Suk-kyu Ryu

发表

Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique

Suk-kyu Ryu, Tengfei Jiang, K. Lu, 2012 .

Thermo-mechanical reliability of 3-D ICs containing through silicon vias

Suk-kyu Ryu, K. Lu, J. Im, 2009, 2009 59th Electronic Components and Technology Conference.

Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon Vias for 3-D Interconnects

Suk-kyu Ryu, K. Lu, Rui Huang, 2011, IEEE Transactions on Device and Materials Reliability.

Micro-Raman spectroscopy and analysis of near-surface stresses in silicon around through-silicon vias for three-dimensional interconnects

Suk-kyu Ryu, H.-Y Son, Kwang-yoo Byun, 2012 .

Effect of Thermal Stresses on Carrier Mobility and Keep-Out Zone Around Through-Silicon Vias for 3-D Integration

Suk-kyu Ryu, Tengfei Jiang, K. Lu, 2012, IEEE Transactions on Device and Materials Reliability.

Thermal Stresses Analysis of 3‐D Interconnect

Suk-kyu Ryu, K. Lu, Rui Huang, 2009 .

Thermal stress induced delamination of through silicon vias in 3-D interconnects

Suk-kyu Ryu, K. Lu, J. Im, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Stress-Induced Delamination Of Through Silicon Via Structures

Suk-kyu Ryu, K. Lu, J. Im, 2011 .

Temperature-dependent thermal stress determination for through-silicon-vias (TSVs) by combining bending beam technique with finite element analysis

Klaus Hummler, Paul S. Ho, Suk-Kyu Ryu, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Impact of material and microstructure on thermal stresses and reliability of through-silicon via (TSV) structures

Suk-kyu Ryu, Tengfei Jiang, J. Im, 2013, 2013 IEEE International Interconnect Technology Conference - IITC.

A highly efficient 3D micromixer using soft PDMS bonding

Sukho Park, Jungyul Park, Hyeon Cheol Kim, 2006 .

A three-dimensional model of fluid-structural interactions for quantifying the contractile force for cardiomyocytes on hybrid biopolymer microcantilever.

Suk-kyu Ryu, Byungkyu Kim, Sukho Park, 2007, Journal of biomechanics.

Characterization of thermal stresses and plasticity in through-silicon via structures for three-dimensional integration

Suk-kyu Ryu, Tengfei Jiang, Rui Huang, 2014 .

The dependence of contractile force for the cardiomyocytes on a different engineered surface

Suk-kyu Ryu, Byungkyu Kim, Sukho Park, 2005, IEEE Sensors, 2005..

A kinetic decomposition process for air-gap interconnects and induced deformation instability of a low-k dielectric cap layer

Suk-kyu Ryu, J. Im, Rui Huang, 2014 .

Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias

Tengfei Jiang, Rui Huang, Jay Im, 2013, Microelectron. Reliab..

Thermomechanical Reliability Challenges For 3D Interconnects With Through-Silicon Vias

Paul S. Ho, Suk-Kyu Ryu, Rui Huang, 2010 .

Mechanical Stability of Air-gap Interconnects

Suk-kyu Ryu, Rui Huang, P. Ho, 2008 .

Realistic computational modeling for hybrid biopolymer microcantilevers

Sukho Park, Jungyul Park, Hyeon Cheol Kim, 2006, 2006 International Conference of the IEEE Engineering in Medicine and Biology Society.

Impact of Process Induced Stresses and Chip-Packaging Interaction on Reliability of Air-gap Interconnects

Paul S. Ho, Suk-Kyu Ryu, Rui Huang, 2008, 2008 International Interconnect Technology Conference.

A fast simulation framework for full-chip thermo-mechanical stress and reliability analysis of through-silicon-via based 3D ICs

David Z. Pan, Moongon Jung, Suk-Kyu Ryu, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Thermomechanical reliability of through-silicon vias in 3D interconnects

Paul S. Ho, Suk-Kyu Ryu, Rui Huang, 2011, 2011 International Reliability Physics Symposium.

Thermomechanical Failure Analysis of Through-Silicon Via Interface Using a Shear-Lag Model With Cohesive Zone

Tengfei Jiang, Paul S. Ho, Suk-Kyu Ryu, 2014, IEEE Transactions on Device and Materials Reliability.