S. Moreau
发表
C. Laviron,
B. Dunne,
V. Lapras,
2009,
2009 59th Electronic Components and Technology Conference.
P. Bleuet,
P. Cloetens,
S. Moreau,
2019,
IEEE Electron Device Letters.
S. Moreau,
D. Bouchu,
2013,
2013 IEEE International Reliability Physics Symposium (IRPS).
S. Moreau,
N. Sillon,
P. Chausse,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
S. Moreau,
L. Yahia,
M. Tabrizian,
2001,
International journal of pharmaceutics.
Lorena Anghel,
Patrick Leduc,
Lucile Arnaud,
2010,
2010 12th Electronics Packaging Technology Conference.
L. Arnaud,
L. Anghel,
F. Lorut,
2011,
2011 International Reliability Physics Symposium.
L. Arnaud,
L. Anghel,
T. Frank,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
N. Sillon,
S. Moreau,
G. Parès,
2011
.
N. Sillon,
D. Henry,
N. Bresson,
2010,
2010 12th Electronics Packaging Technology Conference.
peixiong zhao,
R. Reed,
M. Alles,
2020,
IEEE Electron Device Letters.
D. Veksler,
S. Moreau,
Y. Obeng,
2019,
ECS journal of solid state science and technology : JSS.
S. Moreau,
Y. Obeng,
U. Cvelbar,
2020,
Electroanalysis.
F. Fournel,
F. Gigon,
E. Deloffre,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
E. Deloffre,
V. Balan,
S. Moreau,
2020,
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
S. Moreau,
S. Fanget,
A. Pouydebasque,
2014
.
S. Moreau,
J. Charbonnier,
R. Hida,
2013,
2013 Eurpoean Microelectronics Packaging Conference (EMPC).
In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration
E. Deloffre,
E. Souchier,
S. Moreau,
2022,
Microelectronic Engineering.
S. Moreau,
S. Lhostis,
H. Combeau,
2022,
2022 IEEE International Reliability Physics Symposium (IRPS).
S. Moreau,
F. de Crécy,
V. Mandrillon,
2015,
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
S. Moreau,
P. Coudrain,
L. Di Cioccio,
2015,
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
S. Maitrejean,
S. Moreau,
G. Passemard,
2007
.
S. Moreau,
D. Bouchu,
G. Audoit,
2014,
Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Michel Moisan,
A. Ricard,
Stéphane Moreau,
2000
.
P. Chausse,
N. Sillon,
S. Moreau,
2010,
3rd Electronics System Integration Technology Conference ESTC.
S. Moreau,
R. Leroy,
T. Lequeu,
2005,
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
C. Ferrandon,
F. de Crecy,
S. Moreau,
2013,
2013 Eurpoean Microelectronics Packaging Conference (EMPC).
Pierre Montmitonnet,
Stéphane Moreau,
David Bouchu,
2015,
Microelectron. Reliab..
S. Moreau,
S. Lhostis,
D. Bouchu,
2022,
ECS Journal of Solid State Science and Technology.
Stéphane Moreau,
Léa Di Cioccio,
Thomas Signamarcheix,
2013,
2013 IEEE International 3D Systems Integration Conference (3DIC).
Stéphane Moreau,
Patrick Leduc,
Lucile Arnaud,
2013,
Microelectron. Reliab..
S. Moreau,
C. Dubarry,
B. Aventurier,
2021,
2021 IEEE International 3D Systems Integration Conference (3DIC).
L. Arnaud,
E. Deloffre,
A. Farcy,
2018,
2018 IEEE International Electron Devices Meeting (IEDM).
X. Garros,
O. Rozeau,
G. Ghibaudo,
2020,
2020 IEEE Symposium on VLSI Technology.
S. Moreau,
Y. Obeng,
P. Kabos,
2022,
IEEE Transactions on Electron Devices.
Stéphane Moreau,
Daniel Bellet,
Caroline Celle,
2016,
Nano letters.
Stéphane Moreau,
Stephane Fanget,
Christophe Poulain,
2013,
The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems.
S. Moreau,
N. Sillon,
G. Simon,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
Christophe Kopp,
Sofiane Soulimane,
Sébastien Bolis,
2012,
Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components.
Process optimization and performance analysis of an electrostatically actuated varifocal liquid lens
C. Kopp,
A. Pouydebasque,
N. Sillon,
2011,
2011 16th International Solid-State Sensors, Actuators and Microsystems Conference.
S. Moreau,
P. Chausse,
L. Vignoud,
2017,
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
S. Moreau,
D. Bouchu,
T. Mourier,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Pierric Gueguen,
Rachid Taibi,
Sebastien Mermoz,
2012
.
Stéphane Moreau,
E. Rolland,
F. Aussenac,
2014,
2014 International 3D Systems Integration Conference (3DIC).
S. Moreau,
S. Lhostis,
H. Frémont,
2021,
Microelectronics Reliability.
E. Deloffre,
E. Souchier,
S. Moreau,
2022,
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
S. Moreau,
S. Lhostis,
N. Bernier,
2021,
IEEE Electron Device Letters.
S. Maitrejean,
S. Moreau,
P. Leduc,
2008,
2008 10th Electronics Packaging Technology Conference.
S. Moreau,
F. Fournel,
F. Rieutord,
2022,
Journal of Applied Physics.
S. Moreau,
L. Sanchez,
P. Gueguen,
2014
.
Farid N. Najm,
Valeriy Sukharev,
Jun-Ho Choy,
2017,
2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD).