B. Dunne

Via first approach optimisation for Through Silicon Via applications

C. Laviron, B. Dunne, V. Lapras, 2009, 2009 59th Electronic Components and Technology Conference.

Finite element method as applied to the study of gratings embedded in complementary metal-oxide semiconductor image sensors

Caroline Fossati, Mireille Commandre, Frédéric Zolla, 2009 .

Via First Technology Development Based on High Aspect Ratio Trenches Filled with Doped Polysilicon

X. Baillin, N. Sillon, D. Henry, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

High Aspect Ratio Vias First for Advanced Packaging

B. Dunne, V. Lapras, D. Henry, 2007, 2007 9th Electronics Packaging Technology Conference.

New test structure for high resolution leakage current and capacitance measurements in CMOS imager applications

B. Dunne, H. Brut, L. Grant, 2004, Proceedings of the 2004 International Conference on Microelectronic Test Structures (IEEE Cat. No.04CH37516).

The Finite Element Method as applied to the calculation of the quantum efficiency in optoelectronic imaging devices

Caroline Fossati, Guillaume Demesy, Mireille Commandre, 2008, NanoScience + Engineering.

How heat influences CIGSSe solar cells properties

Mirjam Theelen, Marco Giacomo Flammini, Nicola Debernardi, 2016, Optics + Photonics for Sustainable Energy.

The Influence of Heating Time and Temperature on the Properties of CIGSSe Solar Cells

B. Dunne, M. Theelen, N. Debernardi, 2016 .

Low-cost copper conductive grids for thin-film solar cells formed by screen printing and laser sintering

B. Dunne, A. Brunton, S. Henley, 2015, 2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC).

Microlens design for CMOS image sensor

Caroline Fossati, Mireille Commandre, Olivier Gagliano, 2005, SPIE Optical Systems Design.