C. H. Lin

Impact of slurry in Cu CMP (chemical mechanical polishing) on Cu topography of Through Silicon Vias (TSVs), re-distribution layers, and Cu exposure

P. Tzeng, M. Kao, J. Lau, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Utilizing Sub-5 nm sidewall electrode technology for atomic-scale resistive memory fabrication

Y. J. Chen, C. C. Chen, C. H. Lin, 2014, 2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers.

Genome-wide association study of bipolar I disorder in the Han Chinese population

M. Lee, T. Lai, C. H. Lin, 2011, Molecular Psychiatry.

Oxygen transfer and mixing in a tower cycling fermentor

C. H. Lin, B. S. Fang, C. S. Wu, 1976 .

Optimization of separation and migration behavior of chloropyridines in micellar electrokinetic chromatography.

C. H. Lin, Y. C. Liu, C. E. Lin, 2001, Journal of chromatography. A.