B. Vandevelde

发表

In-depth Raman spectroscopy analysis of various parameters affecting the mechanical stress near the surface and bulk of Cu-TSVs

E. Beyne, V. Simons, I. De Wolf, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Impact of post-plating anneal and through-silicon via dimensions on Cu pumping

E. Beyne, K. Croes, H. Philipsen, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Impact of through silicon via induced mechanical stress on fully depleted Bulk FinFET technology

G. Beyer, E. Beyne, A. Thean, 2012, 2012 International Electron Devices Meeting.

Numerical and experimental characterization of the thermal behavior of a packaged DRAM-on-logic stack

E. Beyne, P. Marchal, G. Van der Plas, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV

B. Verlinden, R. Labie, B. Vandevelde, 2010 .

Design of Metal Interconnects for Stretchable Electronic Circuits using Finite Element Analysis

J. Vanfleteren, B. Vandevelde, Mario Gonzalez, 2007 .

Thermo-Mechanical FEM Analysis of Lead Free and Lead Containing Solder for Flip Chip Applications

J. Vanfleteren, B. Vandevelde, M. B. González, 2005 .

Design and performance of metal conductors for stretchable electronic circuits

J. Vanfleteren, B. Vandevelde, F. Bossuyt, 2008, 2008 2nd Electronics System-Integration Technology Conference.

Design and performance of metal conductors for stretchable electronic circuits

Bart Vandevelde, Jan Vanfleteren, Mario Gonzalez, 2008 .

Extraction of the Appropriate Material Property for Realistic Modeling of Through-Silicon-Vias using μ-Raman Spectroscopy

B. Swinnen, I. De Wolf, B. Vandevelde, 2008, 2008 International Interconnect Technology Conference.

Challenges for structural stability of ultra-low- k -based interconnects

F. Iacopi, K. Maex, Y. Travaly, 2004 .

FEM study of deformation and stresses in copper wire bonds on Cu lowK structures during processing

E. Beyne, B. Vandevelde, D. Degryse, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Mechanical FEM Simulation of bonding process on Cu lowK wafers

E. Beyne, B. Vandevelde, D. Degryse, 2004, IEEE Transactions on Components and Packaging Technologies.

Thermomechanical models for leadless solder interconnections in flip chip assemblies

Bart Vandevelde, Eric Beyne, Joris Peeters, 1998 .

Analysis of the Induced Stresses in Silicon During Thermcompression Cu-Cu Bonding of Cu-Through-Vias in 3D-SIC Architecture

E. Beyne, G. Eneman, S. Stoukatch, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Prediction of the Influence of Induced Stresses in Silicon on CMOS Performance in a Cu-Through-Via Interconnect Technology

E. Beyne, G. Eneman, P. Verheyen, 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints

B. Verlinden, B. Vandevelde, I. Wolf, 2009 .

Compact transient thermal models for the polymer stud grid array (PSGATM) package

Bart Vandevelde, Eric Beyne, Robert Mertens, 1997 .

Numerical comparison of the thermal performance of 3D stacking and Si interposer based packaging concepts

E. Beyne, G. Van der Plas, B. Vandevelde, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Delamination in BEOL: Analysis of interface failure by combined experimental & modeling approaches

B. Vandevelde, K. Vanstreels, M. Gonzalez, 2013, 2013 IEEE International Reliability Physics Symposium (IRPS).

Practical chip-centric electro-thermal simulations

R. Gillon, A. Srinivasan, B. Vandevelde, 2008, 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems.

Impact of thermal ageing on cohesive and adhesive strengths of overmould materials: Characterisation methods and implementation in FEM

A. Ivankovic, B. Vandevelde, K. Vanstreels, 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

characterisation methods and implementation in FEM

A. Ivankovic, B. Vandevelde, K. Vanstreels, 2011 .

Improved thermal fatigue reliability for flip chip assemblies using redistribution techniques

E. Beyne, B. Vandevelde, 2000, ECTC 2000.

Thermal fatigue reliability analysis of redistributed flip chip assemblies

E. Beyne, B. Vandevelde, B. Vandevelde, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Evaluation of structural degradation in packaged semiconductor components using a transient thermal characterisation technique

E. Beyne, B. Vandevelde, F. Christriaens, 1996 .

Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly

Nele Van Steenberge, Paresh Limaye, Geert Willems, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

Thermal analysis of AlGaN/GaN HEMTs

Bart Vandevelde, Wouter Ruythooren, Herman Oprins, 2005 .

Finite element modeling of solder joint fatigue in four-point bending test

I. De Wolf, B. Vandevelde, D. Vandepitte, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Electrical characterization, modeling and reliability analysis of a via last TSV

E. Beyne, B. Vandevelde, B. Majeed, 2010, 2010 12th Electronics Packaging Technology Conference.

Ultra-thin chip package (UTCP) for flexible electronics applications

Bart Vandevelde, Jan Vanfleteren, Wim Christiaens, 2006 .

Thermal Modelling of the Polymer Stud Grid Array (PSGA) Packages

E. Beyne, B. Vandevelde, R. Mertens, 1997 .

Advanced (Metal 3D-Printed) Direct Liquid Jet-Impingement Cooling Solution for Autonomous Driving High-Performance Vehicle Computer (HPVC)

B. Vandevelde, H. Oprins, Antonio Pappaterra, 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Fabrication of an electrostatically actuated impingement cooling device

B. Vandevelde, H. Oprins, B. Jones, 2011 .

Thermo-mechanical analysis of flexible and stretchable systems

J. Vanfleteren, B. Vandevelde, Mario Gonzalez, 2010, 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).

An Analysis of Beam Deflections in Poly-SiGe Cantilevers

B. Vandevelde, M. Gonzalez, A. Witvrouw, 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.

Cross-Section Nano-Indentation for Rapid Adhesion Evaluation

K. Maex, B. Vandevelde, S. Brongersma, 2004 .

Thermo-mechanical modeling of stress-induced-voiding in BEOL Cu interconnect structures

Christopher J. Wilson, K. Croes, B. Vandevelde, 2009, EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

The kinetics of the early stages of electromigration and concurrent temperature induced processes in thin film metallisations studied by means of an in-situ high resolution resistometric technique

E. Beyne, K. Maex, B. Vandevelde, 1999 .

Novel Cu–Cu Bonding Technique: The Insertion Bonding Approach

E. Beyne, B. Vandevelde, C. Okoro, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

A Study on the 0-Level Package Design of a High Accuracy Silicon MEMS Resonator

A. Jourdain, B. Vandevelde, H. Tilmans, 2006, 2006 1st Electronic Systemintegration Technology Conference.

3D THERMAL MODELING FOR A PHOTOVOLTAIC MODULE

F. Catthoor, J. Driesen, B. Vandevelde, 2011 .

Strength analysis of advanced node BEOL under CPI induced stresses

K. Vanstreels, Z. Tokei, B. Vandevelde, 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

The Shear Test as Interface Characterization Tool Applied to the Si-BCB Interface

Bart Vandevelde, Eric Beyne, Joris Degrieck, 2009 .

Stress-induced large-area lift-off of crystalline Si films

I. Gordon, B. Vandevelde, G. Beaucarne, 2007 .

Thermal cycling of lead‐free Sn‐3.8Ag‐0.7Cu 388PBGA packages

Bart Vandevelde, Peng Sun, Göran Wetter, 2009 .

Solder parameter sensitivity for CSP life-time prediction using simulation-based optimization method

Eric Beyne, J.F.J.M. Caers, B. Vandevelde, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Hermal cycling reliability of snagcu and snpb solder joints: a comparison for several ic-packages

Paresh Limaye, Bart Vandevelde, Eric Beyne, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

Evaluation of Fatigue Behavior of Lead-Free Solder Joints in Four-Point Bending Test by Finite-Element Modeling

B. Vandevelde, D. Vandepitte, F. Vanhee, 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

Bart Vandevelde, Eric Beyne, Dirk Vandepitte, 2011 .

Analysis of microbump induced stress effects in 3D stacked IC technologies

Diederik Verkest, Bart Vandevelde, Eric Beyne, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

Creep Behavior of Mixed SAC 405/SnPb Soldered Assemblies in Shear Loading

R. Labie, B. Vandevelde, D. Vandepitte, 2007, 2007 9th Electronics Packaging Technology Conference.

Outperformance of Cu pillar flip chip bumps in electromigration testing

Bart Vandevelde, Eric Beyne, Riet Labie, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Electromigration failure mechanisms for different flip chip bump configurations

Bart Vandevelde, Riet Labie, Kristof Croes, 2011, 2011 International Reliability Physics Symposium.

Analytical Thermo-Mechanical Model for Non-Underfilled Area Array Flip Chip Assemblies

E. Beyne, M. Baelmans, B. Vandevelde, 2004 .

An integrated creep, crack growth and thermo-mechanical fatigue model for WLCSP assemblies soldered with SAC 405

B. Verlinden, B. Vandevelde, D. Vandepitte, 2009, 2009 59th Electronic Components and Technology Conference.

Finite element analysis of ultra thin BGA package: first and second level reliability

R. Labie, B. Vandevelde, H. de Vries, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

THERMO-MECHANICAL ANALYSIS OF A CHIP SCALE PACKAGE (CSP) USING LEAD FREE AND LEAD CONTAINING SOLDER MATERIALS

E. Beyne, B. Vandevelde, Mario Gonzalez, 2004 .

Influence of printed circuit board properties on solder joint fatigue life of assembled IC packages

Bart Vandevelde, Eric Beyne, Martine Baelmans, 2004 .

Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies

Bart Vandevelde, Martine Baelmans, Dirk Vandepitte, 2003 .

Optimal choice of the FEM damage volumes for estimation of the solder joint reliability for electronic package assemblies

E. Beyne, B. Vandevelde, M. Gonzalez, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Thermal fatigue analysis of the flip chip assembly on the polymer stud grid array (PSGA) package

Bart Vandevelde, Eric Beyne, E. Beyne, 1999 .

Cu pumping in TSVs: Effect of pre-CMP thermal budget

Bart Vandevelde, Eric Beyne, Ingrid De Wolf, 2011, Microelectron. Reliab..

Design and implementation of flexible and stretchable systems

Bart Vandevelde, Jan Vanfleteren, Frederick Bossuyt, 2011, Microelectron. Reliab..

Design and analysis of a novel fine pitch and highly stretchable interconnect

J. Vanfleteren, B. Vandevelde, Mario Gonzalez, 2010 .

Design of Metal Interconnects for Stretchable Electronic Circuits using Finite Element Analysis

Bart Vandevelde, Fabrice Axisa, Jan Vanfleteren, 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

Introducing a silicone under the bump configuration for stress relief in a wafer level package

E. Beyne, B. Vandevelde, H. Meynen, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Luca Benini, Federico Angiolini, Paresh Limaye, 2010, IEEE Journal of Solid-State Circuits.

Degradation and failure analysis of copper and tungsten contacts under high fluence stress

S. Demuynck, H. Bender, G. Groeseneken, 2010, 2010 IEEE International Reliability Physics Symposium.

Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging

Bart Vandevelde, Renaud Gillon, Kris Vanstreels, 2012, Microelectron. Reliab..

Electro-thermal-mechanical Analysis of A HQUAD Package for High Current and High Power Application

Bart Vandevelde, Herman Oprins, Daniel Vanderstraeten, 2005 .

Compact thermal modeling of hot spots in advanced 3D-stacked ICs

E. Beyne, I. De Wolf, B. Vandevelde, 2009, 2009 11th Electronics Packaging Technology Conference.

Comparison of x-ray diffraction, wafer curvature and Raman spectroscopy to evaluate the stress evolution in Copper TSV's

E. Beyne, A. Redolfi, V. Simons, 2012, 2012 IEEE International Interconnect Technology Conference.

Deformation analysis of QFN packages for validation of thermo-mechanical finite element simulations

B. Vandevelde, P. Vernhes, Chinmay Nawghane, 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Challenges in introducing high-density interconnect technology in printed circuit boards for space applications

B. Vandevelde, M. Cauwe, S. Heltzel, 2021, CEAS Space Journal.

High-Density Interconnect Technology Assessment of Printed Circuit Boards for Space Applications

Bart Vandevelde, Erwin Bosman, Maarten Cauwe, 2020 .

MEMS packaging and reliability: An undividable couple

Bart Vandevelde, Ingrid De Wolf, Ann Witvrouw, 2012, Microelectron. Reliab..

Effects of Interfacial Strength and Dimension of Structures on Physical Cleaning Window

Tae Gon Kim, K. Wostyn, M. Heyns, 2012 .

Thermo-mechanics of 3D-wafer level and 3D stacked IC packaging technologies

E. Beyne, B. Vandevelde, B. Swinnen, 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.

Thermo-mechanical design of a generic 0-level MEMS package using chip capping and Through Silicon Via's

E. Beyne, R. Jansen, B. Vandevelde, 2010, 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).

On the impact of the edge profile of interconnects on the occurrence of passivation cracks of plastic-encapsulated electronic power devices

B. Vandevelde, J. Ackaert, D. Vanderstraeten, 2011, 2011 IEEE International Conference on IC Design & Technology.

B-Spline X-Ray Diffraction Imaging - Rapid non-destructive measurement of die warpage in ball grid array packages

Bart Vandevelde, C. S. Wong, Ingrid De Wolf, 2016, Microelectron. Reliab..

Development of B-spline X-ray Diffraction Imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips

I. De Wolf, A. Ivankovic, V. Cherman, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

A study of brittle to ductile fracture transition temperatures in bulk Pb-free solders

B. Verlinden, B. Vandevelde, P. Ratchev, 2005 .

Characterization of the thermal impact of Cu-Cu bonds achieved using TSVs on hot spot dissipation in 3D stacked ICs

E. Beyne, G. Van der Plas, V. Cherman, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Thermal test vehicle for the validation of thermal modelling of hot spot dissipation in 3D stacked ICs

E. Beyne, V. Cherman, M. Stucchi, 2010, 3rd Electronics System Integration Technology Conference ESTC.

Thermal analysis of hot spots in advanced 3D-stacked structures

E. Beyne, I. De Wolf, B. Vandevelde, 2009, 2009 15th International Workshop on Thermal Investigations of ICs and Systems.

Excessive Warpage of Large Packages During Reflow Soldering

B. Vandevelde, 2011 .

Hidden Head-In-Pillow soldering failures

B. Vandevelde, B. Allaert, G. Willems, 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Impact of moisture absorption on warpage of large BGA packages during a lead-free reflow process

B. Vandevelde, M. Gonzalez, R. Gillon, 2009, 2009 15th International Workshop on Thermal Investigations of ICs and Systems.

How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance

B. Vandevelde, M. Cauwe, B. Allaert, 2016, 2016 International Conference on Electronics Packaging (ICEP).

Reduced 2nd level solder joint life time of low-CTE mold compound packages

Geert Willems, Bart Vandevelde, Riet Labie, 2014 .

Green mould compounds: Impact on second level interconnect reliability

B. Vandevelde, M. Lofrano, G. Willems, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.

Dealing with IC package material and design uncertainties using FUZZY finite elements

B. Vandevelde, D. Vandepitte, I. Konstantinou, 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Early fatigue failures in copper wire bonds inside packages with low CTE green mold compounds

B. Vandevelde, G. Willems, 2012, 2012 4th Electronic System-Integration Technology Conference.

Impact of PCB-housing-interaction on QFN solder joint reliability

R. Labie, B. Vandevelde, D. Vanderstraeten, 2020, 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode

D. Schaubroeck, B. Vandevelde, D. Degryse, 2013, 2013 Eurpoean Microelectronics Packaging Conference (EMPC).

Studies on Thermo-Mechanical Reliability of High Performance Vehicle Computers Based on a Mock-up System

B. Vandevelde, R. Dudek, S. Rzepka, 2021, International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.

3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps

Bart Vandevelde, Eric Beyne, Geert Van der Plas, 2012, 2012 IEEE International Conference on IC Design & Technology.

Minimizing interposer warpage by process control and design optimization

M. Gonzalez, E. Beyne, Mikael Detalle, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Modified micro-macro thermo-mechanical modelling of ceramic ball grid array packages

Alcatel Bell, Geert Willems, Bart Vandevelde, 2003, Microelectron. Reliab..

Fine grain thermal modeling of 3D stacked structures

G. Van der Plas, E. Cheng, A. Srinivasan, 2009, 2009 15th International Workshop on Thermal Investigations of ICs and Systems.

Crack growth analysis of lead free passive component assemblies

B. Verlinden, B. Vandevelde, D. Vandepitte, 2006 .

Modeling and Control of Electrowetting Induced Droplet Motion

Bart Vandevelde, Martine Baelmans, Herman Oprins, 2012, Micromachines.

Design issues and considerations for low-cost 3D TSV IC technology

Paresh Limaye, Bart Vandevelde, Eric Beyne, 2010, 2010 IEEE International Solid-State Circuits Conference - (ISSCC).

Elimination Of The Axial Deformation Problem Of Cu-TSV In 3D Integration

Bart Vandevelde, Eric Beyne, Cedric Huyghebaert, 2010 .