J. Im

发表

Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique

Suk-kyu Ryu, Tengfei Jiang, K. Lu, 2012 .

Thermo-mechanical reliability of 3-D ICs containing through silicon vias

Suk-kyu Ryu, K. Lu, J. Im, 2009, 2009 59th Electronic Components and Technology Conference.

Effect of high temperature storage on the stress and reliability of 3D stacked chip

Tengfei Jiang, J. Im, H.-Y Son, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Effects of UBM thickness, contact trace structure and solder joint scaling on electromigration reliability of Pb-free solder joints

J. Im, P. Ho, Seung-Hyun Chae, 2008, 2008 58th Electronic Components and Technology Conference.

Investigation of Intermetallic Compound Growth Enhanced by Electromigration in Pb-Free Solder Joints

J. Im, P. Ho, Xuefeng Zhang, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Effect of Sn grain structure on electromigration reliability of Pb-free solders

K. Lu, J. Im, P. Ho, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Thermal stress induced delamination of through silicon vias in 3-D interconnects

Suk-kyu Ryu, K. Lu, J. Im, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Stress-Induced Delamination Of Through Silicon Via Structures

Suk-kyu Ryu, K. Lu, J. Im, 2011 .

Temperature-dependent thermal stress determination for through-silicon-vias (TSVs) by combining bending beam technique with finite element analysis

Klaus Hummler, Paul S. Ho, Suk-Kyu Ryu, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Impact of material and microstructure on thermal stresses and reliability of through-silicon via (TSV) structures

Suk-kyu Ryu, Tengfei Jiang, J. Im, 2013, 2013 IEEE International Interconnect Technology Conference - IITC.

Impact of Grain Structure and Material Properties on Via Extrusion in 3D Interconnects

Tengfei Jiang, J. Im, Rui Huang, 2014 .

Study of Stresses and Plasticity in Through-Silicon Via Structures for 3D Interconnects by X-Ray Micro-Beam Diffraction

M. Kunz, N. Tamura, Tengfei Jiang, 2014, IEEE Transactions on Device and Materials Reliability.

Effect of Cu grain boundary sliding on TSV extrusion

Tengfei Jiang, J. Im, Rui Huang, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Effect of intermetallic formation on electromigration reliability of TSV-microbump joints in 3D interconnect

Tengfei Jiang, P. S. Ho, T. Bonifield, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Chemical and Mechanical Analysis of PCB Surface Treated by Argon Plasma to Enhance Interfacial Adhesion

J. Im, D. Shin, Hyo-sug Lee, 2009, IEEE Transactions on Electronics Packaging Manufacturing.

Effect of PCB Surface Modifications on the EMC-to-PCB Adhesion in Electronic Packages

J. Im, D. Shin, Young-hee Song, 2010, IEEE Transactions on Components and Packaging Technologies.

Oxidation of the TA Diffusion Barrier and Its Effect on the Reliability of CU Interconnects

J. Im, P. Ho, W. Baek, 2006, 2006 IEEE International Reliability Physics Symposium Proceedings.

Quantitative analysis of the mechanical robustness of multilayered bonding pad on a semiconductor device by nanoindentation and nanoscratch tests

J. Im, D. Shin, 2013 .

Cap layer and grain size effects on electromigration reliability in Cu/low-k interconnects

J. Im, P. Ho, E. Zschech, 2010, 2010 IEEE International Interconnect Technology Conference.

Critical initial void growth for electromigration: Stress modeling and multi-link statistics for Cu/low-k interconnects

J. Im, P. Ho, Zhuojie Wu, 2013, 2013 IEEE International Interconnect Technology Conference - IITC.

Effect of barrier process on electromigration reliability of Cu/porous low-k interconnects

J. Im, P. Ho, W. Baek, 2006 .

Plasma altered layer model for plasma damage characterization of porous OSG films

J. Im, P. Ho, M. Armacost, 2009, 2009 IEEE International Interconnect Technology Conference.

Material characterization and failure analysis of through-silicon vias

Tengfei Jiang, J. Im, Rui Huang, 2014, Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

A kinetic decomposition process for air-gap interconnects and induced deformation instability of a low-k dielectric cap layer

Suk-kyu Ryu, J. Im, Rui Huang, 2014 .

Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints

Paul S. Ho, Min Ding, Seung-Hyun Chae, 2006 .

Moisture Transport and its Effects on Fracture Strength and Dielectric Constant of Underfill Materials

K. Lu, J. Im, P. Ho, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Effects of Sn grain structure on the electromigration of Sn−Ag solder joints

Paul S. Ho, Seung-Hyun Chae, Jay Im, 2012 .

Effect of surface conditions on interfacial adhesion between PCB and EMC

J. Im, D. Shin, Young-hee Song, 2007, International Conference on Electronic Materials and Packaging.

Reliability of Cu pillar bumps for flip-chip packages with ultra low-k dielectrics

K. Lu, J. Im, P. Ho, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Through-silicon via stress characteristics and reliability impact on 3D integrated circuits

Tengfei Jiang, Paul S. Ho, Rui Huang, 2015 .

Characterization of plasticity and stresses in TSV structures in stacked dies using synchrotron x-ray microdiffraction

Tengfei Jiang, J. Im, H.-Y Son, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Kinetic study of intermetallic growth and its reliability implications in Pb-free Sn-based microbumps in 3D integration

J. Im, P. Ho, Seung-Hyun Chae, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias

Tengfei Jiang, Rui Huang, Jay Im, 2013, Microelectron. Reliab..

Thermomechanical Reliability Challenges For 3D Interconnects With Through-Silicon Vias

Paul S. Ho, Suk-Kyu Ryu, Rui Huang, 2010 .

Extension of micro-Raman spectroscopy for full-component stress characterization of TSV structures

Qiu Zhao, P. S. Ho, J. Im, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Electrical and Mechanical Characteristics of Air-Bridge Cu Interconnects

J. Im, P. Ho, M. Kraatz, 2009 .

Investigation of thermo-mechanical stresses and reliability of 3D die-stack structures by synchrotron x-ray micro-diffraction

Tengfei Jiang, Jian Li, Peng Su, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Thermomechanical reliability of through-silicon vias in 3D interconnects

Paul S. Ho, Suk-Kyu Ryu, Rui Huang, 2011, 2011 International Reliability Physics Symposium.

Thermomechanical Failure Analysis of Through-Silicon Via Interface Using a Shear-Lag Model With Cohesive Zone

Tengfei Jiang, Paul S. Ho, Suk-Kyu Ryu, 2014, IEEE Transactions on Device and Materials Reliability.

Thermal Stress in 3-d Packaging

Tengfei Jiang, J. Im, Rui Huang, 2022 .

Nanoindentation of Si Nanostructures: Buckling and Friction at Nanoscales

J. Im, Rui Huang, P. Ho, 2009 .

Chemistry in the Initial Formation of Nitride Barriers on Low-K Dielectrics

J. Im, P. Ho, P. Abramowitz, 2002 .