Mike Ma

Capability evaluation and validation of FC chip scale package structure

Eason Chen, Kenet Liu, Daniel Lee, 2011, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Development of thermal compression bonding with Non Conductive Paste for 3DIC fine pitch copper pillar bump interconnections

Mike Ma, Steve Chiu, Mu-Hsuan Chan, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.

The Development and Technological Comparison of Various Die Stacking and Integration Options with TSV Si Interposer

Mike Ma, Stephen Chen, Terrence Lu, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

High-speed electrical design study for 3D-IC packaging technology

Robert Sung, Kevin Chiang, Daniel Lee, 2011, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Efficient Improvement on Device Performance for sub-90nm CMOSFETs

Chia-Wei Hsu, Wen-Kuan Yeh, Yean-Kuen Fang, 2006 .