B. Valek

发表

Scanning X-ray microdiffraction with submicrometer white beam for strain/stress and orientation mapping in thin films.

J. R. Patel, N. Tamura, R. Celestre, 2003, Journal of synchrotron radiation.

Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffraction

J. R. Patel, N. Tamura, K. Gadre, 2006 .

Quantitative characterization of electromigration-induced plastic deformation in Al(0.5wt%Cu) interconnect

J. R. Patel, N. Tamura, R. Spolenak, 2004 .

Quantitative analysis of dislocation arrangements induced by electromigration in a passivated Al (0.5 wt % Cu) interconnect

J. R. Patel, N. Tamura, R. Spolenak, 2003 .

Local plasticity of Al thin films as revealed by x-ray microdiffraction.

J. R. Patel, N. Tamura, R. Celestre, 2003, Physical review letters.

Submicron X-ray diffraction

J. R. Patel, N. Tamura, R. Celestre, 2000 .

Lawrence Berkeley National Laboratory Recent Work

J. R. Patel, N. Tamura, R. Celestre, 2001 .

Early stage of plastic deformation in thin films undergoing electromigration

J. R. Patel, N. Tamura, H. Padmore, 2003 .

Local Microstructure and Stress in Al(Cu) Thin Film Structures Studied by X-Ray Microdiffraction

J. R. Patel, N. Tamura, R. Celestre, 2001 .

Silica thin films applied to Ni-20Cr alloy via combustion chemical vapor deposition

B. Valek, J. M. Hampikian, 1997 .

Submicron X-ray diffraction and its applications to problems in materials and environmental science.

Howard A. Padmore, Alastair A. MacDowell, Richard Celestre, 2002 .

Coupling Between Precipitation and Plastic Deformation During Electromigration in a Passivated Al (0.5wt%Cu) Interconnect

J. R. Patel, N. Tamura, R. Spolenak, 2004 .

Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction

N. Tamura, B. Valek, J. Lloyd, 2004 .

Electromigration-induced plastic deformation in passivated metal lines

A. A. MacDowell, Richard Celestre, Ralph Spolenak, 2002 .

Plastic deformation in Al (Cu) interconnects stressed by electromigration and studied by synchrotron polychromatic X-ray microdiffraction

King-Ning Tu, Kai Chen, Nobumichi Tamura, 2008 .

Electromigration-Induced Plastic Deformation in Cu Damascene Interconnect Lines as Revealed by Synchrotron X-Ray Microdiffraction

J. R. Patel, N. Tamura, K. Gadre, 2006 .

Quantitative characterization of dislocation structure coupled with electromigration in a passivated Al(0.5wt% Cu) interconnect

J. R. Patel, R. Spolenak, B. Valek, 2003 .

Spatially resolved characterization of electromigration-induced plastic deformation in al (0.5wt percent cu) interconnect

J. R. Patel, N. Tamura, R. Spolenak, 2003 .

High spatial resolution grain orientation and strain mapping in thin films using polychromatic submicron X-ray diffraction

J. R. Patel, N. Tamura, R. Celestre, 2002 .

X-ray microdiffraction studies of mechanical behavior and electromigration in thin film structures

B. Valek, 2003 .

A Comparison of X-Ray Microdiffraction and Coherent Gradient Sensing in Measuring Discontinuous Curvatures in Thin Film: Substrate Systems

N. Tamura, A. Rosakis, B. Valek, 2006 .