Jongmyung Kim
发表
Chunqing Wang,
Hongjun Ji,
Mingyu Li,
2008
.
Mingyu Li,
Jongmyung Kim,
Daewon Kim,
2008,
IEEE Transactions on Advanced Packaging.
Mingyu Li,
Jongmyung Kim,
Hongbo Xu,
2009
.
Mingyu Li,
Jongmyung Kim,
Hongbo Xu,
2008,
2008 International Conference on Electronic Packaging Technology & High Density Packaging.
Hongjun Ji,
Mingyu Li,
Jongmyung Kim,
2014
.
Mingyu Li,
Jongmyung Kim,
Zhihao Zhang,
2010,
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
Hongjun Ji,
Mingyu Li,
Jongmyung Kim,
2014
.
Mingyu Li,
Jongmyung Kim,
Shuai Wang,
2014,
2014 15th International Conference on Electronic Packaging Technology.
Hongjun Ji,
Mingyu Li,
Jongmyung Kim,
2012
.
Hongjun Ji,
Mingyu Li,
Jongmyung Kim,
2013
.
Mingyu Li,
Jongmyung Kim,
Yong Xiao,
2013,
2013 14th International Conference on Electronic Packaging Technology.
Hongjun Ji,
Mingyu Li,
Jongmyung Kim,
2013
.
Jongmyung Kim,
Mingyu Li,
Hongbae Kim,
2012,
2012 14th International Conference on Electronic Materials and Packaging (EMAP).
Mingyu Li,
Jongmyung Kim,
L. Weng,
2011
.
Cu6Sn5 Morphology Transition and Its Effect on Mechanical Properties of Eutectic Sn-Ag Solder Joints
Ling Wang,
Mingyu Li,
Yonggao Fu,
2011
.
Yong Cao,
Mingyu Li,
Jongmyung Kim,
2014,
Journal of Materials Science.
Mingyu Li,
Jongmyung Kim,
Mingqi Yang,
2012
.
Mingyu Li,
Jongmyung Kim,
Mingqi Yang,
2012
.
Mingyu Li,
Jongmyung Kim,
Hongbo Xu,
2009
.
Mingyu Li,
Jongmyung Kim,
Daewon Kim,
2008,
2008 10th Electronics Packaging Technology Conference.
Mingyu Li,
Jongmyung Kim,
Hongbo Xu,
2006,
2006 7th International Conference on Electronic Packaging Technology.
Mingyu Li,
Jongmyung Kim,
Mingqi Yang,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
Jongmyung Kim,
2008
.
Hongbo Xu,
Mingyu Li,
Jongmyung Kim,
2009
.
Beomsu Kim,
Hansung Lee,
Seokho Lee,
2013,
2013 IEEE International Conference on Mechatronics and Automation.
Chunqing Wang,
Hongjun Ji,
Mingyu Li,
2008,
2008 International Conference on Electronic Packaging Technology & High Density Packaging.