P. Ho

发表

Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique

Suk-kyu Ryu, Tengfei Jiang, K. Lu, 2012 .

Thermo-mechanical reliability of 3-D ICs containing through silicon vias

Suk-kyu Ryu, K. Lu, J. Im, 2009, 2009 59th Electronic Components and Technology Conference.

Effect of high temperature storage on the stress and reliability of 3D stacked chip

Tengfei Jiang, J. Im, H.-Y Son, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon Vias for 3-D Interconnects

Suk-kyu Ryu, K. Lu, Rui Huang, 2011, IEEE Transactions on Device and Materials Reliability.

Micro-Raman spectroscopy and analysis of near-surface stresses in silicon around through-silicon vias for three-dimensional interconnects

Suk-kyu Ryu, H.-Y Son, Kwang-yoo Byun, 2012 .

Effect of Thermal Stresses on Carrier Mobility and Keep-Out Zone Around Through-Silicon Vias for 3-D Integration

Suk-kyu Ryu, Tengfei Jiang, K. Lu, 2012, IEEE Transactions on Device and Materials Reliability.

Thermal Stresses Analysis of 3‐D Interconnect

Suk-kyu Ryu, K. Lu, Rui Huang, 2009 .

Electromigration in Al(Cu) two-level structures: Effect of Cu and kinetics of damage formation

C. Hu, P. Ho, M. Small, 1993 .

Scaling and Microstructure Effects on Electromigration Reliability for Cu Interconnects

Paul S. Ho, Meike Hauschildt, René Hübner, 2012 .

Reliability and early failure in Cu/oxide dual-damascene interconnects

Paul S. Ho, Ennis T. Ogawa, Ki-Don Lee, 2002 .

Reliability Assessment of Fan-Out Packages Using High Resolution Moiré Interferometry and Synchrotron X-Ray Microdiffraction

P. Ho, J. Im, Laura Spinella, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Chip‐Packaging Interaction and Reliability Impact on Cu/Low k Interconnects

Paul S. Ho, G. Wang, P. Ho, 2006 .

Investigation of interfacial delamination for Cu/low k structures during flip-chip packaging

P. Ho, Guotao Wang, S. Groothuis, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

Effect of packaging on interfacial cracking in Cu/ low k Damascene structures

Paul S. Ho, S. Groothuis, P. Ho, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Packaging effects on reliability of Cu/low-k interconnects

Paul S. Ho, Steven K. Groothuis, P. Ho, 2003 .

Interfacial fracture mechanics: chip-level interconnect reliability

P. Ho, Guotao Wang, S. Groothuis, 2003, Proceedings of the 15th Biennial University/Government/ Industry Microelectronics Symposium (Cat. No.03CH37488).

Thermal deformation analysis on flip-chip packages using high resolution moire interferometry

Paul S. Ho, Min Ding, P. Ho, 2002, ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).

Analysis of flip-chip packages using high resolution moire interferometry

Paul S. Ho, Ilyas Mohammed, Xiang Dai, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

Effects of UBM thickness, contact trace structure and solder joint scaling on electromigration reliability of Pb-free solder joints

J. Im, P. Ho, Seung-Hyun Chae, 2008, 2008 58th Electronic Components and Technology Conference.

Geometry and Microstructure Effect on EM-Induced Copper Interconnect Degradation

A. V. Vairagar, P. Ho, G. Schneider, 2009, IEEE Transactions on Device and Materials Reliability.

Investigation of Intermetallic Compound Growth Enhanced by Electromigration in Pb-Free Solder Joints

J. Im, P. Ho, Xuefeng Zhang, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Effect of Sn grain structure on electromigration reliability of Pb-free solders

K. Lu, J. Im, P. Ho, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Thermal stress induced delamination of through silicon vias in 3-D interconnects

Suk-kyu Ryu, K. Lu, J. Im, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Effects of Chip-Package Interaction on Mechanical Reliability of Cu Interconnects for 65nm Technology Node and Beyond

P. Ho, Xuefeng Zhang, T. Nakamura, 2006, 2006 International Interconnect Technology Conference.

Electromigration in Metals

P. Ho, T. Kwok, 1989 .

Stress-Induced Delamination Of Through Silicon Via Structures

Suk-kyu Ryu, K. Lu, J. Im, 2011 .

Transmission electron microscopy of the formation of nickel silicides

P. Ho, K. Tu, H. Föll, 1982 .

Statistical analysis of early failures in electromigration

Hisao Kawasaki, Paul S. Ho, C. Capasso, 2001 .

Temperature-dependent thermal stress determination for through-silicon-vias (TSVs) by combining bending beam technique with finite element analysis

Klaus Hummler, Paul S. Ho, Suk-Kyu Ryu, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

Paul S. Ho, Xuefeng Zhang, Jang-Hi Im, 2007 .

Impact of material and microstructure on thermal stresses and reliability of through-silicon via (TSV) structures

Suk-kyu Ryu, Tengfei Jiang, J. Im, 2013, 2013 IEEE International Interconnect Technology Conference - IITC.

Impact of Grain Structure and Material Properties on Via Extrusion in 3D Interconnects

Tengfei Jiang, J. Im, Rui Huang, 2014 .

Study of Stresses and Plasticity in Through-Silicon Via Structures for 3D Interconnects by X-Ray Micro-Beam Diffraction

M. Kunz, N. Tamura, Tengfei Jiang, 2014, IEEE Transactions on Device and Materials Reliability.

Effect of Cu grain boundary sliding on TSV extrusion

Tengfei Jiang, J. Im, Rui Huang, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Low Dielectric Constant Materials for IC Applications

Paul S. Ho, P. Ho, Jihperng Leu, 2003 .

Adhesion and toughening mechanisms at underfill interfaces for flip-chip-on-organic-substrate packaging

Paul S. Ho, Xiang Dai, M. Roesch, 2000 .

Effect of intermetallic formation on electromigration reliability of TSV-microbump joints in 3D interconnect

Tengfei Jiang, P. S. Ho, T. Bonifield, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Chemical bonding and reaction at metal/polymer interfaces

G. Rubloff, P. Ho, B. Silverman, 1985 .

Delocalized bonding at the metal-polymer interface

P. Ho, P. Sanda, B. Silverman, 1988 .

Intermetallic compounds of Al and transitions metals: Effect of electromigration in 1-2-μm-wide lines

Paul S. Ho, J. K. Howard, P. Ho, 1978 .

Auger study of preferred sputtering on Ag–Au alloy surfaces

J. K. Howard, P. Ho, J. Lewis, 1976 .

Auger study of preferred sputtering on binary alloy surfaces

J. K. Howard, P. Ho, J. Lewis, 1976 .

Effects of enhanced diffusion on preferred sputtering of homogeneous alloy surfaces

P. Ho, 1978 .

Preferred sputtering on binary alloy surfaces of the AlPdSi system

P. Ho, W. Chu, J. Lewis, 1979 .

Abstract: Preferred sputtering on binary alloy surfaces of the Al–Pd–Si system

P. Ho, J. Lewis, 1979 .

Interatomic potentials and defect energetics in dilute alloys

P. Ho, R. Benedek, 1974 .

ELECTRON BEAM STUDY OF SILICIDE SCHOTTKY DIODES.

P. Ho, C. Aliotta, Huai Huang, 1982 .

Characterization of Plasma Damage for Low-kDielectric Films

P. Ho, R. S. Smith, Hualiang Shi, 2016 .

Investigation of Interconnect Design on Chip Package Interaction and Mechanical Reliability of Cu/Low-k Multi-Layer Interconnects in Flip Chip Package

P. Ho, Xuefeng Zhang, Tomoji Nakamura, 2008, 2008 International Interconnect Technology Conference.

Intermetallic compound formations in titanium-copper thin-film couples

P. Ho, D. Gupta, P. Psaras, 1985 .

Grain Boundary Diffusion in NiFe/Ag Bilayer Thin Films

J. K. Howard, M. Gall, P. Ho, 1994 .

Plasma processing of low-k dielectrics

P. Ho, D. Shamiryan, M. Baklanov, 2013 .

Leakage current degradation and carrier conduction mechanisms for Cu/BCB damascene process under bias-temperature stress

P. Ho, S. U. Kim, T. Cho, 1999, 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296).

Dielectric anisotropy and molecular orientation of fluorinated polymers confined in submicron trenches

E. T. Ryan, P. Ho, Jaekwang Lee, 2000 .

Effects of Chip-Package Interaction on Mechanical Reliability of Cu Interconnects for 65nm Technology Node and Beyond

P. Ho, Xuefeng Zhang, Tomoji Nakamura, 2006, IITC 2006.

Chemical reaction and silicide formation at the Pt/Si interface

G. Rubloff, P. Ho, R. Matz, 1984 .

Diffusion Phenomena in Thin Films and Microelectronic Materials

P. S. Ho, P. Ho, Devendra Gupta, 1989 .

Scaling effects on electromigration reliability of copper interconnects

P. Ho, Lijuan Zhang, J. Pyun, 2011 .

Direct measurements of Cu diffusion into a polyimide below the glass transition temperature

P. Ho, B. Silverman, F. Faupel, 1989 .

Characterization of thermal stresses and plasticity in through-silicon via structures for three-dimensional integration

Suk-kyu Ryu, Tengfei Jiang, Rui Huang, 2014 .

Effect of backside scratch direction on the Si die strength

P. Ho, D. Edwards, Jie-Hua Zhao, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Kinetic Analysis of Electromigration Enhanced Intermetallic Growth and Void Formation in Pb-Free Solders

P. Ho, Xuefeng Zhang, Seung-Hyun Chae, 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

Impact of low k dielectrics on electromigration reliability for Cu interconnects

Paul S. Ho, Ennis T. Ogawa, Ki-Don Lee, 2003 .

EM and SM induced degradation dynamics in copper interconnects studied using electron microscopy and X-ray microscopy

P. Ho, R. Hübner, E. Zschech, 2010, 2010 IEEE International Reliability Physics Symposium.

Summary Abstract: Electromigration studies of al-intermetallic structures

P. Ho, T. Kwok, Huai Huang, 1984 .

Determination of vacancy mechanism for grain boundary self-diffusion by computer simulation

P. Ho, S. Yip, T. Kwok, 1981 .

Schottky barrier, electronic states and microstructure at Ni silicide-silicon interfaces

P. Ho, H. Evans, E. Yang, 1986 .

Schottky Barrier and Electronic States at Silicide-Silicon Interfaces

P. Ho, P. Schmid, M. Liehr, 1985 .

Complex formation and growth at the Cr– and Cu–polyimide interface

P. Ho, B. Silverman, R. Haight, 1988 .

Thickness-direction thermal-expansion measurements

R. Saraf, P. Ho, B. Silverman, 1992 .

Photoemission spectroscopy study of aluminum-polyimide interface

P. Ho, P. Hahn, J. Bartha, 1985 .

Chemical and structural aspects of reaction at the Ti/Si interface

G. Rubloff, P. Ho, T. Tan, 1984 .

Transmission electron microscopy investigation of silicide formation on slightly oxidized silicon substrates

P. Ho, H. Föll, 1981 .

OBSERVATION OF DAMAGE IN HELIUM ION IRRADIATED GOLD FILMS USING TRANSMISSION ELECTRON MICROSCOPY.

R. D. Brown, P. Ho, P. Rao, 1973 .

Residual Damage in Silicon Implanted and Post-Annealed Silicon

P. Ho, K. Tu, L. Glowinski, 1977 .

Chemical bonding and electronic structure of Pd2Si

G. Rubloff, P. Ho, A. R. Williams, 1980 .

Electronic states and microstructure at the silicide-silicon interface

G. Rubloff, P. Ho, 1982 .

Analysis of electromigration statistics for Cu interconnects

Hisao Kawasaki, Paul S. Ho, Martin Gall, 2006 .

Scaling effects on microstructure and reliability for Cu interconnects

M. Gall, P. Ho, E. Zschech, 2010 .

Physical Characterization of PECVD and PEALD Ru(-C) Films and Comparison with PVD Ruthenium Film Properties

Paul S. Ho, D. Utess, Siegfried Menzel, 2011 .

Mechanical characterization of low-K dielectric materials

P. Ho, J. Anthony, T. M. Moore, 2001 .

Chemical bonding and reactions at Ti/Si and Ti/oxygen/Si interfaces

G. Rubloff, P. Ho, R. Butz, 1983 .

Electromigration reliability of Mn-doped Cu interconnects for the 28 nm technology

P. Ho, P. Justison, L. Cao, 2013, 2013 IEEE International Reliability Physics Symposium (IRPS).

Characterization of thermal stresses of Cu/low-k submicron interconnect structures

P. Ho, Yong Du, S. Rhee, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

FRACTURE OF METAL-POLYMER LINE STRUCTURES. I: SEMIFLEXIBLE POLYIMIDE

P. Ho, J. Leu, S. Chiu, 1994 .

Overview on Low Dielectric Constant Materials for IC Applications

P. Ho, J. Leu, W. W. Lee, 2003 .

Buckling of single-crystal silicon nanolines under indentation

Bin Li, Paul S. Ho, Rui Huang, 2008 .

Chip-Package Interaction and Crackstop Study for Cu/Ultra low-k Interconnects

Rui Huang, P. Ho, Xuefeng Zhang, 2009 .

Isothermal stress relaxation in electroplated Cu films. II. Kinetic modeling

Rui Huang, P. Ho, Dongwen Gan, 2005 .

Experimental investigation on interfacial adhesion in microelectronic assemblies

P. Ho, X. Dai, M. Brillhart, 1998 .

Mechanical strength and reliability of a novel thin monocrystalline silicon solar cell

P. Ho, S. Saha, R. Rao, 2012, 2012 IEEE International Reliability Physics Symposium (IRPS).

Interaction of metals with model polymer surfaces: Core level photoemission studies

J. L. Jordan, P. Ho, J. Clabes, 1986 .

Material reactions Al/Pd2Si/Si junctions. II. Kinetic rates

P. Ho, J. Lewis, U. Koster, 1982 .

Low dielectric constant materials for advanced interconnects

P. Ho, Jie-Hua Zhao, M. Morgen, 1999 .

Molecular structure and thermal/mechanical properties of polymer thin films

P. Ho, J. Leu, T. Poon, 1994 .

XPS Studies of Chromium Atoms Interacting with a PMDA-ODA Polyimide Surface

P. Ho, B. Silverman, R. Haight, 1987 .

Effects of ultraviolet radiation on ultra-low-dielectric constant thin film fracture properties

P. Ho, T. Tsui, R. S. Smith, 2009 .

Analysis of Ultraviolet Curing Effect on the Dielectric Constant and Molecular Structure of a Porous Dielectric Film

P. Ho, T. Tsui, R. S. Smith, 2010 .

Dielectric Recovery of Plasma Damaged Organosilicate Low-k Films

P. Ho, R. S. Smith, Junjun Liu, 2008 .

The Effect of Ultraviolet Light Curing on the Material and Fracture Properties of a k∼2.5 Low-k Dielectric

P. Ho, R. S. Smith, T. Tsui, 2007 .

New Methodologies for Characterization of Low Dielectric Constant Thin Films

E. T. Ryan, P. Ho, Jie-Hua Zhao, 1997 .

Effects of variations of silicide characteristics on the Schottky-barrier height of silicide-silicon interfaces

P. Ho, H. Föll, T. Tan, 1983 .

Oxidation of the TA Diffusion Barrier and Its Effect on the Reliability of CU Interconnects

J. Im, P. Ho, W. Baek, 2006, 2006 IEEE International Reliability Physics Symposium Proceedings.

Mechanistic study of plasma damage of low k dielectric surfaces

P. Ho, M. D. Goodner, Junjun Liu, 2008 .

Origin of dielectric loss induced by oxygen plasma on organo-silicate glass low-k dielectrics

P. Ho, R. S. Smith, Haiyu Huang, 2008 .

Pressure dependence of the elastic constants and an experimental equation of state for CaF2

P. Ho, A. Ruoff, 1967 .

Computer simulation of vacancy migration in a fcc tilt boundary

P. Ho, S. Yip, T. Kwok, 1984 .

Evidence for vacancy mechanism in grain boundary diffusion in bcc iron: A molecular-dynamics study

P. Ho, S. Yip, T. Kwok, 1981 .

Analysis of grain‐boundary electromigration

P. Ho, 1978 .

Critical and Sub-critical Debonding in Nano-clustering Porous Low-k Films

P. Ho, T. Nakamura, R. S. Smith, 2006 .

Effect of Mode-Mixity and Porosity on Interfacial Fracture of Low-k Dielectrics

P. Ho, C. Merrill, 2004 .

Interfacial Adhesion Study of Porous Low-K Dielectrics to CVD Barrier Layers

J. Wetzel, P. Ho, C. Merrill, 2002 .

The Effect of Methylating Treatments on the Dielectric Reliability of Low-k/Cu Structures

P. Ho, A. Knorr, S. Borthakur, 2005 .

Oxygen plasma damage to blanket and patterned ultralow-κ surfaces

P. Ho, M. D. Goodner, M. Moinpour, 2010 .

Mechanistic Study of Plasma Damage of Low k

P. Ho, M. D. Goodner, Junjun Liu, 2007 .

Restoration and pore sealing of plasma damaged porous organosilicate low k dielectrics with phenyl containing agents

P. Ho, W. Baek, Hualiang Shi, 2007 .

Low Dielectric Constant Materials for ULSI Interconnects

Paul S. Ho, Michael Morgen, E. Todd Ryan, 2000 .

Thermomechanical Property Characterization of Ultra Low‐k Materials

K. Lu, P. Ho, Vikas Gupta, 2009 .

Mechanistic Study of CO2 Plasma Damage to OSG Low k Dielectrics

P. Ho, M. Armacost, B. Chao, 2008, 2008 International Interconnect Technology Conference.

Effect of CH4 plasma treatment on O2 plasma ashed organosilicate low-k dielectrics

P. Ho, M. D. Goodner, Junjun Liu, 2007 .

Feasibility of an Ag-alloy film as a thin-film transistor liquid-crystal display source/drain material

P. Ho, W. Lee, H. J. Yang, 2002 .

Thermomechanical properties and moisture uptake characteristics of hydrogen silsesquioxane submicron films

P. Ho, E. Ogawa, Jie-Hua Zhao, 1999 .

Material property characterization and integration issues for mesoporous silica

E. T. Ryan, P. Ho, Wen-Li Wu, 1999, Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247).

Structure-Property Correlation in Low K Dielectric Materials

P. Ho, Jie-Hua Zhao, M. Morgen, 1999 .

Effect of Deposition and Annealing on The Thermomechanical Properties of Parylene Films

E. T. Ryan, P. Ho, M. Miller, 1997 .

Thermal conductivity study of porous low-k dielectric materials

P. Wayner, P. Ho, M. Morgen, 2000 .

Study of the thermal properties of polymeric dielectric materials by photothermal technique

P. Ho, E. Ogawa, Chuan Hu, 1998 .

Thermal and Bias-Temperature Stress Induced Leakage Current Failure of Cu/BCB Single Damascene Integration

P. Ho, Sang U. Kim, T. Cho, 1998 .

Activation of Low k Dielectrc Surfaces for ALD Barrier Formation

P. Ho, Junjun Liu, Hualiang Shi, 2007 .

Effect of passivation on stress relaxation in electroplated copper films

Rui Huang, P. Ho, J. Maiz, 2006 .

Chemical reactions at Pt/oxide/Si and Ti/oxide/Si interfaces

G. Rubloff, P. Ho, M. Liehr, 1985 .

Initial interface formation of Ta-based barriers on SiLK™ low dielectric constant films

P. Ho, J. Im, M. Scharnberg, 2005 .

General aspects of barrier layers for very-large-scale integration applications I: Concepts

P. Ho, 1982 .

Nanoporous Materials Integration Into Advanced Microprocessors

E. T. Ryan, A. Simon, S. Nitta, 2005 .

A model for statistical electromigration simulation with dependence on capping layer and Cu microstructure in two dimensions

M. Gall, P. Ho, E. Zschech, 2016 .

Cap layer and grain size effects on electromigration reliability in Cu/low-k interconnects

J. Im, P. Ho, E. Zschech, 2010, 2010 IEEE International Interconnect Technology Conference.

Effects of Passivation Layer on Stress Relaxation and Mass Transport in Electroplated Cu Films

Paul S. Ho, J. Maiz, Rui Huang, 2004 .

Packaging effect on reliability for Cu/low k structures

P. Ho, Guotao Wang, S. Groothuis, 2004, 2004 IEEE International Reliability Physics Symposium. Proceedings.

Mechanistic Study of Plasma Damage and CH4 Recovery of Low k Dielectric Surface

P. Ho, M. D. Goodner, M. Moinpour, 2007, 2007 IEEE International Interconnect Technology Conferencee.

Effects of surface chemistry on ALD Ta3N5 barrier formation on low-k dielectrics

P. Ho, M. Scharnberg, R. Laxman, 2005 .

Effects of a low-energy ion beam on the growth of titanium nitride layers near the interface of a polyimide

P. Ho, P. Abramowitz, M. Kiene, 1999 .

Thermal stress characteristics of Cu/oxide and Cu/low-k submicron interconnect structures

Paul S. Ho, P. Ho, Yong Du, 2003 .

Critical initial void growth for electromigration: Stress modeling and multi-link statistics for Cu/low-k interconnects

J. Im, P. Ho, Zhuojie Wu, 2013, 2013 IEEE International Interconnect Technology Conference - IITC.

Chip–Package Interaction and Reliability Improvement by Structure Optimization for Ultralow-$k$ Interconnects in Flip-Chip Packages

P. S. Ho, Xuefeng Zhang, Jang-Hi Im, 2012, IEEE Transactions on Device and Materials Reliability.

Stressmigration studies on dual damascene Cu/oxide and Cu/low k interconnects

P. Ho, S. Hwang, Jongsun Maeng, 2004 .

Linewidth dependence of stress relaxation and microstructural change in passivated Al(Cu) lines

P. Ho, H. Kawasaki, I. Yeo, 1997 .

Effect of barrier process on electromigration reliability of Cu/porous low-k interconnects

J. Im, P. Ho, W. Baek, 2006 .

Scaling effect on electromigration reliability for Cu/low-k interconnects

P. Ho, S. Yoon, J. Pyun, 2005, 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual..

Plasma altered layer model for plasma damage characterization of porous OSG films

J. Im, P. Ho, M. Armacost, 2009, 2009 IEEE International Interconnect Technology Conference.

Grain structure effect on electromigration reliability of Cu interconnects with CoWP capping

P. Ho, E. Zschech, Lijuan Zhang, 2011 .

Statistical Analysis of Electromigration in Cu Interconnects With Multi‐link Test Structures

M. Gall, P. Ho, M. Hauschildt, 2004 .

Nonlinear propagation of void front during electromigration in alloy films

J. K. Howard, P. Ho, 1975 .

Scaling effects on microstructure and electromigration reliability for Cu and Cu(Mn) interconnects

P. Ho, Lijuan Zhang, M. Hauschildt, 2014, 2014 IEEE International Reliability Physics Symposium.

Diffusion processes in thin films

P. Ho, D. Gupta, 1980 .

Thin films: Interfaces and phenomena

P. Ho, R. Nemanich, S. Lav, 1986 .

Grain Size And Cap Layer Effects On Electromigration Reliability Of Cu Interconnects: Experiments And Simulation

P. Ho, E. Zschech, Lijuan Zhang, 2010 .

Electronic Structure Of Silicide-Silicon Interfaces

G. Rubloff, P. Ho, 1982 .

Effect of substrate temperature on the microstructure of thin‐film silicide

P. Ho, K. Tu, U. Köster, 1977 .

Lattice statics calculations for interstitial atoms in tungsten

P. Ho, R. Benedek, 1974 .

Pseudopotential Calculation of Point Defect Properties in Simple Metals

P. Ho, 1972 .

Preparation and characterization of polyimide alternating copolymers incorporating N,N′‐bis‐(4‐anilino)‐1,2,4,5‐benzene bis(dicarboximide)

P. Ho, M. Fox, J. Leu, 1997 .

In situ transmission electron microscopy study of plastic deformation and stress-induced voiding in Al–Cu interconnects

J. Stark, P. Ho, H. Kawasaki, 1997 .

Thickness dependence of the anisotropy in thermal expansion of PMDA-ODA and BPDA-PDA thin films

P. Ho, R. Stierman, H. Liou, 1999 .

Low TCE Polyimides from Polyamic Acid Blends and Copolymers: Preparation and Characterization Studies

P. Ho, T. L. Nunes, K. Sachdev, 1992 .

Grain boundary diffusion and its effects on the magnetic properties of Co/Cu and Co/Cr thin film bilayers

J. K. Howard, P. Ho, K. Barmak, 1994 .

Grain Boundary Diffusion in Co/Cu and Co/Cr Magnetic Thin Films

J. K. Howard, P. Ho, K. Barmak, 1993 .

Low temperature diffusion and applications to thin films : proceedings of an international conference held on August 12-14, 1974, Yorktown Heights, New York

P. S. Ho, A. Gangulee, K. N. Tu, 1976 .

Co Liner Impact on Microstructure of Cu Interconnects

P. Ho, C. Labelle, B. Taylor, 2015 .

Mechanical Characterization of High Aspect Ratio Silicon Nanolines

Rui Huang, P. Ho, J. Im, 2008 .

Ultra low-k dielectric mechanical property characterization

K. Lu, P. Ho, D. Edwards, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Thermal stress characteristics of two-level Al(Cu) interconnect structure

P. Ho, S. Rhee, 2003 .

Measurement of thermal stress and stress relaxation in confined metal lines. II. Stress relaxation study

P. Ho, J. Cuomo, M. Moske, 1993 .

Numerical Simulations of Stress Relaxation by Interface Diffusion in Patterned Copper Lines

P. Ho, A. Bower, S. Shankar, 2004 .

Material characterization and failure analysis of through-silicon vias

Tengfei Jiang, J. Im, Rui Huang, 2014, Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

A kinetic decomposition process for air-gap interconnects and induced deformation instability of a low-k dielectric cap layer

Suk-kyu Ryu, J. Im, Rui Huang, 2014 .

Chemistry and adhesion of metal-polymer interfaces

P. Ho, 1990 .

Structure–property correlation for thin films of semi‐interpenetrating polyimide networks. II. Anisotropy in optical, electrical, thermal, and mechanical properties

P. Ho, H. Liou, Betty Tung, 1998 .

Microstructure-based stress modeling of tin whisker growth

Peng Su, Min Ding, P. Ho, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Atomic structure of the epitaxial Al-Si interface

P. Ho, F. Legoues, W. Krakow, 1986 .

Thermal reactions between aluminum and palladium layered films

P. Ho, Paul S Ho, Uwe Koster, 1980 .

Surface and grain boundary segregation related to the temper embrittlement of a 214Cr-1Mo steel

P. Ho, M. Graham, D. F. Mitchell, 1983 .

Auger analysis of fracture surfaces of temper embrittled 2.25 Cr-1Mo steel containing rare earth additions

P. Ho, M. Graham, G. Sproule, 1983 .

Ultrasonic study of the beta → omega phase transformation in Zr-Nb alloys

P. Ho, S. Sass, G. Goasdoue, 1972 .

Electromigration and soret effect in cobalt

P. Ho, Paul S Ho, 1966 .

Analysis of ultrasonic data and experimental equation of state for sodium

P. Ho, A. Ruoff, 1968 .

A Quasi-Harmonic Calculation of Lattice Dynamics for Na

P. Ho, A. Ruoff, 1967, October 1.

The microstructure of metal–polyimide interfaces

Paul S. Ho, F. K. LeGoues, P. Ho, 1988 .

Chemistry, Microstructure, and Adhesion of Metal—Polymer Interfaces

P. Ho, B. Silverman, R. Haight, 1991 .

CHEMICAL INTERACTIONS AT METAL-POLYMER INTERFACES.

G. Rubloff, P. Ho, P. Hahn, 1984 .

Kinetics of compound formation in thin film couples of Al and transition metals

J. K. Howard, P. Ho, R. Lever, 1975 .

Thin Films and Interfaces

P. Ho, K. Tu, 1982 .

Material reactions in Al/Pd2Si/Si junctions. I. Phase stability

P. Ho, J. Lewis, U. Koster, 1982 .

Schottky barrier height measurement by electron‐beam induced voltage

P. Ho, C. Aliotta, Huai Huang, 1982 .

CHEMICAL AND STRUCTURAL PROPERTIES OF THE Pd/Si INTERFACE DURING THE INITIAL STAGES OF SILICIDE FORMATION.

G. Rubloff, P. Ho, T. Tan, 1979 .

Molecular dynamics study of thermal disorder in a bicrystal model

P. Ho, S. Yip, T. Kwok, 1991 .

Adhesion and deformation of metal/polyimide layered structures

Franz Faupel, P. S. Ho, P. Ho, 1989 .

Reliability issues for flip-chip packages

Xiang Dai, Guotao Wang, Paul S. Ho, 2004, Microelectron. Reliab..

Cross-sectional transmission electron microscopy of silicon-silicide interfaces

P. Ho, K. Tu, F. Föll, 1981 .

Materials Research Society Symposia Proceedings. Volume 54. Thin Films - Interfaces and Phenomena Held in Boston, Massachusetts on 2-6 December 1985,

P. Ho, R. Nemanich, S. Lau, 1986 .

TEM STUDY OF Pt SILICIDE FORMATION ON CLEAN Si SURFACES.

P. Ho, R. Matz, Y. Yokota, 1983 .

The Microstructure of Transition Metal/Al(Cu) Layers

P. Ho, T. Kwok, H. C. Huang, 1987 .

Electromigration Reliability of Pb-Free Solder Joints

P. Ho, Seung-Hyun Chae, Yiwei Wang, 2012 .

Chemical bonding at the polyimide surface

G. Rubloff, P. Ho, P. Hahn, 1984 .

Direct observations of defects in implanted and postannealed silicon wafers

P. Ho, K. Tu, L. Glowinski, 1976 .

Schottky barrier heights of epitaxial Ni–silicides on Si(111)

P. Ho, P. Schmid, M. Liehr, 1986 .

Formation of the Schottky barrier at the Pd/Si interface

G. Rubloff, P. Ho, R. Purtell, 1983 .

An X-ray study of domain structure and stress in Pd2Si films at Pd-Si interfaces

P. Ho, S. Stock, G. White, 1982 .

An X-Ray Study of Domain Structure and Stress in Pd 2 Si Films at Pd-Si Interfaces

P. Ho, S. Stock, G. White, 1981 .

Fracture of metal-polymer line structures. II. Rigid-rodlike polyimide

P. Ho, J. Leu, S. Chiu, 1994 .

Microscopic Compound Formation at the Pd-Si(111) Interface

G. Rubloff, P. Ho, T. Kuan, 1979 .

Pressure Dependence of the Elastic Constants for Aluminum from 77° to 300°K

P. Ho, A. Ruoff, 1969 .

Effect of electron-irradiation on void formation in helium-pre-injected aluminium films.

P. Ho, P. Rao, L. Glowinski, 1973 .

Energetics of divacancy diffusion in sodium

P. Ho, 1972 .

Application of pseudopotentials to the calculation of vacancy formation energy and volume for alkali metals

P. Ho, 1971 .

A cw Interferometer for Elastic Constant Measurements

P. Ho, A. Ruoff, J. Day, 1973 .

Lattice-Dynamic Calculation for Alkali Metals

P. Ho, 1968 .

DEFECT ENERGETICS FOR SELF-DIFFUSION IN SODIUM.

P. Ho, 1973 .

Calculation of clustering effects on impurity-vacancy binding energies in aluminum☆

P. Ho, R. Benedek, 1978 .

A modified Green function technique for the calculation of lattice distortion surrounding interstitials

P. Ho, R. Benedek, 1973 .

Effect of supporting layer on growth of carbon nanotubes by thermal chemical vapor deposition

P. Ho, Z. Yao, Li Shi, 2006 .

Observation of local melting in an aluminum bicrystal by molecular dynamics simulation

P. Ho, S. Yip, T. Kwok, 1985 .

Contactless measurement of Schottky barrier heights using secondary electrons

P. Ho, Huai Huang, 1982 .

Electron Beam Study of Silicide Schottky Diodes

P. Ho, C. Aliotta, Huai Huang, 1981 .

Kirkendall study of electromigration in thin films

J. K. Howard, P. Ho, J. Lewis, 1975 .

Interdiffusion at the polyimide-Cu interface

P. Ho, R. Tromp, F. Legoues, 1985 .

Pressure Dependence of the Elastic Constants for Silver from 77 to 300 °K

P. Ho, A. Ruoff, J. Poirier, 1969 .

Effect of surface condition on diffusion in thin films at low temperatures

P. Ho, J. Hwang, R. Balluffi, 1978 .

Motion of Inclusion Induced by a Direct Current and a Temperature Gradient

Paul S. Ho, P. Ho, 1970 .

GROWTH KINETICS AND ORIENTATION DEPENDENCE OF DISLOCATION LOOPS IN ELECTRON IRRADIATED ALUMINUM.

P. Ho, P. Rao, J. H. Chen, 1973 .

Effect of contact metallization on electromigration reliability of Pb-free solder joints

Peng Su, Paul S. Ho, Min Ding, 2006 .

Thermal diffusivity measurement of polymeric thin films using the photothermal displacement technique. II. On-wafer measurement

P. Ho, E. Ogawa, Chuan Hu, 1999 .

Characterization of low dielectric constant materials

Paul S. Ho, M. Morgen, C. Hu, 2003 .

Adhesion measurement for electronic packaging applications using double cantilever beam method

Paul S. Ho, Xiang Dai, P. Ho, 2000 .

Effects of Wiring Density and Pillar Structure on Chip Package Interaction for Advanced Cu Low-k Chips

Paul S. Ho, Weishen Chu, Laura Spinella, 2020, 2020 IEEE International Reliability Physics Symposium (IRPS).

Micro-fabricated perforated polymer devices for long-term drug delivery

Paul S. Ho, Zhiquan Luo, Phillip D. Bowman, 2011, Biomedical microdevices.

Polymer interfacial adhesion in microelectronic assemblies

Paul S. Ho, P. Ho, X. Dai, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Electromigration study of high lead solders in flip-chip packages using the Wheatstone bridge method

P. Ho, H. Matsuhashi, Guotao Wang, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Isothermal stress relaxation in electroplated Cu films. I. Mass transport measurements

Paul S. Ho, J. Maiz, Rui Huang, 2005 .

Dielectric and Scaling Effects on Electromigration for Cu Interconnects

P. Ho, S. Yoon, J. Pyun, 2005 .

Statistical study for electromigration reliability in dual-damascene Cu interconnects

P. Ho, P.S. Ho, Ki-Don Lee, 2004, IEEE Transactions on Device and Materials Reliability.

Reliability challenges and recent advances for Cu interconnects

Ki-Don Lee, P. Ho, Ki-Don Lee, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

Effect of low k dielectrics on electromigration reliability for Cu interconnects

Paul S. Ho, Ennis T. Ogawa, P. Ho, 2004 .

Electromigration reliability of Cu interconnects and the impact of low-k dielectrics

P. Ho, E. Ogawa, H. Matsuhashi, 2003, Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003.

Electromigration reliability issues in dual-damascene Cu interconnections

Paul S. Ho, Ennis T. Ogawa, Ki-Don Lee, 2002, IEEE Trans. Reliab..

Electromigration in submicron dual-damascene Cu/low-k interconnects

P. Ho, R. Augur, Ki-Don Lee, 2002 .

Electromigration reliability of Cu interconnects and effects of low K dielectrics

K.-D. Lee, P. Ho, R. Augur, 2002, Digest. International Electron Devices Meeting,.

Electromigration study of Cu/low k dual-damascene interconnects

P. Ho, R. Augur, E. Ogawa, 2002, 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320).

Statistics of electromigration early failures in Cu/oxide dual-damascene interconnects

Paul S. Ho, Ennis T. Ogawa, Ki-Don Lee, 2001, 2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167).

Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints

Xuefeng Zhang, Paul S. Ho, Brook Huang-Lin Chao, 2009, Microelectron. Reliab..

Electromigration in two-level interconnect structures with Al alloy lines and W studs

P. S. Ho, M. B. Small, C-K. Hu, 1992 .

Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints

Paul S. Ho, Min Ding, Seung-Hyun Chae, 2006 .

Moisture Transport and its Effects on Fracture Strength and Dielectric Constant of Underfill Materials

K. Lu, J. Im, P. Ho, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

K. Lu, P. Ho, Xuefeng Zhang, 2006 .

Electromigration lifetime statistics for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

K. Lu, P. Ho, Xuefeng Zhang, 2006, 56th Electronic Components and Technology Conference 2006.

Effects of Sn grain structure on the electromigration of Sn−Ag solder joints

Paul S. Ho, Seung-Hyun Chae, Jay Im, 2012 .

Impact of Cu/low-k interconnect design on chip package interaction in flip chip package

Paul S. Ho, Xuefeng Zhang, P. Ho, 2009 .

Chip-packaging interaction: a critical concern for Cu/low k packaging

Guotao Wang, Paul S. Ho, Steven Groothuis, 2005, Microelectron. Reliab..

Low temperature interdiffusion in Cu/Ni thin films

P. Ho, H. Lefakis, J. Cain, 1983 .

Summary Abstract: Auger study of interdiffusion in Cu/Ni thin films

P. Ho, J. Lewis, 1982 .

Deconvolution method for composition profiling by Auger sputtering technique

P. Ho, J. Lewis, 1976 .

Grain-boundary diffusion of Sn in Pb

K. K. Kim, P. Ho, D. Gupta, 1982 .

Thickness dependent mechanical behavior of submicron aluminum films

Paul S. Ho, P. Ho, Young-Seok Kang, 1997 .

Film Thickness Effect on Tensile Properties and Microstructures of Submicron Aluminum Thin Films on Polyimide

P. Ho, J. Tregilgas, Y. Kang, 1996 .

Size effect on the electron wind force for electromigration at the top metal-dielectric interface in nanoscale interconnects

P. Ho, Zhuojie Wu, 2012 .

Electromigration threshold for Cu/low k interconnects

Ki-Don Lee, P. Ho, Ki-Don Lee, 2003, Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695).

Electromigration reliability of dual-damascene Cu/porous methylsilsesquioxane low k interconnects

Paul S. Ho, Ennis T. Ogawa, Ki-Don Lee, 2003 .

Electromigration and void observation in silver

P. Ho, H. B. Huntington, Paul S Ho, 1966 .

Materials effects on reliability of FC-PBGA packages for Cu/low-k chips

P. Ho, Li Li, Min Ding, 2006, 56th Electronic Components and Technology Conference 2006.

Electromigration in Al/W and Al(Cu)/W Interconnect Structures

P. Ho, M. Small, C. Hu, 1991 .

An in situ Auger electron spectroscopy study of chromium thin film coverage of copper surfaces: Effects of surface morphology, temperature and environment

P. Ho, Harry Lefakis, Harry Lefakis, 1991 .

Grain‐boundary solute electromigration in polycrystalline films

P. S. Ho, J. K. Howard, P. Ho, 1974 .

Reliability of Cu pillar bumps for flip-chip packages with ultra low-k dielectrics

K. Lu, J. Im, P. Ho, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Processing Effect on Via Extrusion for TSVs in Three-Dimensional Interconnects: A Comparative Study

Tengfei Jiang, Rui Huang, P. Ho, 2016, IEEE Transactions on Device and Materials Reliability.

Through-silicon via stress characteristics and reliability impact on 3D integrated circuits

Tengfei Jiang, Paul S. Ho, Rui Huang, 2015 .

Materials Issues and Characterization of Low-k Dielectric Materials

Paul S. Ho, Andrew J. McKerrow, E. T. Ryan, 1997 .

Simultaneous measurement of Young’s modulus, Poisson ratio, and coefficient of thermal expansion of thin films on substrates

Paul S. Ho, Michael Morgen, P. Ho, 2000 .

Current Carrying Capability of Sn0.7Cu Solder Bumps in Flip Chip Modules for High Power Applications

P. Ho, Jin-wook Jang, Seung-Hyun Chae, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

An evaluation of electromigration performance of SnPb and Pb-free flip chip solder joints

Peng Su, Min Ding, P. Ho, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Solute effects on electromigration

Paul S. Ho, P. Ho, 1973 .

Analysis and modeling verification for thermal-mechanical deformation in flip-chip packages

Paul S. Ho, Xiang Dai, P. Ho, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Characterization of plasticity and stresses in TSV structures in stacked dies using synchrotron x-ray microdiffraction

Tengfei Jiang, J. Im, H.-Y Son, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Stress-induced phenomena in metallization

Paul S. Ho, C. Y. Li, P. Ho, 1994 .

Packaging effect on reliability of Cu/low k interconnects

Guotao Wang, P.S. Ho, S. Groothuis, 2004, 2004 IEEE Workshop on Microelectronics and Electron Devices.

Simulating package behavior under power dissipation using uniform thermal loading

P. S. Ho, P. Ho, J. Wakil, 2001 .

Nonuniform temperature and strain fields in a powered package

Paul S. Ho, J. Wakil, P. Ho, 2000 .

Effect of nonuniform temperature on thermal modeling and strain distribution in electronic packaging

Paul S. Ho, J. Wakil, P. Ho, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

Materials reliability issues in microelectronics

F. G. Yost, P. S. Ho, J. R. Lloyd, 1991 .

A study of electromigration failure in Pb-free solder joints

Peng Su, Min Ding, P. Ho, 2005, 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual..

Wheatstone bridge method for electromigration study of solder balls in flip-chip packages

Paul S. Ho, Min Ding, R. Master, 2003, 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual..

Kinetic study of intermetallic growth and its reliability implications in Pb-free Sn-based microbumps in 3D integration

J. Im, P. Ho, Seung-Hyun Chae, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Kinetic Analysis of Current Enhanced Intermetallic Growth and Its Effect on Electromigration Reliability of Solder Joints

K. Lu, P. Ho, Xuefeng Zhang, 2006, 2006 IEEE International Reliability Physics Symposium Proceedings.

Origin of the carbon 1s-core level shifts in polyimide model compounds

P. Ho, P. Sanda, B. Silverman, 1985 .

The Effect of Curing on the Thermomechanical Properties of BPDA-PDA Polyimide Thin Films

P. Ho, J. Leu, Y. Kang, 1993 .

Morphological effects on the materials properties of polyimides

P. Ho, J. Leu, T. Poon, 1993 .

Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias

Tengfei Jiang, Rui Huang, Jay Im, 2013, Microelectron. Reliab..

Electromigration reliability of dual damascene Cu/CVD SiOC interconnects

R. Augur, M. Tsai, W. Yeh, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

Synchrotron X-Ray Microdiffraction Investigation of Scaling Effects on Reliability for Through-Silicon Vias for 3-D Integration

N. Tamura, Tengfei Jiang, P. Ho, 2019, IEEE Transactions on Device and Materials Reliability.

Chemical bonding and reactions at the Pd/Si interface

Paul S. Ho, Gary W. Rubloff, J. E. Lewis, 1981 .

Thermal stress and glass transition of ultrathin polystyrene films

Paul S. Ho, P. Ho, Jie-Hua Zhao, 2000 .

Low-temperature solution growth of textured zinc oxide films for light trapping enhancement in thin film silicon solar cells

P. Ho, Alex Y. S. Lee, Lei Wang, 2014 .

Quantitative strain analysis of flip-chip electronic packages using phase-shifting moiré interferometry

Paul S. Ho, Ilyas Mohammed, P. Ho, 2001 .

Characterization of the Viscoelasticity of Molding Compounds in the Time Domain

Paul S. Ho, Darvin R. Edwards, Seung-Hyun Chae, 2010 .

Interfacial adhesion studies for step and flash imprint lithography

Li Tao, C. Grant Willson, Paul S. Ho, 2008, SPIE Advanced Lithography.

Plasticity mechanism for copper extrusion in through-silicon vias for three-dimensional interconnects

M. Kunz, N. Tamura, Tengfei Jiang, 2013 .

An Adaptive Machine Learning Method Based on Finite Element Analysis for Ultra Low-k Chip Package Design

P. Ho, Wei Li, Weishen Chu, 2021, IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Thermomechanical Reliability Challenges For 3D Interconnects With Through-Silicon Vias

Paul S. Ho, Suk-Kyu Ryu, Rui Huang, 2010 .

O2 plasma damage and dielectric recoveries to patterned CDO low-k dielectrics

P. Ho, M. D. Goodner, M. Moinpour, 2009 .

Thermal conductivity and interfacial thermal resistance of polymeric low k films

Paul S. Ho, P. Ho, M. Kiene, 2001 .

Mechanical Stability of Air-gap Interconnects

Suk-kyu Ryu, Rui Huang, P. Ho, 2008 .

Development and characterization of a scalable microperforated device capable of long-term zero order drug release

P. Ho, S. Stavchansky, P. Bowman, 2010, Biomedical microdevices.

Extension of micro-Raman spectroscopy for full-component stress characterization of TSV structures

Qiu Zhao, P. S. Ho, J. Im, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

CHEMISTRY AND MICROSTRUCTURE AT METAL-POLYMER INTERFACES

P. Ho, B. Silverman, R. Haight, 1988 .

Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures

Wen-Jie Qi, Paul S. Ho, Jie-Hua Zhao, 2002, Microelectron. Reliab..

Microstructure-Based Stress Modeling of Tin Whisker Growth

Peng Su, Min Ding, P. Ho, 2006, IEEE Transactions on Electronics Packaging Manufacturing.

Schottky barrier formation at Pd, Pt, and Ni/Si(111) interfaces

G. Rubloff, P. Ho, G. Hollinger, 1983 .

Comparison study of catalyst nanoparticle formation and carbon nanotube growth: Support effect

P. Ho, Z. Yao, R. Nemanich, 2007 .

Controlled formation and resistivity scaling of nickel silicide nanolines

Li Shi, Bin Li, Zhiquan Luo, 2009, Nanotechnology.

Support Controlled Catalytic Chemical Vapor Deposition of Carbon Nanotubes

P. Ho, Z. Yao, R. Nemanich, 2007 .

Porosity effect on the dielectric constant and thermomechanical properties of organosilicate films

P. Ho, Robert D. Miller, W. Volksen, 2002 .

Extraction of trench geometry and linewidth of nanoscale grating targets in (110)-oriented silicon using angle-resolved scatterometry

Heather Patrick, Huai Huang, Thomas A. Germer, 2008, NanoScience + Engineering.

In situ transmission electron microscopy study of plastic deformation in passivated Al-Cu thin films

J. Stark, P. Ho, H. Kawasaki, 1997 .

Cr- and Cu-polyimide interface: chemistry and structure

P. Ho, B. Silverman, R. Haight, 1987 .

Summary Abstract: Schottky barrier formation at Pd/Si(111) and V/Si(111) interfaces

G. Rubloff, P. Ho, J. Clabes, 1982 .

Summary Abstract: Correlation between Schottky barrier height and phase stoichiometry/structure of silicide–silicon interfaces

P. Ho, T. Tan, P. Schmid, 1982 .

The formation of the Schottky barrier at the V/Si interface

G. Rubloff, P. Ho, J. Clabes, 1982 .

Electronic states and atomic structure at the Pd2Si–Si interface

G. Rubloff, P. Ho, H. Foll, 1981 .

Stoichiometric and structural origin of electronic states at the Pd2Si-Si interface

P. Ho, H. Foll, P. Schmid, 1981 .

Reactive Schottky barrier formation: The Pd/Si interface

G. Rubloff, P. Ho, T. Kuan, 1980 .

Chemical bonding and Schottky barrier formation at transition metal-silicon interfaces

P. Ho, 1983 .

Measurement of interface states in palladium silicon diodes

P. Ho, H. Evans, E. Yang, 1986 .

Thermal diffusivity measurement of polymeric thin films using the photothermal displacement technique. I. Free-standing film case

P. Ho, E. Ogawa, Chuan Hu, 1999 .

Adhesion Strength and Deformation Behavior of Al(Cu-Si)/BPDA-PDA Layered Structures

J. Wetzel, P. Ho, E. Ogawa, 1997 .

Contact reactions in Pd/GaAs junctions

P. Ho, J. Woodall, H. Hövel, 1979 .

Atomic Structure of the Epitaxial Al/Si Interface

P. Ho, F. Legoues, W. Krakow, 1984 .

Adhesion and fracture analysis of metal/polyimide fine line structures

P. Ho, J. Leu, T. Poon, 1994 .

Grain Growth in Vapor Deposited Aluminium Alloys

P. Ho, U. Köster, 1986 .

Temperature Dependence of Stress Relaxation at the Copper/Polyimide Interface

P. Ho, C. Yang, H. Tong, 1986 .

Chip Package Interaction analysis for Cu/Ultra low-k large die Flip Chip Ball Grid Array

P. Ho, C. Uchibori, P.S. Ho, 2008, 2008 IEEE 9th VLSI Packaging Workshop of Japan.

Microstructure Evolution and Effect on Resistivity for Cu Nanointerconnects and Beyond

P. Ho, Laura Spinella, Szu-Tung Hu, 2018, International Electron Devices Meeting.

Grain structure analysis and effect on electromigration reliability in nanoscale Cu interconnects

Oliver Aubel, Paul S. Ho, Linjun Cao, 2013 .

Stress relaxation during thermal cycling in metal/polyimide layered films

Franz Faupel, Paul S. Ho, P. Ho, 1988 .

Reaction Kinetics, Stress And Microstructure In Titanium-Copper-Titanium Thin Films

J. Wetzel, P. Ho, D. Gupta, 1985 .

Investigation of residual stress in wafer level interconnect structures induced by wafer processing

S. Groothuis, P. Ho, S. Groothuis, 2006, 56th Electronic Components and Technology Conference 2006.

Electrical and Mechanical Characteristics of Air-Bridge Cu Interconnects

J. Im, P. Ho, M. Kraatz, 2009 .

Silicide-Silicon Interface States +

P. Ho, H. Evans, E. Yang, 1985 .

Oxide characterization and behavior at CuCu and CuCuOx interfaces

P. Ho, Harry Lefakis, 1986 .

Effect of Hydrogen on Thermal Stress in Layered Structure of Ti and Ti(Al) Thin Films.

P. Ho, D. Gupta, Chenming Hu, 1988 .

Characteristics of thermal stresses in Al(Cu) fine lines. II. Passivated line structures

P. Ho, I. Yeo, S. Anderson, 1995 .

Numerical simulations and experimental measurements of stress relaxation by interface diffusion in a patterned copper interconnect structure

P. Ho, A. Bower, S. Shankar, 2005 .

Investigation of thermo-mechanical stresses and reliability of 3D die-stack structures by synchrotron x-ray micro-diffraction

Tengfei Jiang, Jian Li, Peng Su, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Rheological analysis of an underfill material

P. Ho, I. Rasiah, M. Manoharan, 1998, Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235).

Fabrication and characterization of patterned single-crystal silicon nanolines.

Bin Li, Kuan Lu, Rui Huang, 2008, Nano letters.

Impact of Process Induced Stresses and Chip-Packaging Interaction on Reliability of Air-gap Interconnects

Paul S. Ho, Suk-Kyu Ryu, Rui Huang, 2008, 2008 International Interconnect Technology Conference.

Investigation of Mechanical Reliability of Cu/low-k Multi-layer Interconnects in Flip Chip Packages

T. Nakamura, Xuefeng Zhang, P. Ho, 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

Thermo-mechanical deformation of underfilled flip-chip packaging

P. S. Ho, Xiang Dai, P. Ho, 1997, Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium.

Low-Dielectric-Constant Materials for ULSI Interlayer-Dielectric Applications

Paul S. Ho, P. Ho, W. Lee, 1997 .

Role of ions, photons, and radicals in inducing plasma damage to ultra low-k dielectrics

Paul S. Ho, Michael D. Armacost, Hualiang Shi, 2012 .

Electromigration critical length effect in Cu/oxide dual-damascene interconnects

Paul S. Ho, Ennis T. Ogawa, Hideki Matsuhashi, 2001 .

Molecular-dynamics studies of grain-boundary diffusion. I. Structural properties and mobility of point defects

Thomas Kwok, Paul S. Ho, Sidney Yip, 1984 .

Integration and reliability of ultra thin silicon solar cells and modules fabricated using SOM ® technology

S. Banerjee, P. Ho, S. Saha, 2013, PVSC 2013.

Analysis of grain boundary diffusion in bimetallic thin film structures using Auger electron spectroscopy

J. K. Howard, P. Ho, H. Wildman, 1974 .

Second-harmonic microscopy of strain fields around through-silicon-vias

Tengfei Jiang, P. Ho, B. Mendoza, 2016 .

Adhesion and deformation study of metal/polymer structures by a stretch deformation method

P. Ho, F. Faupel, 1988 .

Effect of Dicing Technique on the Fracture Strength of Si Dies With Emphasis on Multimodal Failure Distribution

Seung-Hyun Chae, P. Ho, D. Edwards, 2010, IEEE Transactions on Device and Materials Reliability.

Measurement of elastic modulus, Poisson ratio, and coefficient of thermal expansion of on-wafer submicron films

Paul S. Ho, Andrew J. McKerrow, P. Ho, 1999 .

Electromigration failure due to interfacial diffusion in fine Al alloy lines

Paul S. Ho, M. B. Small, Kenneth P. Rodbell, 1993 .

Mode II electromigration failure mechanism in Sn-based Pb-free solder joints with Ni under-bump metallization

P. Ho, Yiwei Wang, 2013 .

Thermomechanical reliability of through-silicon vias in 3D interconnects

Paul S. Ho, Suk-Kyu Ryu, Rui Huang, 2011, 2011 International Reliability Physics Symposium.

Thermomechanical Failure Analysis of Through-Silicon Via Interface Using a Shear-Lag Model With Cohesive Zone

Tengfei Jiang, Paul S. Ho, Suk-Kyu Ryu, 2014, IEEE Transactions on Device and Materials Reliability.

Thermal Stress in 3-d Packaging

Tengfei Jiang, J. Im, Rui Huang, 2022 .

In-situ XPS Study of ALD Ta(N) Barrier Formation on Organosilicate Dielectric Surface

P. Ho, M. Scharnberg, Junjun Liu, 2004 .

Grain boundary diffusion of aluminum in polycrystalline silicon films

P. S. Ho, J. E. Lewis, P. Ho, 1980 .

Statistics of microstructure for via metallization and implication for electromigration reliability

P. S. Ho, P. Ho, H. Toyoda, 1998, 1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173).

Nano-opto-mechanical characterization of neuron membrane mechanics under cellular growth and differentiation

Bin Li, Jae Young Lee, Kazunori Hoshino, 2008, Biomedical microdevices.

On-wafer characterization of thermomechanical properties of dielectric thin films by a bending beam technique

P. Ho, Jie-Hua Zhao, A. Mckerrow, 2000 .

Effect of scaling copper through-silicon vias on stress and reliability for 3D interconnects

N. Tamura, Tengfei Jiang, P. Ho, 2016, 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).

Study on Factors Affecting Underfill Flow and Underfill Voids in a Large-die Flip Chip Ball Grid Array (FCBGA) Package

K. H. Chua, P. Ho, Z. Xiong, 2007, 2007 9th Electronics Packaging Technology Conference.

Alumina-Ti Interface Reactions Studied By AES And UPS

G. Rubloff, P. Ho, H. Lefakis, 1985 .

Nanoindentation of Si Nanostructures: Buckling and Friction at Nanoscales

J. Im, Rui Huang, P. Ho, 2009 .

Effect of Wiring Density and Pillar Structure on Chip Packaging Interaction for Mixed-Signal Cu Low k Chips

Tengfei Jiang, P. Ho, Weishen Chu, 2021, IEEE Transactions on Device and Materials Reliability.

Planarization for reverse-tone step and flash imprint lithography

C. Grant Willson, Paul S. Ho, Michael W. Lin, 2006, SPIE Advanced Lithography.

Statistical analysis of electromigration lifetimes and void evolution

Hisao Kawasaki, Paul S. Ho, Martin Gall, 2004 .

Reliability and fracture of metal-polymer structures with fine-line geometries (packaging)

P. Ho, R. Acosta, S. Chiu, 1990, IEEE International Symposium on Circuits and Systems.

Metal‐amorphous silicon‐silicon tunnel rectifier

P. Ho, E. Yang, Q. Hua, 1984 .

Electromigration study of Al/low dielectric constant polymer and Al/SiO2 dioxide line structures

Paul S. Ho, P. Ho, R. Fox, 1998 .

Molecular-dynamics studies of grain-boundary diffusion. II. Vacancy migration, diffusion mechanism, and kinetics

P. Ho, S. Yip, T. Kwok, 1984 .

Electromigration Damage in Fine Al Alloy Lines due To Interfacial Diffusion

P. Ho, N. Mazzeo, M. Small, 1993 .

Chemistry in the Initial Formation of Nitride Barriers on Low-K Dielectrics

J. Im, P. Ho, P. Abramowitz, 2002 .

Electromigration Study of Ai/Low K Dielectric Line Structures

Paul S. Ho, P. Ho, R. Fox, 1998 .

Development and characterization of a scalable microperforated device capable of long-term zero order drug release

P. Ho, S. Stavchansky, P. Bowman, 2010, Biomedical microdevices.

Oxygen-induced bi-modal failure phenomenon in SiOx-based resistive switching memory

Li Ji, Fei Zhou, Yao-Feng Chang, 2013 .

Study of out-of-plane elastic properties of PMDA-ODA and BPDA-PDA polyimide thin films

Paul S. Ho, P. Ho, R. Willecke, 1998 .

Thermal stress and debonding in Cu/low k damascene line structures

Paul S. Ho, P. Ho, Guotao Wang, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Study of chip-package interaction and crackstop structures for Cu/ultra low-k interconnects

Paul S. Ho, Rui Huang, Xuefeng Zhang, 2009 .

Effects of passivation layer on stress relaxation in Cu line structures

P. Ho, A. Bower, J. Leu, 2003, Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695).

Chip Package Interaction and mechanical reliability impact on Cu/ultra low-k interconnects in Flip Chip package

Xuefeng Zhang, P. Ho, Xuefeng Zhang, 2008, 2008 9th International Conference on Solid-State and Integrated-Circuit Technology.