B. Michel
发表
Y. Leblebici,
H. Reichl,
T. Brunschwiler,
2010,
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
B. Michel,
R. Dudek,
R. Doering,
2008
.
B. Michel,
R. Dudek,
J. Vogel,
2004
.
B. Michel,
R. Kuhnert,
M. Dost,
2002
.
B. Michel,
R. Dudek,
H. Walter,
2001,
Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).
Low-cycle Fatigue of Ag-Based Solders Dependent on Alloying Composition and Thermal Cycle Conditions
B. Michel,
R. Dudek,
W. Faust,
2007,
2007 9th Electronics Packaging Technology Conference.
H. Reichl,
B. Michel,
R. Dudek,
1997,
1997 Proceedings 47th Electronic Components and Technology Conference.
H. Reichl,
B. Michel,
R. Dudek,
2002,
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
Relevance of primary creep in thermo-mechanical cycling for life-time prediction in Sn-based solders
B. Michel,
R. Dudek,
M. Spraul,
2005,
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
B. Michel,
R. Dudek,
B. Michel,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
B. Michel,
R. Dudek,
M. Roellig,
2008,
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
Herbert Reichl,
Peter Ramm,
Bernhard Wunderle,
2006
.
Bernd Michel,
V. Großer,
W. Benecke,
2001
.
Digital image correlation of nanoscale deformation fields for local stress measurement in thin films
Carles Cané,
Bernd Michel,
Dietmar Vogel,
2006
.
B. Michel,
J. Auersperg,
N. Sabaté,
2006
.
Carles Cané,
Bernd Michel,
N. Sabaté,
2006
.
B. Michel,
R. Dudek,
W. Faust,
2005,
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
B. Michel,
B. Wunderle,
D. May,
2013,
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle,
B. Michel,
B. Michel,
2005,
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
B. Michel,
R. Dudek,
H. Walter,
2001,
First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).
B. Michel,
B. Wunderle,
I. Maus,
2013,
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Michel,
B. Wunderle,
M. Springborn,
2013,
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Michel,
B. Wunderle,
D. May,
2012,
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Michel,
R. Dudek,
J. Auersperg,
2012,
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
B. Michel,
J. Auersperg,
S. Rzepka,
2011,
2011 IEEE International Interconnect Technology Conference.
B. Michel,
B. Wunderle,
J. Keller,
2011
.
B. Michel,
B. Wunderle,
H. Walter,
2011,
2011 IEEE 13th Electronics Packaging Technology Conference.
B. Michel,
R. Dudek,
J. Auersperg,
2011,
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Michel,
J. Auersperg,
D. Vogel,
2010,
3rd Electronics System Integration Technology Conference ESTC.
Bernd Michel,
Bernhard Wunderle,
Wolfgang Nüchter,
2007,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
Norbert Meyendorf,
Bernd Michel,
George Y. Baaklini,
2005
.
B. Michel,
B. Wunderle,
H. Oppermann,
2011
.
H. Reichl,
B. Michel,
R. Dudek,
2003,
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
B. Michel,
B. Wunderle,
K. Jansen,
2017,
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
H. Reichl,
R. Schacht,
B. Wunderle,
2004,
The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).
Ajit Khosla,
Teen-Hang Meen,
Bernd Michel,
2018
.
B. Michel,
B. Wunderle,
R. Pantou,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
B. Michel,
R. Dudek,
S. Rzepka,
2013,
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
B. Michel,
J. Auersperg,
2007,
2007 9th Electronics Packaging Technology Conference.
B. Michel,
R. Dudek,
J. Auersperg,
2006
.
B. Michel,
J. Auersperg,
D. Vogel,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
B. Michel,
J. Auersperg,
A. Schubert,
2002
.
B. Michel,
O. Wittler,
A. Gollhardt,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Michel,
P. Will,
1989
.
B. Michel,
S. Rzepka,
D. Zahn,
2015
.
B. Michel,
B. Wunderle,
J. Bauer,
2006,
2006 1st Electronic Systemintegration Technology Conference.
B. Michel,
J. Auersperg,
D. Vogel,
2013
.
B. Michel,
J. Auersperg,
D. Vogel,
2013,
CP 2013.
B. Michel,
J. Auersperg,
D. Vogel,
2009,
2009 11th Electronics Packaging Technology Conference.
B. Michel,
J. Auersperg,
D. Vogel,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Michel,
S. Rzepka,
E. Auerswald,
2012
.
B. Michel,
D. Vogel,
A. Gollhardt,
2010,
3rd Electronics System Integration Technology Conference ESTC.
B. Michel,
D. Vogel,
I. Maus,
2010,
3rd Electronics System Integration Technology Conference ESTC.
B. Michel,
D. Vogel,
F. Luczak,
2008
.
B. Michel,
W. Doetzel,
2005
.
B. Michel,
W. Grellmann,
S. Seidler,
1991
.
Santi P. Maity,
Bernd Michel,
Dulal Acharjee,
2017
.
Santi P. Maity,
Bernd Michel,
B. Michel,
2017
.
Bernard Courtois,
Bernard Courtois,
Bernd Michel,
2006
.
B. Michel,
M. H. Shirangi,
B. Michel,
2010
.
J. Bauer,
B. Wunderle,
B. Michel,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
Carles Cane,
Joan Ramon Morante,
Dietmar Vogel,
2005,
SPIE Microtechnologies.
Carles Cané,
Bernd Michel,
Dietmar Vogel,
2003
.
B. Michel,
J. Keller,
2007
.
Bernd Michel,
A. Schubert,
Dietmar Vogel,
2004
.
Bernd Michel,
Rainer Dudek,
Sven Rzepka,
2013,
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle,
B. Michel,
J. Keller,
2012,
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
B. Wunderle,
B. Michel,
J. Keller,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
B. Michel,
R. Dudek,
J. Auersperg,
2010,
2010 12th Electronics Packaging Technology Conference.
B. Wunderle,
B. Michel,
H. Pape,
2010,
3rd Electronics System Integration Technology Conference ESTC.
Rainer Dudek,
B. Michel,
B. Michel,
2000
.
B. Michel,
R. Dudek,
H. Walter,
2001,
First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).
B. Michel,
R. Dudek,
J. Auersperg,
2007,
Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics.
B. Michel,
J. Auersperg,
B. Michel,
2007,
2007 8th International Conference on Electronic Packaging Technology.
H. Reichl,
B. Michel,
N. Sabate,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
Dietmar Vogel,
Astrid Gollhardt,
Neus Sabate,
2007,
SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring.
B. Michel,
R. Dudek,
J. Auersperg,
2006,
EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
B. Michel,
B. Seiler,
R. Dudek,
2005,
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
B. Michel,
A. Schubert,
E. Kieselstein,
2001,
First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).
B. Michel,
R. Dudek,
O. Wittler,
2006,
2006 8th Electronics Packaging Technology Conference.
H. Reichl,
M. Schneider-Ramelow,
K.-F. Becker,
2009
.
Herbert Reichl,
Bernd Michel,
Andreas Schubert,
2004,
Microelectron. Reliab..
Modular parametric finite element modelling for reliability-studies in electronic and mems packaging
V. Großer,
B. Wunderle,
E. Kaulfersch,
2004
.
H. Reichl,
B. Wunderle,
B. Michel,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
Modular parametric finite element modelling for reliability-studies in electronic and mems packaging
B. Michel,
B. Wunderle,
J. Auersperg,
2003,
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS.
Dietmar Vogel,
Bernd Michel,
O. Wittler,
2013
.
Olaf Wittler,
Dietmar Vogel,
Juergen Keller,
2005,
International Conference on Experimental Mechanics.
H. Reichl,
B. Michel,
J. Auersperg,
1997,
Application of Fracture Mechanics in Electronic Packaging.
B. Michel,
M. Schaper,
P. Will,
1990
.
B. Michel,
R. Dudek,
B. Michel,
1994,
Proceedings of 1994 IEEE International Reliability Physics Symposium.
H. Reichl,
R. Schacht,
B. Wunderle,
2006,
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
B. Michel,
B. Wunderle,
S. Rzepka,
2016,
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
B. Wunderle,
B. Michel,
B. Michel,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
B. Michel,
R. Dudek,
H. Walter,
2002,
2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617).
H. Reichl,
B. Michel,
A. Schubert,
1997,
Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces.
Bernd Michel,
Marcus Sonner,
Peter Sprafke,
2002,
Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS.
Bernd Michel,
A. Schubert,
Dietmar Vogel,
2001
.
B. Michel,
J. Auersperg,
B. Michel,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
B. Wunderle,
B. Michel,
E. Kaulfersch,
2008,
2008 2nd Electronics System-Integration Technology Conference.
S. Rzepka,
B. Michel,
J. Auersperg,
2015,
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Michel,
D. Vogel,
J. Auersperg,
2010,
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
Bernd Michel,
Dietmar Vogel,
Jürgen Auersperg,
2009
.
D. Vogel,
B. Michel,
J. Auersperg,
2008,
2008 10th Electronics Packaging Technology Conference.
B. Michel,
J. Auersperg,
J. Vogel,
1996
.
B. Michel,
A. Leson,
H. Fecht,
2008
.
Bernd Michel,
Dietrich R. T. Zahn,
Sven Rzepka,
2014,
Microelectron. Reliab..
H. Reichl,
P. Ramm,
B. Wunderle,
2008,
2008 58th Electronic Components and Technology Conference.
B. Wunderle,
S. Rzepka,
B. Michel,
2014,
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
J. Punch,
S. Rzepka,
B. Michel,
2015,
2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Bernd Michel,
Emad A. Poshtan,
Sven Rzepka,
2014,
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Michel,
S. Rzepka,
D. Vogel,
2011,
2011 Semiconductor Conference Dresden.
B. Michel,
G. Fischerauer,
E. Kieselstein,
1998,
IECON '98. Proceedings of the 24th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.98CH36200).
B. Wunderle,
S. Rzepka,
B. Michel,
2012,
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Michel,
S. Rzepka,
D. Breuer,
2016
.
H. Reichl,
B. Wunderle,
B. Michel,
2008,
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
Carles Cané,
Bernd Michel,
Dietmar Vogel,
2003
.
Franz Faupel,
Herbert Reichl,
Bernd Michel,
2009,
2009 59th Electronic Components and Technology Conference.
J. Bauer,
B. Wunderle,
B. Michel,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Norbert Meyendorf,
Bernd Michel,
B. Michel,
2003,
SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring.
S. Rzepka,
B. Michel,
R. Dudek,
2013,
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Joan Ramon Morante,
Dietmar Vogel,
Astrid Gollhardt,
2005,
SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring.
Dietmar Vogel,
Astrid Gollhardt,
Bernd Michel,
2006,
SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring.
B. Wunderle,
B. Michel,
O. Wittler,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Oliver Paul,
Bernd Michel,
Ulrich Wagner,
2001,
Microelectron. Reliab..
Bernd Michel,
Bernhard Wunderle,
Jörg Bauer,
2011,
Microelectron. Reliab..
Thomas Günther,
Olfa Kanoun,
Claudio Lanciotti,
2012
.
H. Reichl,
R. Schacht,
B. Wunderle,
2008,
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
S. Wiese,
R. Doring,
S. Rzepka,
2006,
2006 1st Electronic Systemintegration Technology Conference.
B. Michel,
R. Dudek,
S. Rzepka,
2012,
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
C. P. Wong,
H. Reichl,
Jianmin Qu,
2000,
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
B. Wunderle,
R. K. B. Schacht,
A. Hausdorf,
2014,
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Thomas Winkler,
Bernhard Wunderle,
Bernd Michel,
2013
.
B. Michel,
R. Pantou,
S. Rzepka,
2013,
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Michel,
B. Wunderle,
L. Ernst,
2012,
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
H. Reichl,
O. Ehrmann,
B. Wunderle,
2008,
2008 58th Electronic Components and Technology Conference.
J. Bauer,
B. Wunderle,
B. Michel,
2008,
2008 2nd Electronics System-Integration Technology Conference.
Bernd Michel,
Olaf Wittler,
Bernhard Wunderle,
2011,
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Michel,
S. Rzepka,
E. Auerswald,
2013,
2013 IEEE International Interconnect Technology Conference - IITC.
B. Michel,
S. Rzepka,
E. Auerswald,
2013,
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Michel,
T. Winkler,
L. Skurt,
1993
.
B. Michel,
J. Auersperg,
D. Vogel,
2013
.
B. Michel,
J. Auersperg,
D. Vogel,
1998,
2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225).
B. Michel,
R. Dudek,
J. Auersperg,
2000
.
U. Zerbst,
B. Michel,
P. Will,
1987
.
B. Michel,
B. Wunderle,
D. May,
2012,
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Michel,
B. Wunderle,
D. May,
2015,
2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).