C. Okoro

发表

Experimentally, how does Cu TSV diameter influence its stress state?

C. Okoro, L. Levine, R. Xu, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV

B. Verlinden, R. Labie, B. Vandevelde, 2010 .

A Detailed Failure Analysis Examination of the Effect of Thermal Cycling on Cu TSV Reliability

C. Okoro, Y. Obeng, K. Hummler, 2014, IEEE Transactions on Electron Devices.

Experimental measurement of the effect of copper through-silicon via diameter on stress buildup using synchrotron-based X-ray source

C. Okoro, L. Levine, R. Xu, 2015, Journal of Materials Science.

Nondestructive Measurement of the Residual Stresses in Copper Through-Silicon Vias Using Synchrotron-Based Microbeam X-Ray Diffraction

C. Okoro, L. Levine, R. Xu, 2014, IEEE Transactions on Electron Devices.

Effect of thermal cycling on the signal integrity and morphology of TSV isolation liner- SiO2

C. Okoro, Y. Obeng, 2012, 2012 IEEE International Interconnect Technology Conference.

Synchrotron-based measurement of the impact of thermal cycling on the evolution of stresses in Cu through-silicon vias

C. Okoro, L. Levine, R. Xu, 2014 .

Low Frequency Radio Wave Detection of Electrically Active Defects in Dielectrics

Rhonda R. Franklin, C. Okoro, Y. Obeng, 2016 .

A case study on the impact of local material chemistry on the mechanical reliability of packaged integrated circuits: Correlation of the packaging fallout to the chemistry of passivation dielectrics

C. Okoro, Y. Obeng, 2012 .

The effect of materials and design on the reliability of through-glass vias for 2.5 D integrated circuits: a numerical study

Tengfei Jiang, C. Okoro, O. Ahmed, 2020 .

Metrology for nanosystems and nanoelectronics reliability assessments

C. Okoro, Y. Obeng, J. Kopanski, 2012, 2012 12th IEEE International Conference on Nanotechnology (IEEE-NANO).

The Influence of Pulsed Electroplating Frequency and Duty Cycle on Copper Film Microstructure and Stress State.

C. Okoro, Y. Obeng, K. Richardson, 2017, Thin solid films.

The influence of pulse plating frequency and duty cycle on the microstructure and stress state of electroplated copper films

C. Okoro, Y. Obeng, K. Richardson, 2017 .

The Impact of Organic Additives on Copper Trench Microstructure

C. Okoro, Y. Obeng, K. Richardson, 2017, Journal of the Electrochemical Society.

Towards Understanding Early Failures Behavior during Device Burn-In: Broadband RF Monitoring of Atomistic Changes in Materials

C. Okoro, Y. Obeng, V. Vartanian, 2016, ECS journal of solid state science and technology : JSS.

Micro-Compression of Freestanding Electroplated Copper Through-Glass Vias

Tengfei Jiang, C. Okoro, O. Ahmed, 2020, IEEE Transactions on Device and Materials Reliability.

Use of RF-based technique as a metrology tool for TSV reliability analysis

C. Okoro, Y. Obeng, P. Kabos, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Novel Cu–Cu Bonding Technique: The Insertion Bonding Approach

E. Beyne, B. Vandevelde, C. Okoro, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

Bart Vandevelde, Eric Beyne, Dirk Vandepitte, 2011 .

Investigation of Copper and Glass Interaction in Through Glass Via (TGV) During Thermal Cycling

C. Okoro, Seungbae Park, K. Pan, 2021, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

Cu pumping in TSVs: Effect of pre-CMP thermal budget

Bart Vandevelde, Eric Beyne, Ingrid De Wolf, 2011, Microelectron. Reliab..

Time and Temperature Dependence of Copper Protrusion in Metallized Through-Glass Vias (TGVs) Fabricated in Fused Silica Substrate

C. Okoro, P. Maurey, S. Pollard, 2021, IEEE Transactions on Device and Materials Reliability.

Defect and microstructural evolution in thermally cycled Cu through-silicon vias

Kathleen Richardson, Chukwudi Okoro, Yaw Obeng, 2014, Microelectron. Reliab..

Accelerated Stress Test Assessment of Through-Silicon Via Using RF Signals

J. Obrzut, P. Kabos, K. Hummler, 2013, IEEE Transactions on Electron Devices.

Full elastic strain and stress tensor measurements from individual dislocation cells in copper through-Si vias

C. Okoro, L. Levine, R. Xu, 2015, IUCrJ.

(Invited) Towards the Physical Reliability of 3D-Integrated Systems: Broadband Dielectric Spectroscopic (BDS) Studies of Material Evolution and Reliability in Integrated Systems

D. Veksler, C. Okoro, Y. Obeng, 2022, ECS Transactions.

Dielectric Spectroscopic Detection of Early Failures in 3-D Integrated Circuits.

Lin You, Jung-Joon Ahn, Yaw Obeng, 2015, ECS transactions.

Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performance

P. Soussan, E. Beyne, A. Mercha, 2010, 2010 International Electron Devices Meeting.

X-ray micro-beam diffraction measurement of the effect of thermal cycling on stress in Cu TSV: A comparative study

C. Okoro, L. Levine, R. Xu, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

X-ray micro-beam diffraction determination of full stress tensors in Cu TSVs

Klaus Hummler, Chukwudi Okoro, Yaw S. Obeng, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Thermo-Mechanical Characterization of Copper Through-Silicon-Via Interconnect for 3D Chip Stacking (Thermo-mechanische karakterisatie van koper via interconnecties doorheen silicium voor 3D opeenstapeling van chips)

Chukwudi Okoro, C. Okoro, 2010 .

Elimination Of The Axial Deformation Problem Of Cu-TSV In 3D Integration

Bart Vandevelde, Eric Beyne, Cedric Huyghebaert, 2010 .

Understanding and eliminating thermo-mechanically induced radial cracks in fully metallized through-glass via (TGV) substrates

C. Okoro, S. Jayaraman, S. Pollard, 2021 .

Ultra Low-Loss Ion-Exchange Waveguides in Optimized Alkali Glass for Co-Packaged Optics

Chad C. Terwilliger, C. Okoro, L. Brusberg, 2024, 2024 IEEE 74th Electronic Components and Technology Conference (ECTC).