Microstructure evolution mechanism of tungsten induced by ultrasonic elliptical vibration cutting at atomic/nano scale

Z. Dong, R. Kang, Yan Bao, 2023, International Journal of Mechanical Sciences.

Molecular dynamics study on the thickness of damage layer in multiple grinding of monocrystalline silicon

R. Kang, Xiaoguang Guo, Zhuji Jin, 2016 .

Sensitivity analysis of the surface integrity of monocrystalline silicon to grinding speed with same grain depth-of-cut

P. Zhou, R. Kang, D. Guo, 2020 .

A load identification method for the grinding damage induced stress (GDIS) distribution in silicon wafers

Ping Zhou, Dongming Guo, Renke Kang, 2016 .

Study on the transformation and control mechanism of amorphous damage during the grinding process of monocrystalline silicon considering grain shapes by MD method

R. Kang, D. Guo, Ming Li, 2023, Tribology International.

Subsurface damage pattern and formation mechanism of monocrystalline β-Ga2O3 in grinding process

R. Kang, Shang Gao, Xin Yang, 2022, Frontiers of Mechanical Engineering.

Anisotropic Damage Mechanism during Grinding of CdZnTe Wafers

R. Kang, Hang Gao, Yan Li, 2010 .

Model for surface topography prediction in mirror-milling of aircraft skin parts

Z. Dong, R. Kang, D. Guo, 2018 .

Effects of inclination angles of disc cutter on machining quality of Nomex honeycomb core in ultrasonic cutting

Z. Dong, R. Kang, Yidan Wang, 2021, Frontiers of Mechanical Engineering.

Study on Characteristics of Tool Wear and Breakage of Ultrasonic Cutting Nomex Honeycomb Core with the Disc Cutter

Z. Dong, R. Kang, Yidan Wang, 2023, Applied Sciences.

Postprocessor development for ultrasonic cutting of honeycomb core curved surface with a straight blade

Z. Dong, R. Kang, Zhaocheng Wei, 2023, Frontiers of Mechanical Engineering.

Burr removal from measurement data of honeycomb core surface based on dimensionality reduction and regression analysis

Z. Dong, R. Kang, Yidan Wang, 2018, Measurement Science and Technology.

Study on subsurface damage mechanism of gallium nitride in nano-grinding

Z. Dong, R. Kang, D. Guo, 2021, Materials Science in Semiconductor Processing.

Elliptical vibration cutting of large-size thin-walled curved surface parts of pure iron by using diamond tool with active cutting edge shift

Zhenhua Jiao, R. Kang, Jiang Guo, 2022, Chinese Journal of Aeronautics.

Experimental Study on Ultrasonic Assisted Turning of GH4068 Superalloy

Z. Dong, R. Kang, Zhaocheng Wei, 2023, Materials.

Advances in molecular dynamics simulation of ultra-precision machining of hard and brittle materials

Dongming Guo, Xiaoguang Guo, Zhuji Jin, 2017 .

Effect of direct current and pulse plating on the EDM performance of copper-zirconium diboride composites

R. Kang, D. Guo, Zhuji Jin, 2007 .

Atomistic understanding of the subsurface damage mechanism of silicon (100) during the secondary nano-scratching processing

R. Kang, Xiaoguang Guo, Lemin Zhang, 2022, Materials Science in Semiconductor Processing.

Effect of Mechanical Anisotropy on Grinding of CdZnTe Wafers

R. Kang, Hang Gao, Yan Li, 2010 .

Analysis of material removal behavior in ultrasonically assisted scratching of RB-SiC from energy aspects

Z. Dong, R. Kang, Bi Zhang, 2018, The International Journal of Advanced Manufacturing Technology.

Analysis of material removal behavior in ultrasonically assisted scratching of RB-SiC from energy aspects

Z. Dong, R. Kang, Bi Zhang, 2018, The International Journal of Advanced Manufacturing Technology.

Photoelectrochemically combined mechanical polishing of n-type gallium nitride wafer by using metal nanoparticles as photocathodes

Z. Dong, R. Kang, K. Shi, 2019, The International Journal of Advanced Manufacturing Technology.

Effects of kinematic forms on material removal rate and non-uniformity in chemical mechanical planarisation

R. Kang, C. L. Wang, Z. Jin, 2008 .

The mechanical properties of the scratched surface for silica glass by molecular dynamics simulation

R. Kang, Xiaoguang Guo, Zhuji Jin, 2015 .

Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers

F. Huo, R. Kang, D. Guo, 2013 .

Atomic understanding of elastic-plastic deformation and crack evolution for single crystal AlN during nanoscratch

R. Kang, Shang Gao, Xiaoguang Guo, 2023, Ceramics International.

Edge chipping of silicon wafers in diamond grinding

Renke Kang, Zhigang Dong, Z. Dong, 2013 .

An online monitoring methodology for grinding state identification based on real-time signal of CNC grinding machine

Gang Li, Z. Dong, R. Kang, 2023, Mechanical Systems and Signal Processing.

Polishing tool with phyllotactic distributed through-holes for photochemically combined mechanical polishing of N-type gallium nitride wafers

Z. Dong, R. Kang, D. Guo, 2020 .

A fast self-calibration method of line laser sensors for on-machine measurement of honeycomb cores

Z. Dong, R. Kang, Yidan Wang, 2022, Optics and lasers in engineering.

High surface integrity fabrication of silicon wafers using a newly developed nonwoven structured grind-polishing wheel

R. Kang, Shang Gao, Yu Zhang, 2022, Journal of Manufacturing Processes.

A Form Error Evaluation Method of Honeycomb Core Surfaces

Z. Dong, R. Kang, Yidan Wang, 2022, SSRN Electronic Journal.

Atomistic understanding of rough surface on the interfacial friction behavior during the chemical mechanical polishing process of diamond

R. Kang, Shang Gao, Xiaoguang Guo, 2023, Friction.

Atomic Understanding of the Plastic Deformation Mechanism of 4H-SiC Under Different Grain Depth-of-cut During Nano-Grinding

R. Kang, Shang Gao, Xiaoguang Guo, 2023, Journal of Electronic Materials.

The deformation mechanism of Gallium-faces and Nitrogen-faces Gallium Nitride during nanogrinding

Z. Dong, R. Kang, D. Guo, 2021, International Journal of Mechanical Sciences.

Effects of initial temperature on the damage of GaN during nanogrinding

Z. Dong, R. Kang, Xiaoguang Guo, 2021 .

Cutting Chatter in Ultrasonic Elliptical Vibration Cutting and Its Influence on Surface Roughness and Tool Wear

Gang Li, Z. Dong, R. Kang, 2023, Metals.

Surface/subsurface formation mechanism of tungsten during ultrasonic elliptical vibration cutting

Z. Dong, R. Kang, Hao Wang, 2023, International Journal of Mechanical Sciences.

Mechanical effect of abrasives on silicon surface in chemo-mechanical grinding

R. Kang, Shang Gao, Yu Zhang, 2023, International Journal of Mechanical Sciences.

Design of ultrasonic elliptical vibration cutting system for tungsten heavy alloy

Z. Dong, R. Kang, Yan Bao, 2022, Frontiers of Mechanical Engineering.

Influence of the Planetary Movement of Tool on the Aspect Ratio of Micro Holes Machined by Micro-Ultrasonic Machining

R. Kang, Zuyuan Yu, Jianzhong Li, 2019, Journal of Micro and Nano-Manufacturing.

Ultra-precision grinding of asymmetric curved surfaces by line contact with cup wheel

Dongming Guo, Guang Feng, Zhuji Jin, 2013 .

Study of the influence of tool rake angle in ductile machining of optical quartz glass

R. Kang, D. Guo, Xiaoguang Guo, 2019, The International Journal of Advanced Manufacturing Technology.

Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding

P. Zhou, R. Kang, D. Guo, 2017 .

Precision polishing of the mandrel for X-ray grazing incidence mirrors

R. Kang, Hao Hu, Fuchang Zuo, 2021, The International Journal of Advanced Manufacturing Technology.

FEM-based optimization approach to machining strategy for thin-walled parts made of hard and brittle materials

Shang Gao, Haijun Liu, Liu Zhiqiang, 2020, The International Journal of Advanced Manufacturing Technology.

Ultrasonic Assisted Grinding of C/SiC composites

Zheng, Feifei, Z. Dong, 2018 .

Multi-scale machining damages of CFRP circular cell honeycomb during end face machining

Z. Dong, R. Kang, D. Guo, 2023, Journal of Manufacturing Processes.

Effect of mechanical anisotropy on material removal rate and surface quality during polishing CdZnTe wafers

R. Kang, Hang Gao, Yan Li, 2011 .

On understanding the mechanical properties and damage behavior of Cf/SiC composites by indentation method

Z. Dong, R. Kang, Yan Bao, 2023, Journal of Materials Research and Technology.

Material removal mechanism and deformation characteristics of AlN ceramics under nanoscratching

R. Kang, Shang Gao, Xiaoguang Guo, 2019, Ceramics International.