K. Lu

发表

Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique

Suk-kyu Ryu, Tengfei Jiang, K. Lu, 2012 .

Thermo-mechanical reliability of 3-D ICs containing through silicon vias

Suk-kyu Ryu, K. Lu, J. Im, 2009, 2009 59th Electronic Components and Technology Conference.

Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon Vias for 3-D Interconnects

Suk-kyu Ryu, K. Lu, Rui Huang, 2011, IEEE Transactions on Device and Materials Reliability.

Effect of Thermal Stresses on Carrier Mobility and Keep-Out Zone Around Through-Silicon Vias for 3-D Integration

Suk-kyu Ryu, Tengfei Jiang, K. Lu, 2012, IEEE Transactions on Device and Materials Reliability.

Thermal Stresses Analysis of 3‐D Interconnect

Suk-kyu Ryu, K. Lu, Rui Huang, 2009 .

Effect of Sn grain structure on electromigration reliability of Pb-free solders

K. Lu, J. Im, P. Ho, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Thermal stress induced delamination of through silicon vias in 3-D interconnects

Suk-kyu Ryu, K. Lu, J. Im, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Stress-Induced Delamination Of Through Silicon Via Structures

Suk-kyu Ryu, K. Lu, J. Im, 2011 .

Temperature-dependent thermal stress determination for through-silicon-vias (TSVs) by combining bending beam technique with finite element analysis

Klaus Hummler, Paul S. Ho, Suk-Kyu Ryu, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

Paul S. Ho, Xuefeng Zhang, Jang-Hi Im, 2007 .

Thermomechanical Property Characterization of Ultra Low‐k Materials

K. Lu, P. Ho, Vikas Gupta, 2009 .

Ultra low-k dielectric mechanical property characterization

K. Lu, P. Ho, D. Edwards, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints

Paul S. Ho, Min Ding, Seung-Hyun Chae, 2006 .

Moisture Transport and its Effects on Fracture Strength and Dielectric Constant of Underfill Materials

K. Lu, J. Im, P. Ho, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

K. Lu, P. Ho, Xuefeng Zhang, 2006 .

Electromigration lifetime statistics for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

K. Lu, P. Ho, Xuefeng Zhang, 2006, 56th Electronic Components and Technology Conference 2006.

Effects of Sn grain structure on the electromigration of Sn−Ag solder joints

Paul S. Ho, Seung-Hyun Chae, Jay Im, 2012 .

Reliability of Cu pillar bumps for flip-chip packages with ultra low-k dielectrics

K. Lu, J. Im, P. Ho, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Kinetic Analysis of Current Enhanced Intermetallic Growth and Its Effect on Electromigration Reliability of Solder Joints

K. Lu, P. Ho, Xuefeng Zhang, 2006, 2006 IEEE International Reliability Physics Symposium Proceedings.

Interfacial adhesion studies for step and flash imprint lithography

Li Tao, C. Grant Willson, Paul S. Ho, 2008, SPIE Advanced Lithography.

Thermomechanical Reliability Challenges For 3D Interconnects With Through-Silicon Vias

Paul S. Ho, Suk-Kyu Ryu, Rui Huang, 2010 .

Fabrication and characterization of patterned single-crystal silicon nanolines.

Bin Li, Kuan Lu, Rui Huang, 2008, Nano letters.

Thermomechanical reliability of through-silicon vias in 3D interconnects

Paul S. Ho, Suk-Kyu Ryu, Rui Huang, 2011, 2011 International Reliability Physics Symposium.