F. Carson

Die to die copper wire bonding enabling low cost 3D packaging

F. Carson, Hun Teak Lee, J. Yee, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Development of improved thermal performance embedded heat slug plastic ball grid array package

F. Carson, R. Coronado, B. Zahn, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Package on Package warpage - impact on surface mount yields and board level reliability

F. Carson, N. Vijayaragavan, A. Mistry, 2008, 2008 58th Electronic Components and Technology Conference.

Controlling Top Package Warpage for POP Applications

Seong Min Lee, F. Carson, N. Vijayaragavan, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

3D TSV processes and its assembly/packaging technology

Seung Wook Yoon, Flynn Carson, Dae Wook Yang, 2009, 2009 IEEE International Conference on 3D System Integration.