L. Aryasomayajula

Development of new 2.5D package with novel integrated organic interposer substrate with ultra-fine wiring and high density bumps

K. Oi, Satoshi Otake, N. Shimizu, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Platinum decorated carbon nanotubes for highly sensitive amperometric glucose sensing

V. Varadan, L. Aryasomayajula, Jining Xie, 2007 .

Effect of nanomaterials in platinum-decorated carbon nanotube paste-based electrodes for amperometric glucose detection

V. Varadan, L. Aryasomayajula, Jining Xie, 2008 .

Material and electrochemical studies of platinum nanoparticle-coated carbon nanotubes for biosensing

V. Varadan, L. Aryasomayajula, Jining Xie, 2007, 2007 7th IEEE Conference on Nanotechnology (IEEE NANO).

Carbon Nanotube Composites for Electronic Packaging Applications: A Review

Klaus-Jurgen Wolter, Lavanya Aryasomayajula, L. Aryasomayajula, 2013 .

Carbon nanotube strain sensors for wearable patient monitoring applications

Vijay K. Varadan, Jose K. Abraham, Ashwin K. Whitchurch, 2008, SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring.

Foveros: 3D Integration and the use of Face-to-Face Chip Stacking for Logic Devices

D. Pantuso, A. Balankutty, D. Ingerly, 2019, 2019 IEEE International Electron Devices Meeting (IEDM).