C. King

A 3D-IC Technology with Integrated Microchannel Cooling

J. Meindl, B. Dang, M. Bakir, 2008, 2008 International Interconnect Technology Conference.

3D stacking of chips with electrical and microfluidic I/O interconnects

J.D. Meindl, B. Dang, M.S. Bakir, 2008, 2008 58th Electronic Components and Technology Conference.

A 'mesh' seed layer for improved through-silicon-via fabrication

M. Bakir, H. Yang, C. King, 2010 .

Coupled electrical and thermal 3D IC centric microfluidic heat sink design and technology

M. Bakir, Yue Zhang, C. King, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Integrated Microfluidic Cooling and Interconnects for 2D and 3D Chips

J. Meindl, B. Dang, M. Bakir, 2010, IEEE Transactions on Advanced Packaging.

Electrical and fluidic C4 interconnections for inter-layer liquid cooling of 3D ICs

Muhannad S. Bakir, James D. Meindl, Calvin R. King, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Thermal management of three-dimensional integrated circuits using inter-layer liquid cooling

Calvin R. King, C. King, 2012 .

3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation

Muhannad S. Bakir, Gang Huang, James D. Meindl, 2008, 2008 IEEE Custom Integrated Circuits Conference.