Jongchul Park

Low-loss and high-isolation through silicon via technology for high performance RF applications

J. Yook, Dongsu Kim, Jongchul Park, 2014, 2014 44th European Microwave Conference.

Embedded passive and active package using silicon substrate

J. Yook, Jun-Chul Kim, Dongsu Kim, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.

Embedded IC module package using silicon substrate

J. Yook, Dongsu Kim, Jongchul Park, 2012, 2012 7th European Microwave Integrated Circuit Conference.

A v-band compect bandpass filter in Si-BCB technology using the coupled-line resonators

Jongchul Park, K. Seo, Young-chul Rhee, 2015, 2015 IEEE MTT-S International Microwave Symposium.

Thickness-dependent tunable characteristics of (Ba0.5Sr0.5)0.925K0.075TiO3 thin films prepared by pulsed laser deposition

J. Yook, Jongchul Park, Y. Cho, 2012 .

Fabrication of photoimageable silver paste for low-temperature cofiring using acrylic binder polymers and photosensitive materials

Jongchul Park, Dong-Kook Kim, M. Yoo, 2004 .