H. Edmundson

New interferometric measurement technique for small diameter TSV

R. Alapati, S. Thangaraju, Daniel Smith, 2014, 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014).

Process Development and Optimization for 3 $\mu \text{m}$ High Aspect Ratio Via-Middle Through-Silicon Vias at Wafer Level

M. Rabie, Daniel Smith, Dingyou Zhang, 2015, IEEE Transactions on Semiconductor Manufacturing.

Successful void free gap fill of 3µm, high AR via middle, Through Silicon Vias at wafer level

S. Thangaraju, M. Rabie, H. Edmundson, 2014, 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014).