J. Chun

R. Braatz, J. Chun, B. Trout, 2018, European journal of pharmaceutics and biopharmaceutics : official journal of Arbeitsgemeinschaft fur Pharmazeutische Verfahrenstechnik e.V.

Optical Measurement of Preform Impregnation in Resin Transfer Molding

J. Chun, T. Nowak, 1993 .

Hot-embossing performance of silicon micromold coated with self-assembled n-octadecyltrichlorosilane

D. Hardt, S. Tor, J. Chun, 2011 .

Feasibility Study of Rapid Prototyping Using the Uniform Droplet Spray Process

J. Chun, 2005 .

Demonstration of pharmaceutical tablet coating process by injection molding technology.

R. Braatz, J. Chun, B. Trout, 2018, International journal of pharmaceutics.

Anti-sticking behavior of DLC-coated silicon micro-molds

D. Hardt, S. Tor, J. Chun, 2009 .

Development of Maltodextrin-Based Immediate-Release Tablets Using an Integrated Twin-Screw Hot-Melt Extrusion and Injection-Molding Continuous Manufacturing Process.

J. Chun, B. Trout, A. Myerson, 2017, Journal of pharmaceutical sciences.

Material with Novel Compositions and Fine Microstructljres Produced Via the Mixalloy Process

Nam P. Suh, N. Suh, J. Chun, 1988 .

Titanium–aluminum–polytetrafluoroethylene coated stainless steel micromold via co-sputtering deposition: Replication performance and limitation in hot-embossing

D. Hardt, S. Tor, J. Chun, 2012 .

Modification of surface properties of silicon micro-molds by nitrogen and silicon doped diamond-like carbon coatings deposited with magnetron co-sputtering

D. Hardt, J. Chun, E. Liu, 2011 .

Evolution of Copper-Oxide Damascene Structures in Chemical Mechanical Polishing II. Copper Dishing and Oxide Erosion

J. Chun, N. Saka, J. Lai, 2002 .

Evolution of Copper-Oxide Damascene Structures in Chemical Mechanical Polishing I. Contact Mechanics Modeling

Nannaji Saka, J. Chun, N. Saka, 2002 .

Mechanics, mechanisms, and modeling of the chemical mechanical polishing process

Nannaji Saka, J. Chun, N. Saka, 2001 .

Controlling Scratching in Cu Chemical Mechanical Planarization

J. Chun, N. Saka, S. Armini, 2009 .

Production and characterization of mono-sized SN-PB alloy balls

T. Ando, J. Chun, V. Sikka, 1996 .

The recoiling of liquid droplets upon collision with solid surfaces

J. Chun, Ho-Young Kim, Ho-Young Kim, 2001 .

Integrated hot-melt extrusion - injection molding continuous tablet manufacturing platform: Effects of critical process parameters and formulation attributes on product robustness and dimensional stability.

J. Chun, B. Trout, A. Myerson, 2017, International journal of pharmaceutics.

Digitalization of automotive industry – scenarios for future manufacturing

Steven Peters, Gisela Lanza, Jung-Hoon Chun, 2016 .

Breaking Out of Carbon Lock-In: Malaysia’s Path to Decarbonization

J. Chun, L. Susskind, Jessica A. Gordon, 2020, Frontiers in Genetics.

Effect of sputtering power on friction coefficient and surface energy of co-sputtered titanium and molybdenum disulfide coatings and its performance in micro hot-embossing

D. Hardt, M. Dirckx, S. Tor, 2013 .

A Non-Invasive Solidification Sensor for Metal Casting

N. Suh, R. Lanza, J. Chun, 1999 .

Replication performance of Si-N-DLC-coated Si micro-molds in micro-hot-embossing

David E. Hardt, S. B. Tor, Erjia Liu, 2010 .

A solidification front monitor for metal casting

R. Lanza, J. Chun, M. Hytros, 1998 .

Nano-scale scratching in chemical–mechanical polishing

T. Eusner, Nannaji Saka, J. Chun, 2008 .

Design of High-Ionic Conductivity Electrodes for Direct Methanol Fuel Cells

Jung-Hoon Chun, A. J. Schrauth, Anthony J. Schrauth, 2011 .

Determining the Root Causes of Excess Metal and Void Defects With Respect to the Photoresist Quality in Thin Film PZT Fabrication Processes

J. Chun, Jun Bum Lee, Bum Lee, 2013 .

The role of values in shaping sustainable development perspectives and outcomes: A case study of Iceland

J. Chun, Janelle Knox‐Hayes, S. Chandra, 2020 .

Contamination of silicon surface due to contact with solid polymers

J. Chun, N. Saka, N. Iyer, 2001 .

The Effects of Wetting and Surface Roughness on Liquid Metal Droplet Bouncing

J. Chun, N. Saka, W. Hsiao, 2009 .

Root Cause Analysis of Solder Flux Residue Incidence in the Manufacture of Electronic Power Modules

J. Chun, 2012 .

Scratching of Patterned Cu/Dielectric Surface Layers by Pad Asperities in CMP

Nannaji Saka, Sanha Kim, J. Chun, 2015, IEEE Transactions on Semiconductor Manufacturing.

Effect of Slurry Selectivity on Dielectric Erosion and Copper Dishing in Copper Chemical-Mechanical Polishing

J. Chun, N. Saka, K. Noh, 2004 .

Microsensor for impact of molten metal microdrops

J. Chun, T. Qiu, Ho-Young Kim, 2004 .

Instability of a liquid jet emerging from a droplet upon collision with a solid surface

Z. C. Feng, J. Chun, Ho-Young Kim, 2000 .

Effects of droplet thermal state on deposit microstructure in spray forming

J. Chun, T. Ando, P. Acquaviva, 1996 .

Spray deposition of a Sn-40 Wt Pct Pb alloy with uniform droplets

Christian H. Passow, J. Chun, C. Passow, 1993 .

The Role of Pad Topography in Chemical-Mechanical Polishing

J. Chun, N. Saka, Sanha Kim, 2014, IEEE Transactions on Semiconductor Manufacturing.

Modeling and mitigation of pad scratching in chemical–mechanical polishing

Nannaji Saka, Sanha Kim, J. Chun, 2013 .

Effect of flow obstructions on the flow pattern transitions in horizontal two-phase flow

D. C. Groeneveld, J. Chun, D. Groeneveld, 1983 .

Environmental Sustainability and Finance

J. Chun, Janelle Knox‐Hayes, P. deSouza, 2020, The Routledge Handbook of Financial Geography.

Spreading and solidification of a molten microdrop in the solder jet bumping process

J. Chun, Ho-Young Kim, Y. Yang, 2003 .