Johan Liu
发表
Teng Wang,
K. Jeppson,
N. Olofsson,
2009,
Nanotechnology.
Johan Liu,
V. Kuzmenko,
P. Gatenholm,
2017
.
Carl Zandén,
Lilei Ye,
Johan Liu,
2014
.
Johan Liu,
C. Zandén,
M. Voinova,
2012
.
Dongkai Shangguan,
Björn Carlberg,
Teng Wang,
2009
.
Hongbing Lu,
Johan Liu,
Yifeng Fu,
2018
.
Teng Wang,
Johan Liu,
J. Nurnus,
2010,
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
Lilei Ye,
Zonghe Lai,
Johan Liu,
1999
.
Y. C. Chan,
Guangbin Dou,
Y. Chan,
2003
.
Johan Liu,
W. Ke,
L. Ye,
2019,
Materials Science and Engineering: A.
Johan Liu,
Xiaowu Hu,
L. Ye,
2018,
International Journal of Applied Mechanics.
Johan Liu,
W. Ke,
L. Ye,
2018,
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
Johan Liu,
C. Zandén,
J. Gold,
2012,
Biomicrofluidics.
Johan Liu,
Z. Lai,
2002
.
Johan Liu,
M. Modreanu,
2013
.
K. Jeppson,
Johan Liu,
L. Ye,
2016
.
Johan Liu,
Z. Lai,
C. Andersson,
2005,
Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003..
Teng Wang,
Johan Liu,
Yiheng Qin,
2010,
Advanced materials.
K. Jeppson,
Johan Liu,
T. Xu,
2018,
Advanced Materials Interfaces.
Johan Liu,
Z. Lai,
C. Andersson,
2003
.
Johan Liu,
P. Sun,
D. Shangguan,
2006
.
Johan Liu,
H. Kuhn,
U. Nannmark,
2009,
Biomedical materials.
N. H. Yeung,
Johan Liu,
C.M.L. Wu,
2001
.
Yan Zhang,
K. Jeppson,
Johan Liu,
2019,
Materials.
Johan Liu,
Xiuzhen Lu,
Cheng Zhou,
2020,
2020 China Semiconductor Technology International Conference (CSTIC).
Johan Liu,
Yifeng Fu,
D. Jiang,
2014,
2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT).
Teng Wang,
Johan Liu,
Yifeng Fu,
2013
.
Teng Wang,
Johan Liu,
L. Ye,
2010,
10th IEEE International Conference on Nanotechnology.
Kjell Jeppson,
Teng Wang,
Teng Wang,
2010
.
P. Heremans,
Johan Liu,
Yiheng Qin,
2012
.
Klas Hjort,
Zhigang Wu,
Seung Hee Jeong,
2017,
ACS applied materials & interfaces.
Johan Liu,
H. Zirath,
Xia Zhang,
2008
.
Teng Wang,
Johan Liu,
C. Cooper-Kuhn,
2009,
2009 59th Electronic Components and Technology Conference.
Yan Zhang,
Johan Liu,
L. Ye,
2017,
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Luca Pierantoni,
Wei Mu,
Kjell Jeppson,
2016,
Nanotechnology.
Johan Liu,
C. Andersson,
2003,
53rd Electronic Components and Technology Conference, 2003. Proceedings..
J. R. Oliver,
Johan Liu,
Z. Lai,
2000,
Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507).
Johan Liu,
N. Wang,
W. Ke,
2019,
Soldering & Surface Mount Technology.
Johan Liu,
L. Ye,
Xiuzhen Lu,
2019,
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
Teng Wang,
E. Campbell,
Johan Liu,
2007
.
Johan Liu,
James E. Morris,
J. Morris,
2007
.
Johan Liu,
C. Zandén,
Xin Luo,
2016
.
Johan Liu,
A. Lindahl,
Yifeng Fu,
2015
.
Johan Liu,
Xiuzhen Lu,
Z. Cheng,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
Johan Liu,
Xitao Wang,
Z. Lai,
2002
.
Johan Liu,
D. Johansson,
K. Olsson,
2002,
2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599).
Johan Liu,
P. Tegehall,
P. Sun,
2006,
2006 7th International Conference on Electronic Packaging Technology.
Johan Liu,
N. Wang,
Yong Zhang,
2020,
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
Johan Liu,
L. Ye,
Yifeng Fu,
2020,
Nanotechnology.
Johan Liu,
Xing-ming Guo,
Zhili Hu,
2010,
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
Johan Liu,
Z. Cheng,
Xu Wang,
2006,
Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06..
Teng Wang,
Johan Liu,
J. Bielecki,
2012
.
Teng Wang,
Johan Liu,
L. Ye,
2013
.
Teng Wang,
Johan Liu,
B. Carlberg,
2012,
Nanotechnology.
K. Jeppson,
Johan Liu,
Yifeng Fu,
2016,
Small.
Johan Liu,
L. Ye,
Si Chen,
2012
.
Johan Liu,
L. Ye,
T. Nilsson,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
K. Jeppson,
Johan Liu,
Yifeng Fu,
2015,
Journal of Electronic Materials.
Johan Liu,
Zhigang Wu,
K. Hjort,
2015,
Scientific Reports.
Johan Liu,
A. Andrae,
G. Zou,
2004
.
Johan Liu,
James E. Morris,
P. Tegehall,
2011
.
Johan Liu,
James E. Morris,
P. Tegehall,
2011
.
Johan Liu,
Yan Zhang,
Jing-yu Fan,
2011
.
Johan Liu,
M. Jakubowska,
A. Arazna,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
Johan Liu,
J.E. Morris,
Jeahuck Lee,
2005,
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.
Johan Liu,
Jeahuck Lee,
2006
.
Helge Kristiansen,
Johan Liu,
Johan Liu,
2004
.
Johan Liu,
Q. Zhai,
Yulai Gao,
2010
.
Johan Liu,
P. Sun,
C. Andersson,
2008
.
Michael Pecht,
Bahgat Sammakia,
Avram Bar-Cohen,
2005
.
Johan Liu,
L. Ye,
Xiuzhen Lu,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Johan Liu,
Yan Zhang,
Jing-yu Fan,
2006,
Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06..
Johan Liu,
V. Kuzmenko,
I. Mijakovic,
2017
.
Johan Liu,
Yan Zhang,
Jing-yu Fan,
2013,
2013 14th International Conference on Electronic Packaging Technology.
Johan Liu,
Xing-ming Guo,
M. Murugesan,
2013
.
Johan Liu,
L. Ye,
Xitao Wang,
2018,
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Johan Liu,
L. Ye,
Nan Wang,
2017,
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Yan Zhang,
Johan Liu,
Xiuzhen Lu,
2020
.
K. Jeppson,
Johan Liu,
Yifeng Fu,
2017
.
Peter Enoksson,
Tao Xu,
Per Lundgren,
2019,
Journal of Power Sources.
Atomic Layer Deposition of Buffer Layers for the Growth of Vertically Aligned Carbon Nanotube Arrays
Johan Liu,
Hongliang Lu,
Hongping Ma,
2019,
Nanoscale Research Letters.
Johan Liu,
Shirong Huang,
Guangjie Yuan,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
Johan Liu,
L. Ye,
Nan Wang,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Johan Liu,
Guangjie Yuan,
Haohao Li,
2019,
Micro and Nanosystems.
Johan Liu,
H. Yin,
Yong Zhang,
2020,
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
Teng Wang,
Johan Liu,
Yifeng Fu,
2010
.
K. Jeppson,
Johan Liu,
L. Ye,
2016,
2016 China Semiconductor Technology International Conference (CSTIC).
K. Jeppson,
Johan Liu,
L. Ye,
2016
.
Johan Liu,
1996
.
Johan Liu,
V. Kuzmenko,
P. Gatenholm,
2015
.
Liqiang Cao,
Johan Liu,
Z. Lai,
2005
.
Hongbing Lu,
Johan Liu,
D. Mencarelli,
2020,
2002.11336.
Johan Liu,
X. Long,
Xiuzhen Lu,
2018,
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
Teng Wang,
K. Jeppson,
Johan Liu,
2012
.
Johan Liu,
Yifeng Fu,
Nan Wang,
2019,
2019 IEEE 14th Nanotechnology Materials and Devices Conference (NMDC).
Johan Liu,
Yifeng Fu,
M. Murugesan,
2022,
2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Johan Liu,
Haomin Wang,
Yan Zhang,
2014
.
Yan Zhang,
Johan Liu,
Yifeng Fu,
2022,
2D Materials.
Johan Liu,
L. Nyborg,
E. Hryha,
2018
.
Johan Liu,
Bin Yang,
Q. Zhai,
2009
.
Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression
Johan Liu,
Bin Yang,
Q. Zhai,
2009
.
Johan Liu,
Xiuzhen Lu,
Zhenlin Lv,
2022,
Journal of Physics: Conference Series.
Hongbing Lu,
T. Thiringer,
Johan Liu,
2020,
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
Johan Liu,
L. Ye,
Nan Wang,
2019,
Coatings.
Mehmet Arik,
Patrick McCluskey,
Bahgat Sammakia,
2009
.
Johan Liu,
Zhou Jie-min,
Yang Ying,
2001
.
Hongbing Lu,
Johan Liu,
A. Balandin,
2019,
2D Materials.
Johan Liu,
Li-bin Liu,
C. Andersson,
2004
.
Johan Liu,
L. Ye,
Yifeng Fu,
2020,
Journal of Nanobiotechnology.
Measurement of Dielectric Properties of Ultrafine BaTiO3
Using an Organic–Inorganic Composite Method
Johan Liu,
Shengtao Li,
Weiwang Wang,
2015,
Journal of Electronic Materials.
Hongbing Lu,
Johan Liu,
Jiangwei Liu,
2020,
ACS applied materials & interfaces.
Youyuan Huang,
Johan Liu,
Qianlong Wang,
2020
.
Josef Hansson,
Lilei Ye,
Torbjorn M.J. Nilsson,
2018
.
Johan Liu,
Xiangfan Xu,
Jie Chen,
2018,
Small.
Johan Liu,
P. Enoksson,
Qi Li,
2020
.
M. Inoue,
Johan Liu,
Yan Zhang,
2011
.
Johan Liu,
Z. Cheng,
Yan Zhang,
2010
.
Zhaonian Cheng,
Dongkai Shangguan,
Xicheng Wei,
2007
.
Johan Liu,
L. Ye,
Nan Wang,
2014
.
Johan Liu,
Yong Zhang,
Si-zhen Guo,
2021,
Nanomaterials.
Johan Liu,
L. Ye,
Nan Wang,
2019,
Chemistry.
Johan Liu,
Toshikazu Yamaguchi,
Xin Luo,
2013
.
Johan Liu,
Toshikazu Yamaguchi,
Xin Luo,
2011,
2011 International Symposium on Advanced Packaging Materials (APM).
Johan Liu,
Guangjie Yuan,
Haohao Li,
2019,
Japanese Journal of Applied Physics.
Yu Cao,
Johan Liu,
C. Zandén,
2014,
Journal of Materials Science: Materials in Electronics.
Johan Liu,
P. Sun,
D. Shangguan,
2005,
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.
Masahiro Inoue,
Johan Liu,
Björn Carlberg,
2008
.
Johan Liu,
L. Arnberg,
S. Savage,
1988
.
Johan Liu,
Chang Liu,
W. Waldhauser,
2021,
ACS omega.
Johan Liu,
P. Matkowski,
J. Felba,
2013,
2013 Eurpoean Microelectronics Packaging Conference (EMPC).
Johan Liu,
Camille Philippot,
C. Zandén,
2014,
Journal of neurochemistry.
Johan Liu,
L. Ye,
Z. Lai,
2001
.
Johan Liu,
P. Tegehall,
C. Andersson,
2011
.
Johan Liu,
C. Zandén,
Xiuzhen Lu,
2015,
Biomedical materials.
Johan Liu,
H. Kuhn,
C. Zandén,
2014,
Nanomedicine : nanotechnology, biology, and medicine.
Johan Liu,
A. Sabirsh,
Xiaoqiu Wu,
2021,
ChemistryOpen.
Gang Zou,
J. P. Starski,
H. Gronqvist,
2002
.
Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader
Johan Liu,
L. Ye,
Nan Wang,
2019,
2019 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Johan Liu,
Yifeng Fu,
Mingliang L. Huang,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Josef Hansson,
Lilei Ye,
Johan Liu,
2016,
2016 IEEE 16th International Conference on Nanotechnology (IEEE-NANO).
Johan Liu,
Bin Yang,
C. Schick,
2009
.
Bart Vandevelde,
Peng Sun,
Göran Wetter,
2009
.
Johan Liu,
P. Tegehall,
D. Andersson,
2008,
IEEE Transactions on Components and Packaging Technologies.
Johan Liu,
C. Andersson,
2008
.
Johan Liu,
P. Sun,
C. Andersson,
2006,
Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06..
Yu Wang,
Johan Liu,
Michael Olorunyomi,
2007
.
Johan Liu,
Per-Erik Tegehall,
C. Andersson,
2007,
Microelectron. Reliab..
Johan Liu,
P. Tegehall,
D. Andersson,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
Johan Liu,
Xin Luo,
L. Ye,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Johan Liu,
P. Matkowski,
J. Felba,
2014,
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
Johan Liu,
Zhiliang Zhang,
H. Kristiansen,
2007
.
Johan Liu,
Olli Salmela,
Jussi Särkkä,
2011
.
Johan Liu,
R. Larsson,
Yan Zhang,
2008
.
Yan Zhang,
Itsuo Watanabe,
Johan Liu,
2008
.
Johan Liu,
L. Nyborg,
E. Hryha,
2020,
Metallurgical and Materials Transactions A.
Shiming Li,
Zonghe Lai,
Zhimin Mo,
2004
.
Johan Liu,
E. Wong,
2017,
Polymers.
Ee-Hua Wong,
Johan Liu,
Johan Liu,
2017,
Microelectron. Reliab..
Xiuzhen Lu,
Johan Liu,
Xiuzhen Lu,
2010,
2010 International Symposium on Advanced Packaging Materials: Microtech (APM).
Bo Liu,
Andreas Nylander,
Majid Kabiri Samani,
2017,
ACS applied materials & interfaces.
M. Inoue,
Johan Liu,
Sijia Jiang,
2009,
2009 59th Electronic Components and Technology Conference.
Björn Carlberg,
Johan Liu,
B. Carlberg,
2011,
Small.
Johan Liu,
L. Ye,
Nan Wang,
2018,
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
Johan Liu,
L. Ye,
Yifeng Fu,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Johan Liu,
C. Lambert,
S. Bailey,
2015,
Nature Communications.
Zonghe Lai,
Johan Liu,
Z. Lai,
2002
.
Lilei Ye,
Björn Carlberg,
Johan Liu,
2012
.
Yan Zhang,
Johan Liu,
Fei Yang,
2022,
Journal of Materials Science: Materials in Electronics.
Johan Liu,
L. Ye,
Yifeng Fu,
2017,
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Johan Liu,
P. Ciambelli,
M. Sarno,
2018,
Journal of Nanoscience and Nanotechnology.
K. Jeppson,
Johan Liu,
L. Ye,
2016,
Electronic Materials Letters.
K. Jeppson,
Johan Liu,
Yifeng Fu,
2016
.
Johan Liu,
Johan Liu,
1999
.
Johan Liu,
Yifeng Fu,
M. Murugesan,
2012
.
Milos Pekny,
Carl Zandén,
Johan Liu,
2014,
Tissue engineering. Part C, Methods.
Johan Liu,
F. Kirchhoff,
C. Zandén,
2013,
Glia.
Di Jiang,
Nan Wang,
Lilei Ye,
2015
.
Improved Heat Spreading Performance of Functionalized Graphene in Microelectronic Device Application
Sebastian Volz,
Kjell Jeppson,
Nan Wang,
2015
.
Johan Liu,
R. Larsson,
Z. Cheng,
2006,
Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06..
Johan Liu,
R. Larsson,
Yan Zhang,
2007
.
Johan Liu,
Yan Zhang,
Jing-yu Fan,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
Johan Liu,
R. Larsson,
Yan Zhang,
2006,
2006 1st Electronic Systemintegration Technology Conference.
Johan Liu,
S. Majee,
Shi-Li Zhang,
2018
.
Yan Zhang,
Johan Liu,
J. Bielecki,
2012,
Advanced materials.
Johan Liu,
Tiebing Wang,
2000
.
Johan Liu,
L. Ye,
Yifeng Fu,
2017,
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Johan Liu,
S. Tu,
Yifeng Fu,
2013,
19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
A. Ziaei,
Johan Liu,
S. Xavier,
2013
.
Johan Liu,
J. Bielecki,
Á. Kukovecz,
2012
.
Johan Liu,
Yan Zhang,
Shun Wang,
2010,
3rd Electronics System Integration Technology Conference ESTC.
Johan Liu,
H. Yin,
Longwang Tan,
2019,
2019 IEEE 19th International Conference on Nanotechnology (IEEE-NANO).
Zhaonian Cheng,
Yan Zhang,
Xiuzhen Lu,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
Andreas Nylander,
Josef Hansson,
Majid Kabiri Samani,
2019,
Energies.
K. Jeppson,
Johan Liu,
L. Ye,
2016
.
Johan Liu,
Jin Cao,
B. Wei,
2020
.
M. Yuen,
Johan Liu,
Yifeng Fu,
2013
.
Lilei Ye,
Teng Wang,
Teng Wang,
2011,
Small.
Johan Liu,
Guangjie Yuan,
Jie-Fei Xie,
2020,
Materials.
Johan Liu,
K. Svensson,
L. Ye,
2020,
Nanotechnology.
Johan Liu,
Yifeng Fu,
Shirong Huang,
2016,
2016 6th Electronic System-Integration Technology Conference (ESTC).
Johan Liu,
Shaochun Zhang,
Shirong Huang,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
Teng Wang,
Johan Liu,
2008
.
Johan Liu,
C.G.L. Khoo,
Johan Liu,
1998
.
Johan Liu,
Yan Zhang,
Zhili Hu,
2010,
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
Johan Liu,
K. Janeczek,
Yan Zhang,
2011
.
Johan Liu,
L. Ye,
Dong‐sheng Li,
2011
.
Johan Liu,
L. Ye,
Nan Wang,
2017,
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
M. Inoue,
Johan Liu,
S. Yamanaka,
2012,
2012 4th Electronic System-Integration Technology Conference.
Teng Wang,
Johan Liu,
T. Booth,
2012
.
K. Jeppson,
Johan Liu,
L. Ye,
2017
.
Johan Liu,
Nan Wang,
Qianlong Wang,
2019,
ChemistryOpen.
R. Sihlbom,
M. Dernevik,
Zonghe Lai,
1998,
1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).
Johan Liu,
Olli Salmela,
Jussi Särkkä,
2011
.
Johan Liu,
L. Arnberg,
S. Savage,
1988
.
Johan Liu,
L. Ye,
Nan Wang,
2019,
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
Johan Liu,
Zonghe Lai,
Johan Liu,
1996
.
Johan Liu,
L. Ye,
Yifeng Fu,
2021,
ACS applied materials & interfaces.
B. Tay,
Johan Liu,
Congxiang Lu,
2019,
Materials Research Express.
K. Jeppson,
Johan Liu,
Yifeng Fu,
2016,
2016 6th Electronic System-Integration Technology Conference (ESTC).
Johan Liu,
Xiuzhen Lu,
Shirong Huang,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
Johan Liu,
I. Mijakovic,
Yifeng Fu,
2016
.
Johan Liu,
M. Murugesan,
Xiuzhen Lu,
2022,
Journal of Electronic Materials.
Johan Liu,
Si Chen,
H. Cui,
2010,
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
Liqiang Cao,
Johan Liu,
Z. Lai,
2005
.
Johan Liu,
Johan Liu,
2001
.
Johan Liu,
J. Malmodin,
Z. Lai,
1999
.
Johan Liu,
Johan Liu,
1993
.
K. Jeppson,
Di Jiang,
Lilei Ye,
2012,
IEEE Electron Device Letters.
Experimental study on electrical properties and stability of CNT bumps in high density interconnects
Johan Liu,
Yifeng Fu,
Ying Zhou,
2013,
2013 13th IEEE International Conference on Nanotechnology (IEEE-NANO 2013).
Johan Liu,
L. Ye,
J. Hansson,
2017,
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Carl Zandén,
Mikael Syväjärvi,
Lilei Ye,
2014
.
Johan Liu,
L. Ye,
Dongsheng Li,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
Johan Liu,
Yifeng Fu,
Yong Zhang,
2014,
2014 15th International Conference on Electronic Packaging Technology.
Teng Wang,
Johan Liu,
Z. Cheng,
2009
.
Björn Carlberg,
Teng Wang,
Teng Wang,
2010,
Langmuir : the ACS journal of surfaces and colloids.
Johan Liu,
Xiuzhen Lu,
Qiaoran Zhang,
2018,
International Conference on Electronic Packaging Technology.
Johan Liu,
Z. Lai,
K. Gustafsson,
1997
.
Johan Liu,
Roger Rörgren,
1993
.
Johan Liu,
L. Ye,
Nan Wang,
2017,
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Johan Liu,
L. Arnberg,
S. Savage,
1988
.
P. Hyldgaard,
Johan Liu,
Yifeng Fu,
2018,
Journal of Materials Science: Materials in Electronics.
Li-Rong Zheng,
Johan Liu,
Johan Liu,
2003,
Microelectron. Reliab..
Johan Liu,
L. Ye,
Maulik Satwara,
2017,
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Johan Liu,
C. Zandén,
Xin Luo,
2013,
19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Johan Liu,
P. Sun,
D. Shangguan,
2005
.
Johan Liu,
L. Ye,
Si Chen,
2015
.
Johan Liu,
S. H. Tsang,
E. Teo,
2017,
ACS applied materials & interfaces.
Johan Liu,
Qi Wang,
S. T. Zhang,
2015
.
Yan Zhang,
Jing-yu Fan,
Johan Liu,
2005,
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.
Johan Liu,
Zhi-feng Zhang,
Yilan Kang,
2002
.
Johan Liu,
Z. Lai,
1996
.
Li Li,
Zonghe Lai,
L. Ljungkrona,
1995,
1995 Proceedings. 45th Electronic Components and Technology Conference.
Johan Liu,
A. Fazi,
L. Ye,
2020,
Nanotechnology.
M. Yuen,
Johan Liu,
Yifeng Fu,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
M. Yuen,
Johan Liu,
Yifeng Fu,
2012,
18th International Workshop on THERMal INvestigation of ICs and Systems.
Johan Liu,
Xiuzhen Lu,
Amos Nkansah,
2022,
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Johan Liu,
L. Ye,
Xitao Wang,
2018,
2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
The effects of graphene-based films as heat spreaders for thermal management in electronic packaging
K. Jeppson,
Johan Liu,
W. Ke,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
Johan Liu,
Yifeng Fu,
Nan Wang,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
Johan Liu,
S. H. Tsang,
E. Teo,
2017,
ACS applied materials & interfaces.
K. Jeppson,
Johan Liu,
Yifeng Fu,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Teng Wang,
Johan Liu,
L. Ye,
2011,
Small.
Teng Wang,
K. Jeppson,
N. Olofsson,
2009,
Nanotechnology.
Johan Liu,
S. H. Tsang,
Shuangxi Sun,
2018,
2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM).
Johan Liu,
Yifeng Fu,
Shirong Huang,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
Yan Zhang,
Johan Liu,
W. Ke,
2017,
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).
Yan Zhang,
Johan Liu,
Yong Zhang,
2022,
Advanced Engineering Materials.
Johan Liu,
Johan Liu,
1995
.
K. Jeppson,
Johan Liu,
Yifeng Fu,
2016,
Electronic Materials Letters.
Johan Liu,
L. Ye,
Si Chen,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
Gang Zou,
Johan Liu,
Anders S. G. Andrae,
2004
.
Gang Zou,
Johan Liu,
Anders S. G. Andræ,
2004
.
The Effect of Functionalized Silver on Rheological and Electrical Properties of Conductive Adhesives
Johan Liu,
L. Ye,
Dong‐sheng Li,
2011
.
Si Chen,
Zhichao Yuan,
Lilei Ye,
2011
.
Johan Liu,
Johan Liu,
Ying Fu,
2003
.
Magnus Willander,
Yifeng Fu,
Johan Liu,
2001
.
Johan Liu,
R. S. Rorgren,
Johan Liu,
1995
.