M. Cracraft
发表
Jun Fan,
Tamar Makharashvili,
Siqi Bai,
2016,
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).
Antonio Orlandi,
Victor V. Khilkevich,
Bruce Archambeault,
2016,
IEEE Transactions on Electromagnetic Compatibility.
M. H. Nisanci,
M. Cracraft,
S. Connor,
2015,
IEEE Transactions on Electromagnetic Compatibility.
M. Cracraft,
S. Connor,
B. Archambeault,
2015,
IEEE Transactions on Electromagnetic Compatibility.
M. Cracraft,
S. Connor,
A. Orlandi,
2015,
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC).
J. Drewniak,
A. Ruehli,
Biyao Zhao,
2018,
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI).
M. Cracraft,
2007
.
Minimally Invasive 3D Printed Fixtures for Multi Gb/s Channel Characterization with a Logic Analyzer
M. Cocchini,
K. McMillan,
W. D. Becker,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
David Pommerenke,
James L. Drewniak,
Liangqi Gui,
2015,
IEEE Transactions on Electromagnetic Compatibility.
Michael Andrew Cracraft,
M. Cracraft,
2007
.
Jun Fan,
Siqi Bai,
Bruce Archambeault,
2016,
2016 IEEE/ACES International Conference on Wireless Information Technology and Systems (ICWITS) and Applied Computational Electromagnetics (ACES).
Jun Fan,
Bruce Archambeault,
Michael Cracraft,
2015,
2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity.
B. Archambeault,
A. Orlandi,
F. de Paulis,
2015,
IEEE Transactions on Electromagnetic Compatibility.