A. Teverovsky
发表
A. Teverovsky,
2004
.
A. Teverovsky,
2005
.
A. Teverovsky,
2006
.
A. Teverovsky,
2009,
IEEE Transactions on Dielectrics and Electrical Insulation.
A. Teverovsky,
2018
.
A. Teverovsky,
2017
.
A. Teverovsky,
2006,
56th Electronic Components and Technology Conference 2006.
A. Teverovsky,
2014
.
A. Teverovsky,
2014,
IEEE Transactions on Dielectrics and Electrical Insulation.
A. Teverovsky,
2005
.
A. Teverovsky,
2004,
2004 IEEE International Reliability Physics Symposium. Proceedings.
A. Teverovsky,
A. Sharma,
2001
.
A. Teverovsky,
2017
.
A. Teverovsky,
Kusum Sahu,
2013
.
A. Teverovsky,
2010
.
A. Teverovsky,
2003
.
A. Teverovsky,
A. Sharma,
2003,
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003..
A. Teverovsky,
2019
.
A. Teverovsky,
2016
.
A. Teverovsky,
2013
.
A. Teverovsky,
2013
.
A. Teverovsky,
2012,
IEEE Transactions on Dielectrics and Electrical Insulation.
A. Teverovsky,
2015
.
Alexander Teverovsky,
A. Teverovsky,
2014,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
A. Teverovsky,
2017
.
A. Teverovsky,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Alexander Teverovsky,
A. Teverovsky,
2019
.
A. Teverovsky,
Jaemi L. Herzberger,
2013
.
A. Teverovsky,
2008
.
A. Teverovsky,
Jacobs,
2020
.
A. Teverovsky,
A. Teverovsky,
2012,
IEEE Transactions on Device and Materials Reliability.
A. Teverovsky,
2011,
18th European Microelectronics & Packaging Conference.
A. Teverovsky,
2018
.
A. Teverovsky,
2000
.
A. Teverovsky,
2014
.
Alexander Teverovsky,
A. Teverovsky,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
A. Teverovsky,
2009,
IEEE Transactions on Device and Materials Reliability.
A. Teverovsky,
2008
.