N. Sillon

发表

C. Laviron, B. Dunne, V. Lapras, 2009, 2009 59th Electronic Components and Technology Conference.

D. Henry, R. Anciant, N. Sillon, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

A. Toffoli, A. Roule, S. Maitrejean, 2008, 2008 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA).

D. Henry, N. Sillon, S. Chéramy, 2009, 2009 59th Electronic Components and Technology Conference.

D. Henry, N. Sillon, P. Chausse, 2009, 2009 11th Electronics Packaging Technology Conference.

D. Henry, N. Sillon, P. Chausse, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

C. Laviron, N. Sillon, E. Rolland, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

S. Moreau, N. Sillon, P. Chausse, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

N. Kernevez, M. Zussy, F. de Crecy, 2007, 2007 IEEE International Interconnect Technology Conferencee.

X. Baillin, C. Brunet-Manquat, N. Sillon, 2008, 2008 58th Electronic Components and Technology Conference.

A. Farcy, P. Ancey, G. Garnier, 2010, 3rd Electronics System Integration Technology Conference ESTC.

N. Sillon, D. Henry, N. Bresson, 2010, 2010 12th Electronics Packaging Technology Conference.

P. Brianceau, R. Anciant, N. Sillon, 2011, 2011 IEEE International Conference on IC Design & Technology.

Nicolas Sillon, Jean-Michel Hartmann, Hubert Moriceau, 2015 .

C. Gillot, N. Sillon, F. Lefèvre, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

C. Gillot, N. Sillon, J. Souriau, 2005, 2005 7th Electronic Packaging Technology Conference.

N. Sillon, P. Robert, A. Rouzaud, 2011 .

C. Gillot, N. Sillon, G. Parat, 2010, 3rd Electronics System Integration Technology Conference ESTC.

C. Gillot, N. Sillon, G. Parat, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

R. Anciant, N. Sillon, P. Coudrain, 2010, 2010 IEEE International Interconnect Technology Conference.

X. Baillin, N. Sillon, D. Henry, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

B. Dunne, V. Lapras, D. Henry, 2007, 2007 9th Electronics Packaging Technology Conference.

C. Brunet-Manquat, N. Sillon, D. Henry, 2008, 2008 2nd Electronics System-Integration Technology Conference.

D. Henry, N. Sillon, J. Charbonnier, 2009, 2009 59th Electronic Components and Technology Conference.

D. Henry, N. Sillon, J. Charbonnier, 2008, 2008 10th Electronics Packaging Technology Conference.

O. Faynot, M. Vinet, T. Ernst, 2008, 2008 IEEE International Conference on Electron Devices and Solid-State Circuits.

P. Chausse, N. Sillon, S. Moreau, 2010, 3rd Electronics System Integration Technology Conference ESTC.

Nicolas Sillon, Robert Baptist, N. Sillon, 2002 .

Maud Vinet, Alan Mathewson, Léa Di Cioccio, 2009, Proceedings of the IEEE.

N. Kernevez, M. Zussy, Zhihong Huang, 2007, 2007 IEEE International Interconnect Technology Conferencee.

A. Astier, P. Chausse, S. Cheramy, 2009, 2009 European Microelectronics and Packaging Conference.

L. Di Cioccio, N. Sillon, D. Henry, 2008, 2008 IEEE International Electron Devices Meeting.

Sophie Verrun, Jean Charbonnier, Nicolas Sillon, 2009, 2009 IEEE International Conference on 3D System Integration.

R. Anciant, A. Farcy, T. Lacrevaz, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

S. Moreau, N. Sillon, G. Simon, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

R. Anciant, N. Sillon, A. Pouydebasque, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

C. Kopp, A. Pouydebasque, N. Sillon, 2011, 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference.

N. Sillon, N. Sillon, M. Faivre, 2008, 2008 10th Electronics Packaging Technology Conference.

C. Brunet-Manquat, N. Sillon, D. Henry, 2006, 56th Electronic Components and Technology Conference 2006.

A. Farcy, P. Chausse, G. Garnier, 2009, 2009 11th Electronics Packaging Technology Conference.