B. Wunderle
发表
Y. Leblebici,
H. Reichl,
T. Brunschwiler,
2010,
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
M. Wolf,
B. Wunderle,
R. Dudek,
2018,
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
H. Rothuizen,
H. Reichl,
T. Brunschwiler,
2008
.
B. Wunderle,
D. Zahn,
T. Blaudeck,
2019,
physica status solidi (a).
Herbert Reichl,
Peter Ramm,
Bernhard Wunderle,
2006
.
B. Wunderle,
J. Bonitz,
N. Jöhrmann,
2017,
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle,
J. Bonitz,
S. Schulz,
2016,
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle,
D. May,
H. Oppermann,
2015,
2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
B. Wunderle,
D. May,
H. Oppermann,
2014,
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Michel,
B. Wunderle,
D. May,
2013,
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle,
D. May,
R. Schacht,
2013,
19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
B. Wunderle,
B. Michel,
B. Michel,
2005,
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
B. Wunderle,
J. Arnold,
M. Shaygi,
2019,
2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
B. Wunderle,
M. Dressler,
M. Schulz,
2018,
2018 7th Electronic System-Integration Technology Conference (ESTC).
T. Brunschwiler,
B. Wunderle,
G. Schlottig,
2015,
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Michel,
B. Wunderle,
I. Maus,
2013,
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Michel,
B. Wunderle,
M. Springborn,
2013,
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Michel,
B. Wunderle,
D. May,
2012,
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Michel,
B. Wunderle,
J. Keller,
2011
.
B. Michel,
B. Wunderle,
H. Walter,
2011,
2011 IEEE 13th Electronics Packaging Technology Conference.
Bernd Michel,
Bernhard Wunderle,
Wolfgang Nüchter,
2007,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
B. Wunderle,
D. May,
J. Heilmann,
2021,
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle,
D. Vu,
M. Schulz,
2018,
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle,
M. Klingler,
B. Métais,
2020,
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle,
M. Rittner,
Y. Maniar,
2019,
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle,
D. May,
U. Zschenderlein,
2016,
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Michel,
B. Wunderle,
H. Oppermann,
2011
.
B. Michel,
B. Wunderle,
K. Jansen,
2017,
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Xi Chen,
T. Brunschwiler,
B. Wunderle,
2016,
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
H. Reichl,
R. Schacht,
B. Wunderle,
2004,
The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).
B. Wunderle,
D. May,
J. Heilmann,
2015,
2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
B. Wunderle,
J. Heilmann,
J. Arnold,
2015,
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Wunderle,
P. Grant,
C. Johnston,
2013
.
B. Wunderle,
T. Blaudeck,
S. Schulz,
2014,
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle,
K. Hiller,
P. Meszmer,
2019,
physica status solidi (a).
B. Wunderle,
R. D. Rodriguez,
E. Sheremet,
2016,
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle,
G. M. Reuther,
N. Pflügler,
2018,
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle,
G. M. Reuther,
N. Pflügler,
2017,
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.
B. Michel,
B. Wunderle,
R. Pantou,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
B. Wunderle,
L. Ernst,
I. Paul,
2012,
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Wunderle,
G. Schlottig,
K. Jansen,
2011
.
B. Wunderle,
K. Jansen,
J. de Vreugd,
2009,
2009 59th Electronic Components and Technology Conference.
B. Wunderle,
G. Schlottig,
K. Jansen,
2008,
2008 International Conference on Electronic Packaging Technology & High Density Packaging.
B. Wunderle,
K. Jansen,
J. de Vreugd,
2008,
2008 58th Electronic Components and Technology Conference.
B. Wunderle,
R. Ecke,
N. Jöhrmann,
2021,
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle,
R. Ecke,
N. Jöhrmann,
2020,
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle,
U. Zschenderlein,
J. Arnold,
2019,
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle,
G. M. Reuther,
R. Pufall,
2018,
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle,
E. Kaulfersch,
B. Michell,
2008
.
P. Ramm,
B. Wunderle,
U. Zschenderlein,
2014,
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
D. N. Wright,
Astrid-Sofie B. Vardøy,
T. Brunschwiler,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
B. Michel,
B. Wunderle,
J. Bauer,
2006,
2006 1st Electronic Systemintegration Technology Conference.
O. Kanoun,
B. Wunderle,
H. Khemakhem,
2022,
SSRN Electronic Journal.
B. Wunderle,
H. Walter,
D. May,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
B. Wunderle,
G. Schlottig,
L. Ernst,
2009,
2009 11th Electronics Packaging Technology Conference.
O. Kanoun,
B. Wunderle,
N. Jöhrmann,
2022,
Sensors.
B. Wunderle,
M. Klingler,
M. Schaal,
2018,
2018 7th Electronic System-Integration Technology Conference (ESTC).
B. Wunderle,
J. Heilmann,
I. Nikitin,
2014,
20th International Workshop on Thermal Investigations of ICs and Systems.
B. Wunderle,
G. Elger,
P. Meszmer,
2021,
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Finite Element simulations and Raman measurements to investigate thermomechanical stress in GaN-LEDs
Sri Krishna Bhogaraju,
B. Wunderle,
G. Elger,
2020,
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
B. Wunderle,
D. May,
J. Heilmann,
2019,
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle,
D. May,
J. Heilmann,
2018,
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
B. Wunderle,
D. May,
J. Heilmann,
2017,
2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
B. Wunderle,
D. May,
K. A. Pareek,
2020,
2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
B. Wunderle,
D. May,
M. Krikunova,
2018,
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
B. Wunderle,
D. May,
D. Wargulski,
2017,
2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
B. Wunderle,
S. Hartmann,
O. Holck,
2012
.
M. R. Wagner,
B. Wunderle,
C. M. Torres,
2015
.
Bernhard Wunderle,
Matthias Klein,
Lothar Dietrich,
2010,
3rd Electronics System Integration Technology Conference ESTC.
J. Bauer,
B. Wunderle,
B. Michel,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
O. Hellwig,
O. Kanoun,
B. Wunderle,
2021
.
B. Wunderle,
B. Michel,
J. Keller,
2012,
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
B. Wunderle,
R. Pufall,
B. Seiler,
2012,
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Wunderle,
L. J. Ernst,
H. Pape,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
B. Wunderle,
B. Michel,
J. Keller,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
B. Wunderle,
B. Michel,
H. Pape,
2010,
3rd Electronics System Integration Technology Conference ESTC.
B. Wunderle,
L. J. Ernst,
H. Pape,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
Michael Goroll,
Reinhard Pufall,
Bernhard Wunderle,
2019,
Microelectronics Reliability.
B. Wunderle,
L. Ernst,
I. Maus,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
Daniel Coutellier,
B. Wunderle,
B. Wunderle,
2012
.
B. Wunderle,
L. J. Ernst,
H. Pape,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
B. Wunderle,
L. J. Ernst,
H. Pape,
2009,
2009 IEEE 70th Vehicular Technology Conference Fall.
Bernhard Wunderle,
Heinz Pape,
Leo J. Ernst,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Wunderle,
H. Pape,
B. Wunderle,
2008,
2008 10th Electronics Packaging Technology Conference.
Bernhard Wunderle,
Peter Meszmer,
Przemyslaw Jakub Gromala,
2021
.
Bernhard Wunderle,
Mehryar Majd,
Peter Meszmer,
2020,
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
A. Zimmermann,
B. Wunderle,
P. Gromala,
2023,
Microelectronics Reliability.
M. Leicht,
B. Wunderle,
J. Heilmann,
2022,
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
M. Leicht,
B. Wunderle,
J. Heilmann,
2022,
International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.
M. Leicht,
B. Wunderle,
J. Heilmann,
2021,
International Workshop on Thermal Investigations of ICs and Systems.
M. Leicht,
B. Wunderle,
J. Heilmann,
2021,
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
H. Reichl,
M. Schneider-Ramelow,
K.-F. Becker,
2009
.
B. Wunderle,
D. May,
H. Oppermann,
2014,
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Herbert Reichl,
Bernd Michel,
Andreas Schubert,
2004,
Microelectron. Reliab..
Modular parametric finite element modelling for reliability-studies in electronic and mems packaging
V. Großer,
B. Wunderle,
E. Kaulfersch,
2004
.
H. Reichl,
B. Wunderle,
B. Michel,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
Modular parametric finite element modelling for reliability-studies in electronic and mems packaging
B. Michel,
B. Wunderle,
J. Auersperg,
2003,
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS.
H. Reichl,
R. Aschenbrenner,
T. Braun,
2006,
2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.
Bernhard Wunderle,
B. Wunderle,
2003
.
D. N. Wright,
T. Brunschwiler,
B. Wunderle,
2018,
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
B. Michel,
B. Wunderle,
S. Rzepka,
2016,
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
B. Wunderle,
B. Michel,
B. Michel,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
P. Ramm,
B. Wunderle,
E. Auerswald,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Astrid-Sofie B. Vardøy,
V. Simons,
B. Wunderle,
2013
.
Thomas Brunschwiler,
Sven Rzepka,
Bernhard Wunderle,
2016,
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Sri Krishna Bhogaraju,
B. Wunderle,
G. Elger,
2020
.
Bernhard Wunderle,
Sascha Hermann,
Peter Meszmer,
2019,
physica status solidi (a).
Klaus Pressel,
Bernhard Wunderle,
Jens Heilmann,
2017,
Microelectron. Reliab..
B. Wunderle,
D. Zahn,
A. H. Hight Walker,
2019,
physica status solidi (a).
B. Wunderle,
B. Michel,
E. Kaulfersch,
2008,
2008 2nd Electronics System-Integration Technology Conference.
H. Reichl,
P. Ramm,
B. Wunderle,
2008,
2008 58th Electronic Components and Technology Conference.
B. Wunderle,
S. Rzepka,
B. Michel,
2014,
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle,
T. Blaudeck,
H. Sturm,
2016,
Journal of Materials Science.
B. Wunderle,
T. Blaudeck,
S. Schulz,
2014
.
B. Wunderle,
S. Hartmann,
O. Holck,
2014
.
B. Wunderle,
S. Hartmann,
O. Holck,
2013,
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Gordon Elger,
E. Liu,
Bernhard Wunderle,
2016,
2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Emad A. Poshtan,
Sven Rzepka,
Christian Silber,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Emad A. Poshtan,
Sven Rzepka,
Christian Silber,
2015,
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Bernd Michel,
Emad A. Poshtan,
Sven Rzepka,
2014,
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle,
O. Schmidt,
S. Moradi,
2021,
Advanced Engineering Materials.
Niessner Martin Richard,
B. Wunderle,
Y. S. Chan,
2022,
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
A. Ziaei,
B. Wunderle,
D. May,
2020,
2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
B. Wunderle,
J. Bonitz,
S. Schulz,
2016
.
B. Wunderle,
J. Bonitz,
T. Blaudeck,
2015,
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Wunderle,
S. Rzepka,
B. Michel,
2012,
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Wunderle,
D. May,
D. Wargulski,
2019,
2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Thomas Brunschwiler,
Bernhard Wunderle,
Kerry Yu,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
H. Reichl,
B. Wunderle,
B. Michel,
2008,
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
A. Ziaei,
B. Wunderle,
D. May,
2022,
2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
B. Wunderle,
D. May,
D. Wargulski,
2020,
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
A. Ziaei,
B. Wunderle,
D. May,
2018,
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
B. Wunderle,
D. May,
D. Wargulski,
2020
.
B. Wunderle,
D. May,
R. Schacht,
2021,
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle,
D. May,
R. Schacht,
2020,
2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Bernhard Wunderle,
Daniel May,
Majid Kabiri Samani,
2017,
2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
B. Wunderle,
D. May,
M. A. Ras,
2023,
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Wunderle,
D. May,
J. Heilmann,
2022,
Microelectronics Reliability.
B. Wunderle,
D. May,
A. Cardoso,
2015,
2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Franz Faupel,
Herbert Reichl,
Bernd Michel,
2009,
2009 59th Electronic Components and Technology Conference.
J. Bauer,
B. Wunderle,
B. Michel,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Bernhard Wunderle,
B. Wunderle,
Ole Hölck,
2012
.
B. Wunderle,
D. May,
M. A. Ras,
2015,
2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
B. Wunderle,
D. May,
K. A. Pareek,
2022,
International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.
B. Wunderle,
D. May,
M. A. Ras,
2022,
International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.
B. Wunderle,
S. Rzepka,
C. Silber,
2018,
2018 7th Electronic System-Integration Technology Conference (ESTC).
Dietrich R. T. Zahn,
Bernhard Wunderle,
Peter Meszmer,
2017,
Microelectron. Reliab..
B. Wunderle,
B. Michel,
O. Wittler,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Bernd Michel,
Bernhard Wunderle,
Jörg Bauer,
2011,
Microelectron. Reliab..
H. Reichl,
R. Schacht,
B. Wunderle,
2008,
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
B. Wunderle,
R. K. B. Schacht,
A. Hausdorf,
2014,
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Thomas Winkler,
Bernhard Wunderle,
Bernd Michel,
2013
.
B. Wunderle,
R. Mitova,
T. Caroff,
2013,
19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
B. Michel,
B. Wunderle,
L. Ernst,
2012,
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Wunderle,
J. Heilmann,
R. Kniely,
2023,
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
H. Reichl,
O. Ehrmann,
B. Wunderle,
2008,
2008 58th Electronic Components and Technology Conference.
B. Wunderle,
C. Wagner,
S. Hartmann,
2012,
International Multi-Conference on Systems, Sygnals & Devices.
J. Bauer,
B. Wunderle,
B. Michel,
2008,
2008 2nd Electronics System-Integration Technology Conference.
B. Wunderle,
O. Hölck,
2015
.
Bernd Michel,
Olaf Wittler,
Bernhard Wunderle,
2011,
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
H. Reichl,
K.-F. Becker,
B. Wunderle,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
B. Wunderle,
D. May,
M. A. Ras,
2022,
2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
B. Wunderle,
M. Prunnila,
P. Chapuis,
2018,
Sensors and Actuators A: Physical.
Peter Ramm,
Bernhard Wunderle,
M. Jürgen Wolf,
2008
.
B. Wunderle,
M. Stiebing,
D. Vogel,
2015,
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Michel,
B. Wunderle,
D. May,
2012,
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Michel,
B. Wunderle,
D. May,
2015,
2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
H. Reichl,
K.-F. Becker,
B. Wunderle,
2010,
3rd Electronics System Integration Technology Conference ESTC.