P. Nalla

Advanced metallization scheme for 3×50µm via middle TSV and beyond

G. Beyer, E. Beyne, S. Van Huylenbroeck, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Micro-pattern Corrosion Screening on Bimetallic Corrosion for Microelectronic Application

P. Nalla, K. Singh, O. Chyan, 2016 .

Study of bimetallic corrosion related to Cu interconnects using micropattern corrosion screening method and Tafel plots

P. Nalla, O. Chyan, Kyle Yu, 2009 .

Cobalt bottom-up contact and via prefill enabling advanced logic and DRAM technologies

K. Croes, S. Demuynck, Marleen H. van der Veen, 2015, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).