J. Lau
发表
S. Yoon,
S. W. Ho,
Qiaoer Zhou,
2008,
2008 58th Electronic Components and Technology Conference.
P. Tzeng,
M. Kao,
J. Lau,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
J. Lau,
T. Yue,
2009,
2009 59th Electronic Components and Technology Conference.
J. H. Lau,
C. A. Keely,
J. Lau,
1989,
Proceedings., 39th Electronic Components Conference.
J. Lau,
Robert E. Millert,
1981
.
John H. Lau,
J. Lau,
1993
.
Siow Pin Tan,
J. Lau,
K. Toh,
2010,
IEEE Transactions on Components and Packaging Technologies.
V. N. Sekhar,
D. Kwong,
V. Kripesh,
2009,
2009 59th Electronic Components and Technology Conference.
J. Lau,
2011,
2011 International Symposium on Advanced Packaging Materials (APM).
C. Selvanayagam,
Xiaowu Zhang,
J. Lau,
2009,
IEEE Transactions on Advanced Packaging.
D. Kwong,
S. W. Ho,
V. Kripesh,
2009,
2009 59th Electronic Components and Technology Conference.
J. Lau,
C. Premachandran,
Chengkuo Lee,
2009
.
J. Lau,
P. Engel,
J. Lau,
1993
.
J. Lau,
Y. Pao,
1996
.
J. Lau,
S. Pan,
Chris Chang,
2000,
Packaging of Electronic and Photonic Devices.
J. Lau,
S. Pan,
Z. Mei,
2002
.
J. Lau,
S. Lee,
2002
.
J. Lau,
D. Shangguan,
W. Dauksher,
2004
.
P. Vianco,
J. Lau,
J. Lau,
2003,
53rd Electronic Components and Technology Conference, 2003. Proceedings..
J. Lau,
1994
.
Qing Xin Zhang,
D. Kwong,
V. Sundaram,
2009
.
M. Kao,
W. Lo,
J. Lau,
2014,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
N. Lee,
J. Lau,
2020
.
D. Pinjala,
J. H. Lau,
V. Kripesh,
2013,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. H. Lau,
J. Lau,
J. Lau,
1995,
Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium.
J. Lau,
2021
.
J. Lau,
2021
.
J. Lau,
1993
.
J. H. Lau,
Thomas H. Baker,
J. Lau,
1996
.
J. Lau,
Chih Chen,
Chris Chang,
1999
.
J. Lau,
S. Lee,
J. Lau,
2000,
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
J. H. Lau,
J. Lau,
S. Lee,
2000
.
John H. Lau,
J. Lau,
S. Lee,
2001
.
John H. Lau,
J. Lau,
S. Lee,
2002
.
A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints
John H. Lau,
Chris Chang,
Stephen H. Pan,
2000,
Packaging of Electronic and Photonic Devices.
J. Lau,
S. Pan,
Chris Chang,
2000,
Packaging of Electronic and Photonic Devices.
J. Lau,
D. Shangguan,
Ricky S. W. Lee,
2004
.
J. Lau,
S. Lee,
D. Shangguan,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
John H. Lau,
Dongkai Shangguan,
Walter Dauksher,
2004
.
John H. Lau,
Walter Dauksher,
J. Lau,
2005
.
J. Lau,
W. Dauksher,
2005
.
J. Lau,
D. Shangguan,
W. Dauksher,
2005
.
J. Lau,
S. Lee,
D. Shangguan,
2006,
56th Electronic Components and Technology Conference 2006.
John H. Lau,
S. W. Ricky Lee,
J. Lau,
2010
.
John H. Lau,
S. W. Ricky Lee,
J. Lau,
2011
.
J. Lau,
Peter A. Engel,
J. Lau,
2014
.
J. Lau,
Qinglong Zhang,
Ming Li,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
N. Lee,
J. Lau,
C. Ko,
2017
.
N. Lee,
J. Lau,
C. Ko,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
John H. Lau,
Ming Li,
Cao Xi,
2017
.
John H. Lau,
J. Lau,
2018
.
J. Lau,
J. Lo,
C. Ko,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
K. Vaidyanathan,
S.K.W. Seah,
C. Selvanayagam,
2008,
2008 58th Electronic Components and Technology Conference.
John H. Lau,
J. Lau,
2010,
2010 12th Electronics Packaging Technology Conference.
J. Lau,
J. Chandrappan,
Z. Jing,
2010,
IEEE Transactions on Advanced Packaging.
N. Lee,
J. Lau,
2020
.
N. Lee,
J. Lau,
2020
.
D. Kwong,
V. Sundaram,
R. Tummala,
2012,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
D. Kwong,
V. Sundaram,
C. Selvanayagam,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
N. Lee,
J. Lau,
J. Lo,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
J. Lau,
2019,
Journal of Electronic Packaging.
J. Lau,
2018
.
J. Lau,
2018
.
J. Lau,
2018
.
J. Lau,
2018,
2018 International Wafer Level Packaging Conference (IWLPC).
J. Lau,
Che-yu Li,
R. Subrahmanyan,
1993
.
J. Lau,
S. Erasmus,
G. Dody,
1992
.
J. Lau,
2018
.
John Hon-Shing Lau,
J. Lau,
2009
.
J. Lau,
2019,
Heterogeneous Integrations.
J. Lau,
D. Rice,
1990,
40th Conference Proceedings on Electronic Components and Technology.
J. Lau,
J. Lo,
C. Ko,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
J. Lau,
S. Erasmus,
J. Lau,
1993
.
J. Lau,
2017
.
J. Lau,
Qinglong Zhang,
Ming Li,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
C. Ouyang,
J. Lau,
S. Lee,
1999,
1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).
J. Glazer,
J. Lau,
M. Heydinger,
1994,
Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium.
J. Lau,
1994
.
J. H. Lau,
J. Lau,
C. Chang,
1998,
1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).
J. Lau,
C. Chang,
2002
.
J. Lau,
J. Lau,
C. Chang,
2000,
Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146).
Ramkumar Veppathur Mohan,
D. Kwong,
J. Lau,
2009,
IEEE Transactions on Components and Packaging Technologies.
J. Lau,
K. Chen,
1997
.
J. Lau,
1991
.
J. Lau,
Y. Pao,
S. Erasmus,
1994
.
J. Lau,
S. Erasmus,
D. Rice,
1991
.
J. Lau,
S. Ottoboni,
J. Gleason,
1993,
Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium.
S. Yoon,
T. Lim,
J. Lau,
2009,
IEEE Transactions on Advanced Packaging.
J. Lau,
T. Chai,
W.H. Zhu,
2008,
2008 58th Electronic Components and Technology Conference.
N. Lee,
J. Lau,
J. Lo,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. Lau,
C. Ko,
R. Beica,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. H. Lau,
J. Lau,
1984
.
John Hon Shing Lau,
L. L. Moresco,
J. Lau,
1988
.
J. Lau,
1990,
InterSociety Conference on Thermal Phenomena in Electronic Systems.
J. Lau,
C. Harkins,
1990
.
J. Lau,
S. Lee,
C. Chang,
1999,
Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330).
J. Lau,
W. Dauksher,
B. Sullivan,
2008
.
N. Lee,
J. Lau,
2020
.
J. Lau,
K. Vaidyanathan,
G. Sharma,
2008,
2008 10th Electronics Packaging Technology Conference.
J. Lau,
1981
.
J. Lau,
Y. Pao,
S. Erasmus,
1992,
Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium.
J. Lau,
J. Lau,
Y. Pao,
1992
.
N. Lee,
J. Lau,
2020
.
J. Lau,
A. Jeans,
1989
.
M. Tang,
J. Lau,
Jing Zhang,
2008,
ICAIT '08.
J. Lau,
Chris Chang,
1999
.
John H. Lau,
Jing Li,
Teck Guan Lim,
2008,
SPIE OPTO.
J. Lau,
2019,
Heterogeneous Integrations.
J. Lau,
2019,
Heterogeneous Integrations.
Chengkuo Lee,
John H. Lau,
Chee Lip Gan,
2009
.
J. H. Lau,
Ming-Jer Kao,
Tzu-Kun Ku,
2012,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. H. Lau,
D. Rice,
J. Kral,
1988
.
John H. Lau,
Ying Ying Lim,
K. Y. Au,
2009,
2009 59th Electronic Components and Technology Conference.
Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills
J. H. Lau,
S. W. Ricky Lee,
J. Lau,
2000
.
John H. Lau,
S. W. Ricky Lee,
J. Lau,
2000
.
J. H. Lau,
Chien Ouyang,
C. Ouyang,
1999
.
John H. Lau,
J. Lau,
D. W. Rice,
1985
.
John H. Lau,
Ning-Cheng Lee,
N. Lee,
2020
.
J. Lau,
D. Shangguan,
W. Dauksher,
2009,
2009 59th Electronic Components and Technology Conference.
Gregory Henshall,
John H. Lau,
Jerry Gleason,
2008
.
J. Lau,
Y. Pao,
D. Gilbert,
1993,
Electronic Components and Technology Conference.
J. Lau,
S. Erasmus,
P. Boysan,
1992,
1992 Proceedings 42nd Electronic Components & Technology Conference.
John H. Lau,
Ning-Cheng Lee,
John Lau,
2002
.
John H. Lau,
Richard J. Prosman,
J. Lau,
1995
.
J. Lau,
S. Lee,
2000
.
J. Lau,
S. Erasmus,
T. Marcotte,
1993
.
Jing Li,
John H. Lau,
Jing Zhang,
2008,
SPIE OPTO.
John H. Lau,
J. Lau,
2006
.
John H. Lau,
Dongkai Shangguan,
Walter Dauksher,
2004
.
J. Lau,
S. Lee,
2003
.
John H. Lau,
S. W. Ricky Lee,
J. Lau,
2002
.
John H. Lau,
J. Lau,
S. Lee,
2001,
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
John H. Lau,
J. Lau,
2001
.
John H. Lau,
S. W. Ricky Lee,
J. Lau,
2001
.
J. Lau,
Chris Chang,
D. Lin,
2000
.
J. Lau,
S. Pan,
2000
.
J. Lau,
Tony Chen,
1999
.
John H. Lau,
Tony Chen,
Tai-Yu Chou,
1999
.
John H. Lau,
Tony Chen,
David Cheng,
1998
.
K. L. Chen,
J. Lau,
F. Wu,
1998
.
John H. Lau,
S. W. Ricky Lee,
J. Lau,
1998
.
Tai-Yu Chou,
J. H. Lau,
J. Lau,
1998
.
J. H. Lau,
J. Lau,
1998
.
J. H. Lau,
J. Lau,
1997
.
J. Lau,
S. Lee,
1997
.
J. Lau,
Kuan-Luen Chen,
F. Wu,
1997,
1997 Proceedings 47th Electronic Components and Technology Conference.
J.H. Lau,
J. Lau,
1997,
IEMT/IMC Symposium, 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference].
J. Lau,
S. Lee,
1997
.
J. Lau,
J. Lau,
T. Chen,
1997
.
John H. Lau,
J. Lau,
1993
.
Wataru Nakayama,
John H Lau,
J. Lau,
1998
.
J. H. Lau,
J. Lau,
1996
.
John H. Lau,
S. W. Ricky Lee,
J. Lau,
2001
.
J. Lau,
2019,
Heterogeneous Integrations.
John H. Lau,
J. Lau,
2016
.
John H. Lau,
J. Lau,
2011
.
J. Lau,
Chris Chang,
Tony Chen,
1999
.
John H. Lau,
Tony Chen,
Shi-Wei Ricky Lee,
1999
.
J. Lau,
Y. Zou,
S. Camerlo,
2002
.
D.C. O'Brien,
J. Lau,
G. Faulkner,
1999,
1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).
N. Lee,
J. Lau,
2020
.
Chengkuo Lee,
Aibin Yu,
Daquan Yu,
2009
.
Chengkuo Lee,
Won Kyoung Choi,
Aibin Yu,
2008,
2008 58th Electronic Components and Technology Conference.
John H. Lau,
Chau-Jie Zhan,
Shin-Yi Huang,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
John H. Lau,
J. Lau,
2011
.
J. Lau,
C. Harkins,
1988,
Fifth IEEE/CHMT International Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle.
J. Lau,
D. Rice,
J. Kral,
1987,
25th International Reliability Physics Symposium.
J. Lau,
J.H. Lau,
G. Harkins,
1988,
38th Electronics Components Conference 1988., Proceedings..
J. Lau,
Y. Pao,
W. Jung,
1997
.
Hyuck-Mo Lee,
S. Yoon,
J. Lau,
2008,
2008 58th Electronic Components and Technology Conference.
J. Lau,
D. Rice,
J. Lau,
1987
.
J. Lau,
L. Powers,
J. Baker,
1989,
Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium,.
J. H. Lau,
G. Barrett,
J. Lau,
1987
.
J. Lau,
C. K. Hu,
1985
.
J. Lau,
T. T. Lau,
1984
.
J. Lau,
C.-K. Hu,
1984
.
J. Lau,
C. K. Hu,
1984
.
J. Lau,
T. T. Lau,
S. S. Jung,
1984
.
John H. Lau,
J. Lau,
1981
.
J. Lau,
G. Listvinsky,
1981
.
J. Lau,
1981
.
Chengkuo Lee,
John H. Lau,
Daquan Yu,
2009
.
Chengkuo Lee,
John H. Lau,
Won Kyoung Choi,
2009
.
S. Erasmus,
J. Lau,
D. W. Rice,
1990
.
J. Lau,
J. Lau,
M. Kelly,
1995
.
A. Kumar,
D. Pinjala,
J. H. Lau,
2011,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. H. Lau,
M. Kao,
J. Lau,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
J. H. Lau,
J. Lau,
C. Chang,
1998
.
Xiaowu Zhang,
V. Kripesh,
N. Khan,
2010,
IEEE Transactions on Components and Packaging Technologies.
John H. Lau,
Matthew Ming Fai Yuen,
Philip C. H. Chan,
2010
.
John H. Lau,
Puru Bruce Lin,
Cheng-Ta Ko,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
John H. Lau,
J. Lau,
2014
.
John H. Lau,
Tang Gong Yue,
J. Lau,
2012,
Microelectron. Reliab..
John H. Lau,
J. Lau,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
John H. Lau,
Aibin Yu,
Vaidyanathan Kripesh,
2009,
2009 59th Electronic Components and Technology Conference.
John H. Lau,
V. Kripesh,
Shiguo Liu,
2009,
2009 59th Electronic Components and Technology Conference.
John H. Lau,
Nandar Su,
Vaidyanathan Kripesh,
2009,
2009 59th Electronic Components and Technology Conference.
D. Pinjala,
V. Kripesh,
Seung Wook Yoon,
2009,
IEEE Transactions on Components and Packaging Technologies.
D. Pinjala,
N. Khan,
K. Vaidyanathan,
2008,
2008 10th Electronics Packaging Technology Conference.
John H. Lau,
Teck Guan Lim,
Ying Ying Lim,
2009,
2009 59th Electronic Components and Technology Conference.
Chengkuo Lee,
John H. Lau,
Aibin Yu,
2009
.
J. Lau,
C. Ko,
Kai-Ming Yang,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. Lau,
1981
.
John H. Lau,
Chris Chang,
J. Lau,
2000
.
J. Lau,
J. Lo,
C. Ko,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
J. Lau,
T. T. Lau,
1982
.
J. Lau,
D. Shangguan,
W. Dauksher,
2005
.
John H. Lau,
Dongkai Shangguan,
Jerry Gleason,
2004
.
Khong Chee Houe,
Lim Ying Ying,
V. N. Sekhar,
2011,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. Lau,
C. Ko,
Kai-Ming Yang,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
John H. Lau,
Puru Bruce Lin,
Cheng-Ta Ko,
2020,
International Symposium on Microelectronics.
J. Lau,
C. Ko,
Kai-Ming Yang,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
J. Lau,
C. Ko,
Po-Chun Huang,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
John H. Lau,
J. Lau,
2021,
Advancing Microelectronics Magazine.
J. Lau,
J. Pang,
K. E. Tan,
2008,
2008 10th Electronics Packaging Technology Conference.
N. Lee,
J. Lau,
J. Pang,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
J. Lau,
Won Kyoung Choi,
Ling Xie,
2008,
2008 58th Electronic Components and Technology Conference.
J. Lau,
Ming Li,
Y. Cheung,
2015,
Electronic Components and Technology Conference.
A. Kumar,
V. Kripesh,
Zhang Xiaowu,
2008,
2008 58th Electronic Components and Technology Conference.
S. Yoon,
Xiaowu Zhang,
V. Kripesh,
2010,
IEEE Transactions on Advanced Packaging.
V. Kripesh,
Seung Wook Yoon,
Hnin Wai Yin,
2008,
2008 10th Electronics Packaging Technology Conference.
Chengkuo Lee,
John H. Lau,
Aibin Yu,
2008,
SPIE OPTO.
Chengkuo Lee,
John H. Lau,
Chee Lip Gan,
2008,
SPIE MOEMS-MEMS.
Kuo-Shu Kao,
Tai-Hong Chen,
John H. Lau,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
J. H. Lau,
Chris Chang,
S. W. Ricky Lee,
2000
.
J. Lau,
J. Glazer,
J. Lau,
1995
.
John H. Lau,
Xiaowu Zhang,
Vempati Srinivasa Rao,
2010,
Microelectron. Reliab..
Yu-Min Lin,
J. Lau,
C. Zhan,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
J. Lau,
P. Ramana,
T. Shioda,
2011,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
John H. Lau,
J. Lau,
2012,
2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.
John H. Lau,
Stephen H. Pan,
J. Lau,
2003
.
John H. Lau,
Kripesh Vaidyanathan,
C. T. Chong,
2009,
2009 11th Electronics Packaging Technology Conference.
J. Lau,
H. Chien,
Shang-Tsai Wu,
2012,
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Tai Chong Chai,
Shiguo Liu,
Yue Ying Ong,
2011,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Ren-Shin Cheng,
Tai-Hong Chen,
John H. Lau,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Jinglin Shi,
Teck Guan Lim,
Ying Ying Lim,
2010,
IEEE Transactions on Advanced Packaging.
Chengkuo Lee,
Won Kyoung Choi,
J. Lau,
2009,
IEEE Transactions on Components and Packaging Technologies.
J. Lau,
Chengkuo Lee,
Daquan Yu,
2008,
2008 10th Electronics Packaging Technology Conference.
John H Lau,
J. Lau,
2018,
2018 China Semiconductor Technology International Conference (CSTIC).
J. Lau,
J. Lo,
C. Ko,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
J. Lau,
2019,
Heterogeneous Integrations.
J. Lau,
Li Zhang,
K. Tan,
2017,
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
Sheng-Tsai Wu,
John H. Lau,
Heng-Chieh Chien,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
John H. Lau,
Ming-Jer Kao,
Tzu-Kun Ku,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Xiaowu Zhang,
V. Kripesh,
J. Lau,
2008,
2008 10th Electronics Packaging Technology Conference.
Dim-Lee Kwong,
Srinivasa Rao Vempati,
Kripesh Vaidyanathan,
2009,
2009 59th Electronic Components and Technology Conference.
John H. Lau,
J. Lau,
2019,
Heterogeneous Integrations.
John H. Lau,
J. Lau,
2019,
Heterogeneous Integrations.
John H. Lau,
J. Lau,
2018
.
N. Lee,
J. Lau,
J. Lo,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Sheng-Tsai Wu,
John H. Lau,
Heng-Chieh Chien,
2011
.
Yu-Min Lin,
J. Lau,
C. Zhan,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
John H. Lau,
J. Lau,
2018
.
John H. Lau,
P. Tzeng,
M. Kao,
2013
.
Sheng-Tsai Wu,
John H. Lau,
T.-H. Chen,
2011
.
John H. Lau,
Ming Li,
Cao Xi,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
M. Kao,
W. Lo,
J. Lau,
2013
.
John H. Lau,
J. Lau,
2019,
Heterogeneous Integrations.
J. Lau,
C.S. Premachandran,
J. Lau,
2008,
2008 10th Electronics Packaging Technology Conference.
John H. Lau,
Ming-Jer Kao,
Tzu-Kun Ku,
2011
.
John H. Lau,
J. Lau,
2010
.
M. Kao,
W. Lo,
J. Lau,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
John H. Lau,
J. Lau,
2012,
2012 14th International Conference on Electronic Materials and Packaging (EMAP).
J. H. Lau,
M. J. Kao,
S. S. Sheu,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
Kuo-Shu Kao,
J. H. Lau,
Chau-Jie Zhan,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
Kuo-Shu Kao,
Heng-Chieh Chien,
J. H. Lau,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
P. Tzeng,
M. Kao,
W. Lo,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
Design, fabrication, and calibration of stress sensors embedded in a TSV interposer in a 300mm wafer
Sheng-Tsai Wu,
Heng-Chieh Chien,
J. H. Lau,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
Sheng-Tsai Wu,
Heng-Chieh Chien,
J. H. Lau,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
J. Lau,
H. Chien,
Shang-Tsai Wu,
2012,
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
John H. Lau,
Ming-Jer Kao,
Shyh-Shyuan Sheu,
2012
.
J. H. Lau,
M. Brillhart,
Li Li,
2011
.
Kuo-Shu Kao,
J. H. Lau,
Chau-Jie Zhan,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
J. Lau,
V. S. Rao,
T. Chai,
2009,
2009 59th Electronic Components and Technology Conference.
Xiaowu Zhang,
R. Murthy,
W.H. Zhu,
2008,
2008 58th Electronic Components and Technology Conference.