J. Im

发表

Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon Vias for 3-D Interconnects

Suk-kyu Ryu, K. Lu, Rui Huang, 2011, IEEE Transactions on Device and Materials Reliability.

Micro-Raman spectroscopy and analysis of near-surface stresses in silicon around through-silicon vias for three-dimensional interconnects

Suk-kyu Ryu, H.-Y Son, Kwang-yoo Byun, 2012 .

Effect of Thermal Stresses on Carrier Mobility and Keep-Out Zone Around Through-Silicon Vias for 3-D Integration

Suk-kyu Ryu, Tengfei Jiang, K. Lu, 2012, IEEE Transactions on Device and Materials Reliability.

Reliability Assessment of Fan-Out Packages Using High Resolution Moiré Interferometry and Synchrotron X-Ray Microdiffraction

P. Ho, J. Im, Laura Spinella, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

Paul S. Ho, Xuefeng Zhang, Jang-Hi Im, 2007 .

Surface Crack Growth in Fiber Composites.

J. Im, Su-Su Wang, F. Mcgarry, 1976 .

Characterization of thermal stresses and plasticity in through-silicon via structures for three-dimensional integration

Suk-kyu Ryu, Tengfei Jiang, Rui Huang, 2014 .

Fatigue crack propagation in microlayer composites of polycarbonate and poly (styrene-acrylonitrile)

J. Im, A. Hiltner, E. Baer, 1990 .

Divinylsiloxane-bisbenzocyclobutene-based polymer modified with polystyrene-polybutadiene-polystyrene triblock copolymers

J. Im, P. Garrou, Y. So, 2006 .

Polymer Microlayer Composites

J. Im, A. Hiltner, E. Baer, 1991 .

Underfill adhesion to Cyclotene/sup TM/ (BCB) dielectrics

Ching-ping Wong, J. Im, P. Garrou, 1999, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).

Thickness effects in microlayer composites of polycarbonate and poly(styrene-acrylonitrile)

J. Im, A. Hiltner, E. Baer, 1990 .

On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications

Andrew J. G. Strandjord, Greg Meyers, T. Stokich, 2000 .

A novel positive-tone and aqueous-base-developable photosensitive benzocyclobutene-based material for microelectronics

J. Im, A. Achen, T. Stokich, 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).

Mechanical Properties of Cured SiLK Low-K Dielectric Films

J. Im, P. Townsend, Cheryl L. Karas, 2002 .

Development of adhesion promoters to enhance polymer/substrate interface toughness

J. Im, T. Stokich, G. Meyers, 1999, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).

Physical and Mechanical Properties Determination of Photo-BCB-Based Thin Films

J. Im, Cheryl L. Murlick, E. Shaffer, 1996 .

Initial interface formation of Ta-based barriers on SiLK™ low dielectric constant films

P. Ho, J. Im, M. Scharnberg, 2005 .

Chip–Package Interaction and Reliability Improvement by Structure Optimization for Ultralow-$k$ Interconnects in Flip-Chip Packages

P. S. Ho, Xuefeng Zhang, Jang-Hi Im, 2012, IEEE Transactions on Device and Materials Reliability.

Mechanical Characterization of High Aspect Ratio Silicon Nanolines

Rui Huang, P. Ho, J. Im, 2008 .

Kink bands and shear deformation in polybenzobisoxazole fibres

J. Im, J. Blackson, C. Chau, 1995 .

Structure of ultrathin polyethylene layers in multilayer films

M. J. Hill, J. Im, A. Hiltner, 1990 .

Crazing phenomena in PC/SAN microlayer composites

J. Im, A. Hiltner, E. Baer, 1994 .

Processing Effect on Via Extrusion for TSVs in Three-Dimensional Interconnects: A Comparative Study

Tengfei Jiang, Rui Huang, P. Ho, 2016, IEEE Transactions on Device and Materials Reliability.

Kinetic Analysis of Current Enhanced Intermetallic Growth and Its Effect on Electromigration Reliability of Solder Joints

K. Lu, P. Ho, Xuefeng Zhang, 2006, 2006 IEEE International Reliability Physics Symposium Proceedings.

Some Physical and Mechanical Properties of Pbo Fiber

J. Im, P. A. Percha, D. S. Yeakle, 1988 .

Synchrotron X-Ray Microdiffraction Investigation of Scaling Effects on Reliability for Through-Silicon Vias for 3-D Integration

N. Tamura, Tengfei Jiang, P. Ho, 2019, IEEE Transactions on Device and Materials Reliability.

Plasticity mechanism for copper extrusion in through-silicon vias for three-dimensional interconnects

M. Kunz, N. Tamura, Tengfei Jiang, 2013 .

Stress-Induced Delamination Of Through Silicon Via Structures

Suk-kyu Ryu, K. Lu, J. Im, 2011 .

Silk Polymer Coating with Low Dielectric Constant and High Thermal Stability for Ulsi Interlayer Dielectric

J. Im, Dennis W. Smith, P. Townsend, 1997 .

Solidification Interface Morphologies in Zone Melting Recrystallization

C. Thompson, J. Im, H. Tomita, 1986 .

Effect of scaling copper through-silicon vias on stress and reliability for 3D interconnects

N. Tamura, Tengfei Jiang, P. Ho, 2016, 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).

Cavity formation from inclusions in ductile fracture

J. Im, A. Argon, Ali S. Argon, 1975 .