M. Sunohara

发表

Studies on electrical performance and thermal stress of a silicon interposer with TSVs

M. Sunohara, Hideaki Sakaguchi, A. Takano, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

A Silicon interposer BGA package with Cu-filled TSV and multi-layer Cu-plating interconnect

T. Kurihara, M. Sunohara, M. Higashi, 2008, 2008 58th Electronic Components and Technology Conference.

Low-Latency Real-Time Blind Source Separation with Binaural Directional Hearing Aids

Nobutaka Ono, M. Sunohara, Chiho Haruta, 2017 .

Silicon interposer with TSVs (Through Silicon Vias) and fine multilayer wiring

T. Kurihara, T. Kurihara, M. Sunohara, 2008, 2008 58th Electronic Components and Technology Conference.

Low-latency real-time blind source separation for hearing aids based on time-domain implementation of online independent vector analysis with truncation of non-causal components

Nobutaka Ono, Masahiro Sunohara, Chiho Haruta, 2017, 2017 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP).

Blind reverberation energy estimation using exponential averaging with attack and release time constants for hearing aids

Yasuhiro Oikawa, Yusuke Ikeda, Kotoyo Nozaki, 2018, Applied Acoustics.

Development of advanced 3D chip stacking technology with ultra-fine interconnection

M. Tomisaka, Hitoshi Yonemura, Hiroshi Terao, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Adaptive feedback canceller with howling detection for hearing aids

Arata Kawamura, Youji Iiguni, Nobuhiko Hiruma, 2015, 2015 Asia-Pacific Signal and Information Processing Association Annual Summit and Conference (APSIPA).

Occlusion reduction system for hearing aids with an improved transducer and an associated algorithm

Makoto Tateno, Masahiro Sunohara, Masatoshi Osawa, 2015, 2015 23rd European Signal Processing Conference (EUSIPCO).

Occlusion reduction system for hearing aids using active noise control technique

Makoto Tateno, Masahiro Sunohara, Keisuke Watanuki, 2014 .

Warpage control of silicon interposer for 2.5D package application

Myriam Assous, Kei Murayama, Mitsuhiro Aizawa, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Current Status of Research and Development for Three-Dimensional Chip Stack Technology

Manabu Bonkohara, Yoshihiro Tomita, Y. Yamaji, 2001 .

Development of silicon module with TSVs and global wiring (L/S=0.8/0.8µm)

K. Murayama, Masahiro Sunohara, M. Sunohara, 2009, 2009 59th Electronic Components and Technology Conference.

Electrical and morphological characterization for high integrated silicon interposer and technology transfer from 200 mm to 300mm wafer

Myriam Assous, Kei Murayama, Kenichi Mori, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.